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M24C64-RMB6TG

STMicroelectronics

M24C64-RMB6TG by STMicroelectronics

M24C64-RMB6TG by STMicroelectronics is a compact EEPROM with 8Kx8 organization, operating b/w 1.8V and 5.5V. It features a max clock frequency of 400kHz and offers hardware write protection for reliable data storage. Ideal for industrial applications requiring robust memory solutions.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,418 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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6,418

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-

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Digiode

USA . 4,370 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,370

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Anansix

USA . 510 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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510

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,785 parts In-Stock

1+ parts

$3.188

100+ parts

-

1k+ parts

$2.869

10k+ parts

-

1,785

$3.188

-

$2.869

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MKK Technologies

India . 914 parts In-Stock

1+ parts

$5.994

100+ parts

-

1k+ parts

-

10k+ parts

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914

$5.994

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DigiPath Technology Company

USA . 914 parts In-Stock

1+ parts

$5.994

100+ parts

-

1k+ parts

-

10k+ parts

-

914

$5.994

-

-

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AZTECH Wire

Italy . 306 parts In-Stock

1+ parts

$8.130

100+ parts

-

1k+ parts

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10k+ parts

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306

$8.130

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Microchip USA

USA . 276 parts In-Stock

1+ parts

$115.634

100+ parts

-

1k+ parts

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10k+ parts

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276

$115.634

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Corphita

USA . 2,754 parts In-Stock

1+ parts

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100+ parts

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2,754

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Parana Technologies

USA . 1,720 parts In-Stock

1+ parts

-

100+ parts

$3.812

1k+ parts

-

10k+ parts

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1,720

-

$3.812

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Overview

Unlock the potential of your designs with the M24C64-RMB6TG EEPROM from STMicroelectronics, a leader in innovative semiconductor solutions. This high-performance memory offers unmatched reliability and efficiency, operating seamlessly across diverse applications—from consumer electronics to industrial automation. With robust data retention and low power consumption, you benefit from enhanced longevity and reduced energy costs. Trust STMicroelectronics for exceptional quality and performance that drives your projects forward!

Feature Benefit Bullets

Surface Mount: YES

The surface mount configuration allows for a compact design, making it suitable for modern electronic devices with limited space.

Package Shape: RECTANGULAR

The rectangular package shape is standard and allows for easy integration into various circuit layouts.

Operating Mode: SYNCHRONOUS

Synchronous operation ensures efficient data transfer rates, enhancing performance for applications requiring fast memory access.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5 V balances performance and energy efficiency, making this EEPROM suitable for battery-powered devices.

Power Supplies (V): 2/5 V

The flexibility of power supply options from 2 to 5 V allows for compatibility with a variety of systems, enhancing versatility.

No. of Terminals: 8

With 8 terminals, this EEPROM can facilitate streamlined connections, resulting in simpler PCB designs.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The small outline and very thin profile make it ideal for portable and compact devices where saving space is critical.

Maximum Operating Temperature: 85 °C

An operational range up to 85 °C makes this EEPROM suitable for industrial applications, ensuring reliability in diverse environments.

Organization: 8KX8

Having an organization of 8Kx8 provides substantial memory capacity for data storage, making it versatile for various applications.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this EEPROM is reliable in extremely cold environments, suitable for outdoor and industrial uses.

I2C Control Byte: 1010DDDR

Utilizing an I2C control byte allows for easy communication in multi-device configurations, promoting effective data management.

Terminal Position: DUAL

Dual terminal positioning ensures better mounting options and enhanced circuit layout flexibility.

Write Protection: HARDWARE

The hardware write protection feature provides robust data integrity, safeguarding critical information from accidental modifications.

Maximum Seated Height: 0.6 mm

A low maximum seated height ensures compatibility with space-constrained designs, allowing versatility in mounting on circuit boards.

Maximum Clock Frequency (fCLK): 0.4 MHz

A maximum clock frequency of 0.4 MHz is adequate for most standard applications, balancing speed and power consumption effectively.

Width: 2 mm

The 2 mm width supports compact product design, making it suitable for mobile and portable applications.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum supply voltage of 1.8 V enhances compatibility with low-power devices, promoting energy-efficient designs.

Length: 3 mm

The small length contributes to a low-profile footprint, ideal for integration into tight spaces within devices.

Temperature Grade: INDUSTRIAL

Being rated for industrial temperature grades ensures durability and consistent performance in harsh and fluctuating temperatures.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high speed and density, ensuring efficient memory use.

Parallel or Serial: SERIAL

Serial communication reduces pin count and simplifies circuit design, vital for space-constrained applications.

Terminal Form: NO LEAD

A no-lead terminal form contributes to a smaller footprint, facilitating better design flexibility in compact applications.

Maximum Supply Current: 3 mA

With a maximum supply current of 3 mA, this EEPROM is energy-efficient, supporting low-power device requirements.

No. of Words: 8192 words

Offering 8192 words of storage, this EEPROM provides ample memory for a wide range of applications, from consumer electronics to industrial systems.

Memory Width: 8

An 8-bit memory width allows for efficient data handling, making it compatible with common microcontroller architectures.

Minimum Data Retention Time: 40 years

A minimum data retention time of 40 years ensures that stored data remains intact over long periods, enhancing reliability.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm provides compatibility with high-density PCB designs, enhancing manufacturing options.

No. of Words Code: 8K

With an 8K word code, this EEPROM supports a wide range of data storage needs, making it versatile for various applications.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V allows flexibility in system design, accommodating a variety of voltage levels.

Endurance: 1000000 Write/Erase Cycles

An endurance of 1,000,000 write/erase cycles means this EEPROM is suitable for applications needing frequent data updates.

Serial Bus Type: I2C

The I2C serial bus type simplifies connections in multi-device systems, allowing for easy scaling and integration.

Maximum Write Cycle Time (tWC): 5 ms

A fast write cycle time of 5 ms contributes to quick data updates, making it suitable for time-sensitive applications.

Memory Density: 65536 bit

With a memory density of 65536 bits, this EEPROM provides efficient data storage capabilities for diverse usage.

Memory IC Type: EEPROM

As an EEPROM, this memory IC offers non-volatile data storage capabilities, ensuring data persistence even after power loss.

Maximum Standby Current: 0.000001 Amp

A very low maximum standby current minimizes power consumption during inactive periods, making it ideal for energy-efficient applications.

Technical Specifications

EEPROM M24C64-RMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-XDSO-N8

Length:

3 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

3 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C64-RMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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