Loading...

M24C08-RMB6TG

STMicroelectronics

M24C08-RMB6TG by STMicroelectronics

M24C08-RMB6TG from STMicroelectronics is a compact EEPROM with a 1Kx8 organization, operating b/w 1.8V and 5.5V. It features I2C interface for synchronous communication and offers up to 1M write/erase cycles, ideal for industrial applications. With a max temp of 85 °C, it ensures reliability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

8,800

-

-

-

-

Anansix

USA . 1,913 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,913

-

-

-

-

Digiode

USA . 1,810 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,810

-

-

-

-

LIBRA Elektronik GmbH

Germany . 1,057 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,057

-

-

-

-

J2 Sourcing AB

Sweden . 239 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

239

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,233 parts In-Stock

1+ parts

$5.012

100+ parts

-

1k+ parts

$4.511

10k+ parts

-

1,233

$5.012

-

$4.511

-

Microchip USA

USA . 348 parts In-Stock

1+ parts

$7.610

100+ parts

-

1k+ parts

-

10k+ parts

-

348

$7.610

-

-

-

MKK Technologies

India . 525 parts In-Stock

1+ parts

$9.425

100+ parts

-

1k+ parts

-

10k+ parts

-

525

$9.425

-

-

-

DigiPath Technology Company

USA . 525 parts In-Stock

1+ parts

$9.425

100+ parts

-

1k+ parts

-

10k+ parts

-

525

$9.425

-

-

-

AZTECH Wire

Italy . 620 parts In-Stock

1+ parts

$12.640

100+ parts

-

1k+ parts

-

10k+ parts

-

620

$12.640

-

-

-

Kepictronics

USA . 45,540 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

45,540

-

-

-

-

Authorized Procurement Solutions

USA . 25,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

25,000

-

-

-

-

A-Z Elektronik GmbH

Germany . 6,525 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,525

-

-

-

-

Alle Elektronik GmbH

Germany . 4,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,350

-

-

-

-

Corphita

USA . 1,352 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,352

-

-

-

-

Perfect Parts

USA . 900 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

900

-

-

-

-

Parana Technologies

USA . 584 parts In-Stock

1+ parts

-

100+ parts

$5.993

1k+ parts

-

10k+ parts

-

584

-

$5.993

-

-

Overview

Unlock the potential of your designs with the M24C08-RMB6TG EEPROM from STMicroelectronics, a trusted leader in innovation and quality. Engineered for reliability across diverse applications—from consumer electronics to industrial automation—this compact memory solution ensures robust data retention and swift performance. With its low power consumption and excellent endurance, elevate your projects while enjoying the peace of mind that comes from ST's superior manufacturing standards. Experience efficiency redefined!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and protection against environmental factors, making it suitable for industrial applications.

Surface Mount: YES

Surface mount technology allows for compact PCB designs, saving space and improving performance in electronic circuits.

Package Shape: RECTANGULAR

The rectangular shape is standard, promoting ease of integration with various PCB layouts and components.

Operating Mode: SYNCHRONOUS

Synchronous operation enhances data transfer speeds and efficiency, making it ideal for modern applications requiring fast memory access.

Nominal Supply Voltage / Vsup: 2.5 V

A nominal supply voltage of 2.5 V reduces overall power consumption, contributing to energy-efficient designs.

Power Supplies (V): 2/5

Compatibility with dual voltage power supplies (2V to 5V) offers flexibility for integration into a wide range of devices.

No. of Terminals: 8

Having 8 terminals allows for easy connection to microcontrollers and other peripherals, simplifying design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

The thin profile and small outline design allow for high-density mounting in applications with limited space.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures reliability in high-heat environments typical in industrial settings.

Organization: 1KX8

A memory organization of 1Kx8 bits allows for efficient data access patterns, optimizing performance in data-intensive applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables functionality in extreme cold environments, enhancing versatility.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold finish ensures reliable electrical connections and durability against corrosion.

I2C Control Byte: 1010DMMR

I2C compatibility facilitates easy integration with a variety of devices, simplifying design and assembly.

Terminal Position: DUAL

Dual terminal positions support a wider range of PCB layouts and designs, promoting flexibility.

Write Protection: HARDWARE

Hardware write protection enhances data integrity and security, preventing accidental data corruption.

Maximum Seated Height: 0.6 mm

A low seated height supports compact designs, ideal for portable electronic devices.

Maximum Clock Frequency (fCLK): 0.4 MHz

Support for a maximum clock frequency of 0.4 MHz enables sufficient speed for most slow-speed applications.

Width: 2 mm

The compact width allows for efficient use of PCB space, which is critical in modern electronic designs.

Minimum Supply Voltage (Vsup): 1.8 V

The minimum supply voltage of 1.8 V ensures compatibility with lower-power applications, improving efficiency.

Length: 3 mm

Having a small length contributes to space-saving designs, essential for portable and compact devices.

Temperature Grade: INDUSTRIAL

An industrial temperature grade indicates robustness for use in harsh environments, suitable for various applications.

Technology: CMOS

CMOS technology offers low power consumption and high-density data storage, enhancing overall performance.

Parallel or Serial: SERIAL

The serial interface simplifies wiring and connections, which is particularly advantageous in complex designs.

Terminal Form: NO LEAD

No-lead terminal form allows for easier and cleaner soldering during assembly, improving manufacturing efficiency.

Maximum Supply Current: 0.8 mA

The low maximum supply current minimizes energy consumption, contributing to longer battery life in portable devices.

No. of Words: 1024 words

Offering 1024 words of memory provides sufficient storage for many applications, ensuring versatility.

Memory Width: 8

An 8-bit memory width is standard for many applications, allowing it to interface easily with 8-bit microcontrollers.

Minimum Data Retention Time: 40

A minimum data retention time of 40 years ensures reliability in long-term storage applications.

Terminal Pitch: 0.5 mm

A 0.5 mm terminal pitch is compatible with modern PCB manufacturing techniques, promoting design flexibility.

No. of Words Code: 1K

The 1K word code supports practical applications in consumer electronics, IoT devices, and more.

Maximum Supply Voltage (Vsup): 5.5 V

The higher maximum supply voltage provides additional design flexibility for accommodating varying power supplies.

Endurance: 1000000 Write/Erase Cycles

An endurance rating of 1 million write/erase cycles highlights the long-lasting performance, ideal for frequent data updates.

Serial Bus Type: I2C

I2C serial bus type simplifies communication with multiple devices, promoting modular designs.

Maximum Write Cycle Time (tWC): 5 ms

A maximum write cycle time of 5 ms ensures quick data writing, which is essential for real-time applications.

Memory Density: 8192 bit

With a memory density of 8192 bits, this EEPROM is suitable for a variety of data storage needs across different applications.

Memory IC Type: EEPROM

As an EEPROM, it provides non-volatile memory with the ability to be rewritten, perfect for data that must persist after power loss.

Maximum Standby Current: 0.000001 Amp

The ultra-low standby current minimizes power usage when not actively in operation, ideal for battery-powered devices.

Technical Specifications

EEPROM M24C08-RMB6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DMMR

JESD-30 Code:

R-PDSO-N8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

8192 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

1024 words

No. of Words Code:

1K

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

1KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOLCC8,.11,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

.6 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

2 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C08-RMB6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20