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M24M01-RMW6TG

STMicroelectronics

M24M01-RMW6TG by STMicroelectronics

M24M01-RMW6TG by STMicroelectronics is a 256Kx8 EEPROM with a supply voltage range of 1.8V to 5.5V, ideal for industrial applications. It features synchronous operation and hardware write protection, ensuring data integrity. With an endurance of 1M write/erase cycles, it's perfect for reliable data storage in various devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,844 parts In-Stock

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4,844

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Vyrian

USA . 2,877 parts In-Stock

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2,877

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Anansix

USA . 1,579 parts In-Stock

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1,579

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Distributors (Availability)

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Benley Electronics

USA . 4 parts In-Stock

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$2.000

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4

$2.000

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IDEA Electronic Components Group

UK . 1,724 parts In-Stock

1+ parts

$2.197

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-

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$1.977

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1,724

$2.197

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$1.977

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MKK Technologies

India . 18 parts In-Stock

1+ parts

$4.131

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18

$4.131

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DigiPath Technology Company

USA . 18 parts In-Stock

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$4.131

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18

$4.131

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Microchip USA

USA . 311 parts In-Stock

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$5.138

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311

$5.138

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AZTECH Wire

Italy . 972 parts In-Stock

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$18.090

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972

$18.090

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Perfect Parts

USA . 12,700 parts In-Stock

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12,700

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Corphita

USA . 3,816 parts In-Stock

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A-Z Elektronik GmbH

Germany . 3,738 parts In-Stock

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3,738

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Parana Technologies

USA . 2,316 parts In-Stock

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$2.627

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2,316

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$2.627

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Overview

Unlock limitless possibilities with the M24M01-RMW6TG EEPROM from STMicroelectronics. Renowned for their commitment to excellence, ST offers a robust solution that thrives in diverse applications—from industrial automation to consumer electronics. With superior reliability, exceptional data retention, and efficient power consumption, this compact memory chip empowers your designs while ensuring longevity and performance. Elevate your projects with ST's trusted technology!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and resistance to environmental factors, enhancing longevity.

Surface Mount: YES

Surface mount technology allows for compact design and is ideal for high-density applications, making it versatile.

Package Shape: RECTANGULAR

Rectangular packages facilitate efficient space utilization on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures faster data transfer rates, improving overall system performance.

Nominal Supply Voltage / Vsup (V): 2.5

A nominal supply voltage of 2.5V optimizes power consumption while maintaining performance.

Power Supplies (V): 2/5

Supports a range of supply voltages, enhancing compatibility with various applications.

No. of Terminals: 8

The 8-terminal configuration is suitable for compact designs, making it easy to implement in various circuits.

Package Style (Meter): SMALL OUTLINE

Small outline packages are efficient for space-constrained designs, making it ideal for portable devices.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this EEPROM is suitable for industrial applications requiring high reliability.

Organization: 256KX8

This organization provides a balanced capacity for various data storage needs, suitable for many applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this EEPROM ideal for harsh environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish improves solderability and enhances overall reliability during assembly.

Terminal Position: DUAL

Dual terminal positions assist in easier installation and layout design.

Write Protection: HARDWARE

Hardware write protection enhances data integrity and security, making it suitable for critical applications.

Maximum Seated Height: 2.5 mm

A low seated height is beneficial for applications with strict height constraints.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz ensures adequate speed for many applications while being energy efficient.

Minimum Supply Voltage (Vsup): 1.8 V

Supports a lower operating voltage, which can lead to reduced power consumption and improved battery life in portable devices.

Maximum Time At Peak Reflow Temperature (s): 30

Higher tolerance for reflow soldering processes ensures reliable assembly without damage to the components.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C accommodates various surface mount soldering processes.

Temperature Grade: INDUSTRIAL

Designed for industrial applications, it ensures reliability in extreme conditions.

Technology: CMOS

CMOS technology offers low power consumption and high efficiency, making it suitable for battery-operated devices.

Parallel or Serial: SERIAL

Serial communication simplifies connectivity and reduces pin count, beneficial for compact designs.

Terminal Form: GULL WING

Gull wing terminals are known for reliable solder joints and ease of handling during assembly.

Maximum Supply Current: 5 mA

Low maximum supply current ensures energy efficiency, making it suitable for low-power applications.

No. of Words: 262144 words

A capacity of 262,144 words allows for substantial data storage, suitable for various applications.

Memory Width: 8

An 8-bit memory width supports standard data formats, making it versatile for different use cases.

Minimum Data Retention Time: 40

A minimum data retention time of 40 years provides confidence in long-term data storage reliability.

Terminal Pitch: 1.27 mm

A 1.27 mm terminal pitch is standard for many PCB layouts, enhancing design compatibility.

No. of Words Code: 256K

The coding of 256K words allows for considerable data storage, making it a strong choice for many applications.

Maximum Supply Voltage (Vsup): 5.5 V

The component can handle supply voltages up to 5.5V, adding flexibility for different circuit designs.

Endurance: 1000000 Write/Erase Cycles

A high endurance of 1,000,000 write/erase cycles ensures durability for frequent writing applications.

Serial Bus Type: I2C

I2C bus type simplifies connections and reduces the number of required pins, ideal for compact systems.

Maximum Write Cycle Time (tWC): 5 ms

Fast write cycle times enhance overall performance and responsiveness in applications requiring quick data updates.

Memory Density: 2097152 bit

The high memory density allows for storing large amounts of data, making the product suitable for data-intensive applications.

Memory IC Type: EEPROM

Being an EEPROM type allows for non-volatile storage, retaining data even when power is lost, suitable for critical data storage.

Maximum Standby Current: 0.000001 Amp

Extremely low standby current enhances the product's suitability for low-power and battery-operated devices.

Technical Specifications

EEPROM M24M01-RMW6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

5 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24M01-RMW6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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