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M24C64M-FCU6T/TF

STMicroelectronics

M24C64M-FCU6T/TF by STMicroelectronics

M24C64M-FCU6T/TF by STMicroelectronics is a 64Kb EEPROM with I2C serial bus, operating b/w 1.7V and 5.5V. It features a max clock frequency of 1 MHz and operates in temperatures from -40 °C to 85 °C. Ideal for industrial applications requiring reliable data storage.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,084 parts In-Stock

1+ parts

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4,084

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Digiode

USA . 3,444 parts In-Stock

1+ parts

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1k+ parts

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3,444

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Anansix

USA . 2,802 parts In-Stock

1+ parts

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2,802

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,630 parts In-Stock

1+ parts

$4.989

100+ parts

-

1k+ parts

$4.490

10k+ parts

-

1,630

$4.989

-

$4.490

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AZTECH Wire

Italy . 475 parts In-Stock

1+ parts

$8.860

100+ parts

-

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475

$8.860

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MKK Technologies

India . 1,885 parts In-Stock

1+ parts

$9.382

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1,885

$9.382

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DigiPath Technology Company

USA . 1,885 parts In-Stock

1+ parts

$9.382

100+ parts

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1,885

$9.382

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Parana Technologies

USA . 1,802 parts In-Stock

1+ parts

-

100+ parts

$5.965

1k+ parts

-

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1,802

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$5.965

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Corphita

USA . 747 parts In-Stock

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747

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Overview

Unlock the power of reliable memory with the M24C64M-FCU6T/TF EEPROM from STMicroelectronics. With its robust design and exceptional temperature range, this versatile solution is ideal for industrial applications that demand both efficiency and durability. Enjoy seamless integration thanks to its compact form factor and I2C interface, ensuring you get high performance without compromising on space. Elevate your projects with ST's trusted quality and innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material ensures durability and reliability in various environmental conditions, making it suitable for industrial applications.

Surface Mount: YES

Surface mount capability allows for compact design and easy integration into modern electronic assemblies, enhancing space efficiency.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCB layouts, enabling higher density designs.

Operating Mode: SYNCHRONOUS

Synchronous operation improves performance by allowing faster data communication between devices.

Nominal Supply Voltage / Vsup (V): 2.5

With a nominal supply voltage of 2.5V, this EEPROM ensures low power consumption, ideal for battery-operated devices.

No. of Terminals: 4

The minimal number of terminals simplifies the PCB design and reduces the likelihood of soldering errors.

Package Style (Meter): GRID ARRAY, VERY THIN PROFILE, FINE PITCH

This package style is advantageous for applications requiring a low-profile solution with efficient space utilization.

Maximum Operating Temperature: 85 °C

Operating up to 85 °C ensures reliability in high-temperature environments, making it suitable for industrial uses.

Organization: 8KX8

The 8Kx8 memory organization allows for efficient storage and retrieval of data, suitable for many applications.

Minimum Operating Temperature: -40 °C

The ability to operate at -40 °C makes this EEPROM reliable in extreme cold conditions, suitable for outdoor applications.

Terminal Position: BOTTOM

Bottom terminal positioning facilitates easier mounting on PCBs, improving assembly line efficiency.

Maximum Seated Height: 0.345 mm

A low seated height allows for thinner device profiles, enhancing design flexibility in compact devices.

Maximum Clock Frequency (fCLK): 1 MHz

A clock frequency of 1 MHz enables fast data transfer rates, improving the overall performance of the system.

Width: 0.674 mm

A slim width assists in achieving compact designs, making it suitable for space-constrained applications.

Minimum Supply Voltage (Vsup): 1.7 V

The low minimum supply voltage expands the range of compatible applications, particularly in low-power designs.

Length: 0.795 mm

A concise length contributes to overall compactness, facilitating integration into tight spaces on PCBs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading ensures robustness and reliability under challenging operational conditions.

Technology: CMOS

CMOS technology offers low power consumption and high integration density, making it ideal for EEPROM applications.

Parallel or Serial: SERIAL

Serial communication is advantageous for reducing pin count and complexity in design while maintaining high performance.

Terminal Form: BALL

Ball terminals provide better electrical performance and thermal dissipation, which is crucial for ensuring reliability.

No. of Words: 8192 words

With 8192 words of memory, it effectively supports a variety of data storage applications.

Memory Width: 8

An 8-bit memory width balances performance with efficiency, catering to standard data processing requirements.

Terminal Pitch: 0.4 mm

A 0.4 mm terminal pitch allows for higher densities in circuit design, enabling miniature device layouts.

No. of Words Code: 8K

The 8K word-code signifies adequate memory capacity for many applications while keeping costs manageable.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V ensures compatibility with a wide range of systems while allowing for voltage variations.

Serial Bus Type: I2C

I2C serial bus type supports simple two-wire connections, facilitating easy integration and control in various devices.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms allows for efficient data writing, suitable for real-time applications.

Memory Density: 65536 bit

With a memory density of 65536 bits, this EEPROM provides ample storage for data-heavy applications.

Memory IC Type: EEPROM

As an EEPROM, it offers non-volatile storage capabilities, retaining data even when power is lost.

Technical Specifications

EEPROM M24C64M-FCU6T/TF attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

1 MHz

JESD-30 Code:

R-PBGA-B4

Length:

.795 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

4

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

GRID ARRAY, VERY THIN PROFILE, FINE PITCH

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

.345 mm

Serial Bus Type:

I2C

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.7 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

BALL

Terminal Pitch:

.4 mm

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

.674 mm

Maximum Write Cycle Time (tWC):

5 ms

Trade Compliance

M24C64M-FCU6T/TF Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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