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M74HC4511RM13TR

STMicroelectronics

M74HC4511RM13TR by STMicroelectronics

M74HC4511RM13TR by STMicroelectronics is a CMOS Decoder & Drivers with 16 terminals, latched input conditioning, and 385 ns propagation delay. It operates b/w -55 to 125 °C and has a supply voltage range of 2-6 V. Ideal for military-grade applications requiring true output polarity in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,614 parts In-Stock

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ComSIT Distribution GmbH

Germany . 3,247 parts In-Stock

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Anansix

USA . 1,528 parts In-Stock

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1,528

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J2 Sourcing AB

Sweden . 1,465 parts In-Stock

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Digiode

USA . 1,116 parts In-Stock

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Distributors (Availability)

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Microchip USA

USA . 417 parts In-Stock

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$6.311

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$6.311

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AZTECH Wire

Italy . 683 parts In-Stock

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$15.640

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683

$15.640

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IDEA Electronic Components Group

UK . 1,650 parts In-Stock

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$25.592

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$23.032

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$25.592

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$23.032

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MKK Technologies

India . 815 parts In-Stock

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$48.123

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815

$48.123

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DigiPath Technology Company

USA . 815 parts In-Stock

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$48.123

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815

$48.123

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A-Z Elektronik GmbH

Germany . 5,070 parts In-Stock

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Corphita

USA . 4,482 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,380 parts In-Stock

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Parana Technologies

USA . 1,323 parts In-Stock

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$30.599

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$30.599

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Overview

Discover the ultimate solution for your decoding and driver needs with the M74HC4511RM13TR by STMicroelectronics. Crafted with precision and expertise, this product is designed to deliver top-notch performance in a compact package. From industrial automation to consumer electronics, this decoder & driver offers unparalleled reliability and efficiency. With STMicroelectronics' reputation for excellence, you can trust that this product will meet your expectations every time. Upgrade your projects with the M74HC4511RM13TR and experience the quality and value that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection to the internal components of the decoder and drivers, making it a reliable choice for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and secure installation of the decoder and drivers onto circuit boards, saving space and simplifying the overall assembly process.

Input Conditioning: LATCHED

The latched input conditioning ensures stable and consistent operation of the decoder and drivers, reducing the possibility of errors or data loss during signal processing.

Nominal Supply Voltage / Vsup (V): 4.5

The nominal supply voltage of 4.5V provides a stable power source for the decoder and drivers, ensuring reliable performance within the specified operating range.

Load Capacitance (CL): 50 pF

With a load capacitance of 50pF, the decoder and drivers can effectively drive connected loads while maintaining signal integrity and minimizing power consumption.

Propagation Delay (tpd): 385 ns

The low propagation delay of 385ns ensures fast and efficient signal processing by the decoder and drivers, making it suitable for applications requiring quick response times.

Technology: CMOS

The CMOS technology used in the decoder and drivers offers low power consumption and high noise immunity, making it an energy-efficient and reliable choice for various electronic systems.

Technical Specifications

Decoder & Drivers M74HC4511RM13TR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Additional Features:

BLANKING INPUT; LAMP TEST INPUT; LED DISPLAY DRIVER

Family:

HC/UH

Input Conditioning:

LATCHED

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/6

Propagation Delay (tpd):

385 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

M74HC4511RM13TR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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