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M34D64-WMN6TP

STMicroelectronics

M34D64-WMN6TP by STMicroelectronics

M34D64-WMN6TP by STMicroelectronics is a 64Kb EEPROM with a synchronous operating mode and I2C interface. It features an industrial temperature range (-40 °C to 85°C), 1M write/erase cycles, and operates at supply voltages from 2.5V to 5.5V, ideal for reliable data storage in various applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

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Chip Stock

USA . 17,500 parts In-Stock

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Vyrian

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Digiode

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Anansix

USA . 1,472 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 134 parts In-Stock

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Bristol Electronics

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Atlantic Semiconductor

USA . 41 parts In-Stock

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PC Components Company LLC

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Prism Electronics

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Microchip USA

USA . 210 parts In-Stock

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$4.336

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IDEA Electronic Components Group

UK . 2,124 parts In-Stock

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$5.312

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$4.781

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MKK Technologies

India . 90 parts In-Stock

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$9.989

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DigiPath Technology Company

USA . 90 parts In-Stock

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$9.989

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AZTECH Wire

Italy . 909 parts In-Stock

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$21.500

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Component Stockers USA

USA . 451 parts In-Stock

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Authorized Procurement Solutions

USA . 8,500 parts In-Stock

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Corphita

USA . 4,397 parts In-Stock

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A-Z Elektronik GmbH

Germany . 1,761 parts In-Stock

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Parana Technologies

USA . 1,645 parts In-Stock

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Assy Fe

Spain . 1,317 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,174 parts In-Stock

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S.R.D Solutions

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Perfect Parts

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Overview

Unlock the power of reliable data storage with the M34D64-WMN6TP EEPROM from STMicroelectronics. Renowned for their innovation and quality, STMicroelectronics brings you a compact, high-performance memory solution ideal for industrial applications. With robust endurance, low power consumption, and exceptional temperature resilience, this EEPROM ensures your critical data is safe and accessible when needed most. Elevate your designs with the trusted performance and versatility that only STMicroelectronics can offer!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy material ensures a lightweight and robust design, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs, enabling higher circuit density and improved performance.

Package Shape: RECTANGULAR

The rectangular shape offers standardized fitting for most electronic assemblies, aiding in compatibility and ease of use.

Operating Mode: SYNCHRONOUS

Synchronous operation provides efficient data transfer, enhancing the speed and reliability of communication with the microcontroller.

Nominal Supply Voltage / Vsup: 5V

The nominal supply voltage of 5V makes this EEPROM compatible with many common systems, ensuring broad usability.

Power Supplies: 3/5V

Versatile voltage supply options (3V and 5V) enhance its adaptability for different applications.

No. of Terminals: 8

With 8 terminals, it provides a simple connection scheme, making it easier to interface with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package saves board space and allows for more compact designs.

Maximum Operating Temperature: 85 °C

Rated for high-temperature operation, this EEPROM is suitable for demanding environments.

Organization: 8KX8

The 8Kx8 organization offers a solid balance between capacity and ease of data management, making it effective for many applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, it is suitable for industrial and outdoor applications.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish provides excellent conductivity and resistance to corrosion, ensuring longevity and reliability.

Terminal Position: DUAL

Having dual terminal positions facilitates easier integration into circuit designs.

Write Protection: HARDWARE

Hardware write protection helps prevent accidental data loss, adding reliability for critical applications.

Maximum Seated Height: 1.75 mm

A low seated height allows for design flexibility in applications with space constraints.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz ensures efficient data transfer rates for standard applications.

Width: 3.9 mm

The compact width makes it ideal for densely packed electronic systems.

Minimum Supply Voltage (Vsup): 2.5V

The minimum supply voltage of 2.5V allows for operation in low-power applications.

Length: 4.9 mm

The small length contributes to overall space savings in circuit designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grade ensures reliability in harsh operating conditions, suitable for industrial applications.

Technology: CMOS

CMOS technology offers low power consumption and fast switching times, making it efficient for battery-powered devices.

Parallel or Serial: SERIAL

Serial communication simplifies wiring and reduces the number of pins required, facilitating easier integration.

Terminal Form: GULL WING

Gull wing terminals enhance the soldering process, providing better mechanical stability on PCBs.

Maximum Supply Current: 1 mA

A low maximum supply current allows for energy-efficient operation, ideal for battery-operated devices.

No. of Words: 8192 words

With 8192 words of storage, it offers ample capacity for small to medium data storage needs.

Memory Width: 8

An 8-bit memory width enables straightforward data processing, making it versatile for many applications.

Minimum Data Retention Time: 40 years

A long data retention time ensures data integrity over extended periods, essential for critical applications.

Terminal Pitch: 1.27 mm

The standard terminal pitch simplifies PCB layout design and improves compatibility with other components.

No. of Words Code: 8K

The 8K word code aligns well with typical data requirements for various applications, offering a good balance of storage and accessibility.

Maximum Supply Voltage (Vsup): 5.5V

A maximum voltage of 5.5V provides headroom for stable operation even in fluctuating power environments.

Endurance: 1,000,000 Write/Erase Cycles

High endurance ensures suitability for applications that require frequent data updates, improving longevity.

Serial Bus Type: I2C

Compatibility with the I2C serial bus makes it easy to interface with a wide range of devices, enhancing design flexibility.

Maximum Write Cycle Time (tWC): 5 ms

A quick write cycle time of 5 ms makes it effective for applications requiring rapid data updates.

Memory Density: 65536 bit

High memory density enables storage of substantial amounts of data in a compact form factor.

Memory IC Type: EEPROM

The EEPROM type allows for non-volatile storage, ensuring data is retained even when powered off.

Maximum Standby Current: 0.000002 Amp

Extremely low standby current enhances energy efficiency, making it ideal for low-power applications.

Technical Specifications

EEPROM M34D64-WMN6TP attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000002 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

1 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M34D64-WMN6TP Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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