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M24C04-WBN6P

STMicroelectronics

M24C04-WBN6P by STMicroelectronics

M24C04-WBN6P by STMicroelectronics is a 512x8 EEPROM with a max clock frequency of 0.4 MHz. It operates in synchronous mode and has a temperature range of -40 to 85°C. This memory IC is commonly used in industrial applications for data storage and retrieval.

Median Price

$1.818

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 10 parts In-Stock

1+ parts

$0.167

100+ parts

-

1k+ parts

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10

$0.167

-

-

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American Microsemiconductor Inc.

USA . 80 parts In-Stock

1+ parts

$3.470

100+ parts

-

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80

$3.470

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Vyrian

USA . 8,808 parts In-Stock

1+ parts

-

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8,808

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-

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Semtec, LLC

USA . 6,000 parts In-Stock

1+ parts

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6,000

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-

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Chip Stock

USA . 2,750 parts In-Stock

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2,750

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-

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Anansix

USA . 2,726 parts In-Stock

1+ parts

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2,726

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-

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Digiode

USA . 2,593 parts In-Stock

1+ parts

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2,593

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-

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LWI Electronics Inc

India . 2,050 parts In-Stock

1+ parts

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2,050

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-

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Cyclops Electronics Ltd

UK . 1,205 parts In-Stock

1+ parts

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1,205

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-

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ComSIT USA

USA . 97 parts In-Stock

1+ parts

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97

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ABC Electronics Ltd.

UK . 69 parts In-Stock

1+ parts

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69

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

1+ parts

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20

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Prism Electronics

USA . 10 parts In-Stock

1+ parts

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Argo Parts USA

USA . 4,673 parts In-Stock

1+ parts

$0.167

100+ parts

-

1k+ parts

-

10k+ parts

$0.162

4,673

$0.167

-

-

$0.162

Continental Prestige Electronics

USA . 1,922 parts In-Stock

1+ parts

$0.167

100+ parts

-

1k+ parts

-

10k+ parts

$0.164

1,922

$0.167

-

-

$0.164

Corohmni

South Africa . 733 parts In-Stock

1+ parts

$0.167

100+ parts

-

1k+ parts

-

10k+ parts

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733

$0.167

-

-

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Ampacity Inc.

Singapore . 1,327 parts In-Stock

1+ parts

$1.000

100+ parts

-

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1,327

$1.000

-

-

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Microchip USA

USA . 266 parts In-Stock

1+ parts

$2.323

100+ parts

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266

$2.323

-

-

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Aztec Data Supply Inc.

USA . 2,780 parts In-Stock

1+ parts

$3.160

100+ parts

-

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2,780

$3.160

-

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IDEA Electronic Components Group

UK . 1,687 parts In-Stock

1+ parts

$4.864

100+ parts

-

1k+ parts

$4.378

10k+ parts

-

1,687

$4.864

-

$4.378

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MKK Technologies

India . 706 parts In-Stock

1+ parts

$9.147

100+ parts

-

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706

$9.147

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DigiPath Technology Company

USA . 706 parts In-Stock

1+ parts

$9.147

100+ parts

-

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706

$9.147

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AZTECH Wire

Italy . 332 parts In-Stock

1+ parts

$13.858

100+ parts

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332

$13.858

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Semicontronic

India . 988 parts In-Stock

1+ parts

$27.000

100+ parts

$26.325

1k+ parts

$26.190

10k+ parts

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988

$27.000

$26.325

$26.190

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Perfect Parts

USA . 15,045 parts In-Stock

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15,045

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A-Z Elektronik GmbH

Germany . 15,000 parts In-Stock

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15,000

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Kepictronics

USA . 12,397 parts In-Stock

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12,397

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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10,000

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Lixinc

USA . 9,437 parts In-Stock

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9,437

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Parana Technologies

USA . 1,698 parts In-Stock

1+ parts

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$5.816

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1,698

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$5.816

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Corphita

USA . 1,179 parts In-Stock

1+ parts

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1,179

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

$0.164

1k+ parts

$0.159

10k+ parts

$0.155

1,000

-

$0.164

$0.159

$0.155

Overview

Discover the M24C04-WBN6P by STMicroelectronics, a top-notch EEPROM that brings exceptional quality and performance to your projects. With its cutting-edge technology and reliable manufacturing process, STMicroelectronics ensures that every product meets the highest standards. This EEPROM is perfect for a wide range of applications, offering seamless data storage and retrieval. Experience the value and benefits it brings, including fast operation, high endurance, and outstanding reliability. Unlock endless possibilities with the M24C04-WBN6P and elevate your designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material combination offers durability and resistance to environmental factors, making the product reliable for various applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage provides stable and consistent power to the EEPROM, ensuring proper functionality and performance.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for precise timing and coordination of data transfer, enhancing overall efficiency and reliability.

Memory Density: 4096 bit

With a high memory density, this EEPROM can store a large amount of data in a compact space, ideal for applications requiring extensive memory storage.

Endurance: 1000000 Write/Erase Cycles

The high endurance of 1 million write/erase cycles ensures longevity and reliability of the EEPROM for frequent data read/write operations.

Serial Bus Type: I2C

The I2C serial bus interface offers easy connectivity and communication with other devices, simplifying integration into various systems.

Technical Specifications

EEPROM M24C04-WBN6P attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDMR

JESD-30 Code:

R-PDIP-T8

JESD-609 Code:

e3

Length:

9.27 mm

Memory Density:

4096 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

512 words

No. of Words Code:

512

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

512X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

5.33 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C04-WBN6P Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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