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M34F04-WMN6TP

STMicroelectronics

M34F04-WMN6TP by STMicroelectronics

M34F04-WMN6TP from STMicroelectronics is a 512x8 EEPROM with a synchronous operating mode, ideal for industrial applications. It operates at 2.7-5.5V and supports I2C communication, ensuring efficient data storage and retrieval. With a max temp of 85 °C and endurance of 1M cycles, it's reliable for demanding environments.

Median Price

$0.242

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Avnet

USA . 12,500 parts In-Stock

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Arrow

USA . 2,500 parts In-Stock

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$0.243

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Verical

USA . 2,500 parts In-Stock

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Future Electronics

Canada . 2,500 parts In-Stock

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$0.139

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EBV Elektronik

Germany . 2,500 parts In-Stock

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Vyrian

USA . 7,392 parts In-Stock

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Digiode

USA . 3,081 parts In-Stock

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Anansix

USA . 2,643 parts In-Stock

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IBS Electronics

USA . 2,500 parts In-Stock

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$0.181

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IDEA Electronic Components Group

UK . 647 parts In-Stock

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$2.139

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$1.925

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647

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MKK Technologies

India . 857 parts In-Stock

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$4.022

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DigiPath Technology Company

USA . 857 parts In-Stock

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AZTECH Wire

Italy . 196 parts In-Stock

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Perfect Parts

USA . 16,800 parts In-Stock

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Kepictronics

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Microchip USA

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Parana Technologies

USA . 2,246 parts In-Stock

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Corphita

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Glotronic Ltd.

UK . 2,000 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Overview

Unlock the potential of your designs with the M34F04-WMN6TP EEPROM from STMicroelectronics, a trusted leader in innovation. This compact and robust memory solution delivers exceptional reliability, operating seamlessly in industrial environments. Enjoy the benefits of fast data access, low power consumption, and impressive endurance while ensuring critical data retention. Elevate your projects with a component that combines quality and performance, making it ideal for applications in automotive, consumer electronics, and more!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures good protection against environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for efficient use of PCB space and simplifies the assembly process.

Package Shape: RECTANGULAR

The rectangular shape optimizes layout on PCB, ensuring easy integration into designs.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances performance by reducing data transfer latency, resulting in faster read/write cycles.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at 3.3 V is standard in modern electronics, making it compatible with a wide range of devices.

Power Supplies (V): 2.7/5

The wide voltage range allows for flexible use in different applications, accommodating both low and standard voltage systems.

No. of Terminals: 8

Having 8 terminals provides ample connectivity for various circuit configurations in embedded systems.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for a compact footprint, making it ideal for space-constrained applications.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this component is designed for industrial environments.

Organization: 512X8

The 512x8 organization offers ample memory structure for small to medium data storage needs.

Minimum Operating Temperature: -40 °C

The ability to operate in extreme cold conditions makes it suitable for outdoor or harsh environment applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances conductivity and reduces contact resistance, contributing to better reliability.

I2C Control Byte: 1010DDMR

The use of I2C ensures easy interfacing with microcontrollers while allowing multiple devices on the same bus.

Terminal Position: DUAL

Dual terminal positions provide versatility in circuit design and layout options for PCB manufacturers.

Write Protection: HARDWARE

Hardware write protection enhances data integrity and security, making it ideal for applications requiring critical data retention.

Maximum Seated Height: 1.75 mm

The slim profile aids in achieving compact design goals, which is crucial for today's miniaturized electronics.

Maximum Clock Frequency (fCLK): 0.4 MHz

A clock frequency of 0.4 MHz allows for easy timing control in synchronous applications, balancing performance with simplicity.

Width: 3.9 mm

At just 3.9 mm wide, the component suits tight layout requirements for advanced circuits.

Minimum Supply Voltage (Vsup): 2.5 V

The minimum voltage requirement of 2.5 V allows for operation in low-power scenarios, important for battery-operated applications.

Maximum Time At Peak Reflow Temperature (s): 30

The reflow time specification ensures compatibility with standard soldering processes, enhancing manufacturing efficiency.

Peak Reflow Temperature °C: 260

High peak reflow temperature resilience implies robustness in assembly processes, critical for reliable production.

Length: 4.9 mm

The compact length is suitable for dense circuit board designs, making it a versatile choice for various applications.

Temperature Grade: INDUSTRIAL

Industrial temperature grading guarantees reliability in harsh conditions, appealing to demanding applications.

Technology: CMOS

CMOS technology ensures low power consumption, high speed, and efficient performance, making it suitable for modern circuits.

Parallel or Serial: SERIAL

Serial communication minimizes pin count on microcontroller interfaces, facilitating easier circuit design.

Terminal Form: GULL WING

The gull wing terminal form provides a strong mechanical connection and simplifies soldering procedures.

Maximum Supply Current: 1 mA

Low supply current signifies power efficiency, ideal for battery-saving applications.

No. of Words: 512 words

512 words of storage capacity offers sufficient data retention for simple applications, balancing size and functionality.

Memory Width: 8

An 8-bit memory width allows for compact data representation, enabling more efficient storage.

Minimum Data Retention Time: 40

A minimum data retention time of 40 years assures long-term reliability, important for critical applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch is compatible with many standard PCBs, facilitating easier integration.

No. of Words Code: 512

Offering 512 words of code further enables efficient data management and access.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of handling a maximum supply voltage of 5.5 V expands its usability across various power supply scenarios.

Endurance: 1,000,000 Write/Erase Cycles

With an endurance of 1 million cycles, this EEPROM is perfect for applications requiring frequent updates.

Serial Bus Type: I2C

The I2C serial bus type simplifies connections and allows for multiple devices on a single bus, enhancing system design flexibility.

Maximum Write Cycle Time (tWC): 5 ms

At 5 ms per write cycle, this EEPROM strikes a balance between performance and efficiency.

Memory Density: 4096 bit

4096 bits of memory density ensures that it can accommodate various data storage needs without requiring additional components.

Memory IC Type: EEPROM

Utilizing EEPROM technology allows for non-volatile memory storage, ensuring data retention even without power.

Maximum Standby Current: 0.0000005 Amp

The extremely low standby current indicates minimal energy consumption, making it ideal for energy-efficient designs.

Technical Specifications

EEPROM M34F04-WMN6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2.7/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.0000005 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M34F04-WMN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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