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M74HC138RM13TR

STMicroelectronics

M74HC138RM13TR by STMicroelectronics

STMicroelectronics M74HC138RM13TR is a CMOS decoder with 38ns propagation delay, 4A max I (ol), and -55 to 125 °C operating temp. Ideal for military applications due to its small outline package and inverted output polarity.

Median Price

$0.950

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

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Mobius Materials

USA . 6,569 parts In-Stock

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$0.950

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$0.760

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Vyrian

USA . 6,619 parts In-Stock

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MISTER SPROCKETS

USA . 3,322 parts In-Stock

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3,322

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ComSIT Distribution GmbH

Germany . 2,296 parts In-Stock

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Digiode

USA . 2,086 parts In-Stock

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PC Components Company LLC

USA . 1,320 parts In-Stock

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Bristol Electronics

USA . 1,320 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 760 parts In-Stock

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760

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Anansix

USA . 465 parts In-Stock

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465

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Elcom Components

USA . 382 parts In-Stock

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Greenchips

USA . 221 parts In-Stock

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SIE Connect GmbH - GreenChips

Germany . 221 parts In-Stock

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Speed Components Ltd

Israel . 19 parts In-Stock

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LWI Electronics Inc

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Distributors (Availability)

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Microchip USA

USA . 398 parts In-Stock

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$11.931

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AZTECH Wire

Italy . 803 parts In-Stock

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$19.360

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803

$19.360

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IDEA Electronic Components Group

UK . 1,489 parts In-Stock

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MKK Technologies

India . 1,557 parts In-Stock

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$37.730

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DigiPath Technology Company

USA . 1,557 parts In-Stock

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$37.730

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Perfect Parts

USA . 46,413 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Kepictronics

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Corphita

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Cyclops Electronics Ltd (Excess)

UK . 3,073 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,250 parts In-Stock

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ChipstoGo Electronic ltd

UK . 1,573 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,500 parts In-Stock

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Parana Technologies

USA . 1,299 parts In-Stock

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$23.990

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$23.990

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Overview

Experience unparalleled performance and reliability with the M74HC138RM13TR by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch Decoder & Drivers like this one, designed to meet the highest standards in quality and efficiency. This versatile product is perfect for a wide range of applications, offering customers unmatched value and benefits. Trust in STMicroelectronics to provide you with cutting-edge solutions that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, making it suitable for various applications.

Propagation Delay At Nominal Supply: 38 ns

Low propagation delay ensures fast response times in signal processing, making the product efficient for decoding and driving tasks.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and facilitating automated assembly processes.

Nominal Supply Voltage / Vsup (V): 4.5

Operating at a nominal supply voltage of 4.5V offers a balance between energy efficiency and performance for the product.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows the product to be used in harsh environmental conditions without compromising performance or reliability.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making the product suitable for battery-powered devices and noise-sensitive applications.

Technical Specifications

Decoder & Drivers M74HC138RM13TR attributes and parameters. Explore more Decoder & Drivers devices from STMicroelectronics

Specs

Additional Features:

3 ENABLE INPUTS

Family:

HC/UH

Input Conditioning:

STANDARD

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e4

Length:

9.9 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/6

Propagation Delay At Nominal Supply:

38 ns

Propagation Delay (tpd):

190 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Decoder/Drivers

Maximum Supply Voltage (Vsup):

6 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

4.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Trade Compliance

M74HC138RM13TR Logic ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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