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M710LB1

STMicroelectronics

M710LB1 by STMicroelectronics

M710LB1 by STMicroelectronics is a CMOS transmitter IC designed for infrared remote control applications. It operates b/w 2.2V and 5V, features a rectangular plastic/epoxy package with 28 terminals, and withstands temperatures from 0 °C to 70°C. Ideal for consumer electronics, it ensures reliable performance in various devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,697 parts In-Stock

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Anansix

USA . 2,432 parts In-Stock

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Digiode

USA . 455 parts In-Stock

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455

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ECAB

Sweden . 103 parts In-Stock

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ComSIT Distribution GmbH

Germany . 26 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 11 parts In-Stock

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IDEA Electronic Components Group

UK . 197 parts In-Stock

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$0.313

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$0.282

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197

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$0.282

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MKK Technologies

India . 1,784 parts In-Stock

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$0.588

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DigiPath Technology Company

USA . 1,784 parts In-Stock

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$0.588

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Corphita

USA . 4,471 parts In-Stock

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Parana Technologies

USA . 341 parts In-Stock

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$0.374

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Perfect Parts

USA . 244 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 109 parts In-Stock

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Assy Fe

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Overview

Elevate your remote control designs with the M710LB1 from STMicroelectronics, a trusted leader in innovation. This reliable infrared transmitter IC offers exceptional performance in various applications, ensuring seamless communication and user-friendly experiences. With its robust build and commercial-grade temperature resilience, the M710LB1 not only enhances product quality but also reduces development time, delivering unmatched value to your projects. Experience the advantages that come from choosing a market leader!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material ensures durability and resistance to environmental conditions, making it suitable for various applications.

Transmission Media: INFRARED

Using infrared transmission media allows for reliable and interference-free communication, ideal for remote control applications.

Package Shape: RECTANGULAR

The rectangular package shape provides efficient use of space on PCBs, facilitating easier integration into designs.

General IC Type: TRANSMITTER IC

As a transmitter IC, it is specifically designed for sending signals, making it perfect for remote control systems.

Power Supplies (V): 2/5.5

Supports a wide range of supply voltages, offering flexibility in design and compatibility with various power sources.

No. of Terminals: 28

The 28 terminals provide ample connectivity options for various functionalities, enhancing design versatility.

Package Style (Meter): IN-LINE

An in-line package style simplifies routing on the PCB, making assembly easier and more efficient.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this IC is suitable for a wide range of environments.

Minimum Operating Temperature: 0 °C

A minimum operating temperature of 0 °C ensures reliable performance in cooler conditions.

Terminal Finish: TIN LEAD

The tin lead finish provides excellent solderability, ensuring strong connections during assembly.

Terminal Position: DUAL

Dual terminal position allows for efficient layout on the PCB, facilitating more compact designs.

Width: 15.24 mm

The compact width is ideal for space-constrained applications, enabling a more efficient design footprint.

Minimum Supply Voltage (Vsup): 2.2 V

This low minimum supply voltage enhances usability in battery-powered devices, extending battery life.

Temperature Grade: COMMERCIAL

Rated for commercial use, this IC is designed to operate reliably in typical conditions encountered in consumer products.

Technology: CMOS

CMOS technology ensures low power consumption and high performance, making it efficient for remote control applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances mechanical strength and provides robust solder connections.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch is standard for many PCB designs, making it easier to integrate into existing layouts.

Maximum Supply Voltage (Vsup): 5 V

A maximum supply voltage of 5V ensures compatibility with most standard digital circuits, simplifying integration.

Technical Specifications

Remote Control ICs M710LB1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

2/5.5

Qualification:

Not Qualified

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

15.24 mm

Trade Compliance

M710LB1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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