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M708LB1

STMicroelectronics

M708LB1 by STMicroelectronics

M708LB1 by STMicroelectronics is a transmitter IC for remote controls. It operates on 5V power supply with 20 terminals in an in-line package style. With infrared transmission media, it has a temperature range of 0-70 °C and dimensions of 25.5mm x 7.62mm x 5.08mm, suitable for commercial applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Cyclops Electronics Ltd

UK . 1,698 parts In-Stock

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1,698

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Vyrian

USA . 1,583 parts In-Stock

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1,583

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Anansix

USA . 1,079 parts In-Stock

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1,079

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Digiode

USA . 825 parts In-Stock

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825

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ECAB

Sweden . 540 parts In-Stock

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540

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GES GmbH

Germany . 10 parts In-Stock

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10

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Fibra_Brandt Electronic GMBH

Germany . 2 parts In-Stock

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Goldney Electronics S.L.

Spain . 1 parts In-Stock

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1

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Distributors (Availability)

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Ampacity Inc.

Singapore . 248 parts In-Stock

1+ parts

$2.800

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248

$2.800

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IDEA Electronic Components Group

UK . 2,167 parts In-Stock

1+ parts

$2.933

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$2.640

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2,167

$2.933

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$2.640

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MKK Technologies

India . 1,394 parts In-Stock

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$5.515

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1,394

$5.515

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DigiPath Technology Company

USA . 1,394 parts In-Stock

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$5.515

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1,394

$5.515

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Parana Technologies

USA . 1,999 parts In-Stock

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$3.507

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$3.507

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Perfect Parts

USA . 1,947 parts In-Stock

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Corphita

USA . 1,619 parts In-Stock

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Assy Fe

Spain . 48 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 32 parts In-Stock

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Overview

Enhance your remote control devices with the reliable and innovative M708LB1 from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality Remote Control ICs that are versatile and efficient. The M708LB1 is designed to provide seamless transmission through its Infrared technology, offering customers a user-friendly experience. With a wide range of applications, this transmitter IC ensures optimal performance and durability. Upgrade your remote control systems today with the value and benefits that only STMicroelectronics can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and lightweight design, making it suitable for handheld remote controls.

Transmission Media: INFRARED

Infrared transmission allows for reliable and energy-efficient communication with the remote device, ensuring seamless operation.

Package Shape: RECTANGULAR

Rectangular package shape provides a compact and space-saving design, fitting easily into remote control devices.

General IC Type: TRANSMITTER IC

Having a transmitter IC type ensures efficient communication with the receiving end, making it ideal for remote control applications.

Power Supplies (V): 5

Operating at 5 volts provides sufficient power for reliable and consistent performance of the remote control IC.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options, enabling various functions to be controlled by the remote.

Package Style (Meter): IN-LINE

The in-line package style offers easy integration and installation within the remote control device, ensuring a streamlined and organized design.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, this remote control IC can withstand higher temperature environments, ensuring reliable performance.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0 °C allows for usability in a wide range of environments and conditions.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and conductivity, ensuring secure connections and stable performance.

Terminal Position: DUAL

Dual terminal position allows for flexibility in installation and connection, accommodating different configurations in the remote control device.

Maximum Seated Height: 5.08 mm

With a maximum seated height of 5.08 mm, this remote control IC can be integrated into slim and compact remote control devices.

Width: 7.62 mm

The 7.62 mm width offers a compact form factor, making it suitable for handheld remote control devices.

Minimum Supply Voltage (Vsup): 2.2 V

Operating at a minimum supply voltage of 2.2V ensures efficient power usage and extends battery life in the remote control device.

Length: 25.5 mm

The length of 25.5 mm provides a balance between compact design and functionality, making it suitable for various remote control applications.

Temperature Grade: COMMERCIAL

Being rated for commercial temperature grades ensures reliable performance in typical operating conditions, making it suitable for consumer electronics.

Technology: CMOS

Utilizing CMOS technology offers low power consumption and high noise immunity, optimizing the performance of the remote control IC.

Terminal Form: THROUGH-HOLE

Through-hole terminal form provides secure connections and ease of soldering, ensuring stable operation in the remote control device.

Terminal Pitch: 2.54 mm

The 2.54 mm terminal pitch allows for easy connection and compatibility with standard PCB layouts, simplifying integration into remote control devices.

Maximum Supply Voltage (Vsup): 5 V

Operating at a maximum supply voltage of 5V ensures compatibility with a wide range of power sources and systems, making it versatile for different applications.

Technical Specifications

Remote Control ICs M708LB1 attributes and parameters. Explore more Remote Control ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e0

Length:

25.5 mm

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP20,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Sub-Category:

Remote Control ICs

Maximum Supply Voltage (Vsup):

5 V

Minimum Supply Voltage (Vsup):

2.2 V

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Transmission Media:

INFRARED

Width:

7.62 mm

Trade Compliance

M708LB1 General Purpose ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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