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M24C08-WBN6P

STMicroelectronics

M24C08-WBN6P by STMicroelectronics

M24C08-WBN6P by STMicroelectronics is an EEPROM with 1KX8 organization, 8192 bit memory density, and 1000000 write/erase cycles endurance. It operates in synchronous mode at a max clock frequency of 0.4 MHz and has a serial I2C bus type. This industrial-grade memory IC is commonly used for hardware write protection applications.

Median Price

$0.473

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 69 parts In-Stock

1+ parts

$0.167

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-

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69

$0.167

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American Microsemiconductor Inc.

USA . 407 parts In-Stock

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$0.780

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407

$0.780

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Vyrian

USA . 5,577 parts In-Stock

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5,577

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Bristol Electronics

USA . 2,950 parts In-Stock

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2,950

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Avant Electronics Limited

UK . 1,366 parts In-Stock

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1,366

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J2 Sourcing AB

Sweden . 1,048 parts In-Stock

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1,048

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Digiode

USA . 566 parts In-Stock

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566

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Anansix

USA . 559 parts In-Stock

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559

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ACDS - Activité Composants Distribution Service

France . 350 parts In-Stock

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350

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Prism Electronics

USA . 74 parts In-Stock

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74

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Pegasus Components GmbH

Germany . 53 parts In-Stock

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53

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LIBRA Elektronik GmbH

Germany . 33 parts In-Stock

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ComSIT Distribution GmbH

Germany . 16 parts In-Stock

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,778 parts In-Stock

1+ parts

$0.167

100+ parts

-

1k+ parts

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$0.164

5,778

$0.167

-

-

$0.164

Argo Parts USA

USA . 177 parts In-Stock

1+ parts

$0.167

100+ parts

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$0.162

177

$0.167

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-

$0.162

Corohmni

South Africa . 241 parts In-Stock

1+ parts

$0.167

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241

$0.167

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Microchip USA

USA . 457 parts In-Stock

1+ parts

$1.406

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457

$1.406

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IDEA Electronic Components Group

UK . 48 parts In-Stock

1+ parts

$4.683

100+ parts

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$4.215

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48

$4.683

-

$4.215

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Andel Nordic

Denmark . 712 parts In-Stock

1+ parts

$4.908

100+ parts

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1k+ parts

$4.711

10k+ parts

$4.711

712

$4.908

-

$4.711

$4.711

Aztec Data Supply Inc.

USA . 583 parts In-Stock

1+ parts

$5.530

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583

$5.530

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MKK Technologies

India . 1,563 parts In-Stock

1+ parts

$8.806

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1,563

$8.806

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DigiPath Technology Company

USA . 1,563 parts In-Stock

1+ parts

$8.806

100+ parts

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1,563

$8.806

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AZTECH Wire

Italy . 540 parts In-Stock

1+ parts

$12.114

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540

$12.114

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Semicontronic

India . 1,067 parts In-Stock

1+ parts

$13.000

100+ parts

$12.675

1k+ parts

$12.610

10k+ parts

-

1,067

$13.000

$12.675

$12.610

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Ampacity Inc.

Singapore . 1,039 parts In-Stock

1+ parts

$23.000

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1,039

$23.000

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GreenTree Electronics

Israel . 50,000 parts In-Stock

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Kepictronics

USA . 33,000 parts In-Stock

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Infinite Electronics LLP (Excess)

. 30,006 parts In-Stock

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30,006

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Lixinc

USA . 10,143 parts In-Stock

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10,143

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A-Z Elektronik GmbH

Germany . 7,148 parts In-Stock

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7,148

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Perfect Parts

USA . 6,486 parts In-Stock

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6,486

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Authorized Procurement Solutions

USA . 5,520 parts In-Stock

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5,520

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Alle Elektronik GmbH

Germany . 4,765 parts In-Stock

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4,765

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Corphita

USA . 3,158 parts In-Stock

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3,158

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Assy Fe

Spain . 1,333 parts In-Stock

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1,333

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Parana Technologies

USA . 619 parts In-Stock

1+ parts

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$5.599

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619

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$5.599

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Robosynatics

Brazil . 500 parts In-Stock

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500

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Lucentia Tech

USA . 500 parts In-Stock

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500

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Cyclops Electronics Ltd (Excess)

UK . 10 parts In-Stock

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10

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Overview

Unlock endless possibilities with the M24C08-WBN6P by STMicroelectronics. Crafted with precision and reliability, this EEPROM device offers seamless integration in various applications. From industrial automation to consumer electronics, this product guarantees top-notch performance and durability. With a high endurance level of 1,000,000 write/erase cycles, along with a wide operating temperature range, the M24C08-WBN6P is the perfect solution for your memory storage needs. Trust STMicroelectronics to deliver quality products that exceed expectations. Elevate your projects today with the M24C08-WBN6P.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material provides durability and protection for the EEPROM, making it a reliable choice for long-term use.

Package Shape: RECTANGULAR

The rectangular shape allows for easy integration into various electronic devices, making it versatile and convenient to use.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures efficient and synchronized data transfer, enhancing the performance of the EEPROM.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures compatibility with a wide range of systems, making it a versatile choice for different applications.

Power Supplies (V): 3/5

The support for both 3V and 5V power supplies allows for flexibility in powering the EEPROM, making it suitable for various systems.

No. of Terminals: 8

The 8 terminals provide sufficient connectivity options, allowing for easy integration and connection within a circuit.

Package Style (Meter): IN-LINE

The in-line package style offers a compact design, saving space and ensuring easy installation in tight spaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature of 85°C, the EEPROM can withstand harsh environmental conditions, making it a durable choice.

Organization: 1KX8

The organization of 1KX8 allows for efficient data storage and retrieval, optimizing the performance of the EEPROM.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures reliable operation even in extreme cold conditions, making it suitable for a wide range of environments.

Technical Specifications

EEPROM M24C08-WBN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DMMR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C08-WBN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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