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M24C02-WMN6

STMicroelectronics

M24C02-WMN6 by STMicroelectronics

M24C02-WMN6 by STMicroelectronics is an EEPROM with 256x8 organization, I2C serial bus type, and 2048-bit memory density. It operates at a max clock frequency of 0.4 MHz and has a write protection feature for hardware security. Ideal for industrial applications requiring reliable non-volatile memory storage in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

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Chip Stock

USA . 791,565 parts In-Stock

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Vyrian

USA . 5,331 parts In-Stock

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Prism Electronics

USA . 4,797 parts In-Stock

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Digiode

USA . 3,010 parts In-Stock

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3,010

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Sogenti Electronics

Canada . 2,499 parts In-Stock

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2,499

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Pegasus Components GmbH

Germany . 2,110 parts In-Stock

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Anansix

USA . 1,893 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,487 parts In-Stock

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Ashlea Components Ltd

UK . 689 parts In-Stock

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689

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Bristol Electronics

USA . 670 parts In-Stock

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670

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Flex Direct, LLC

USA . 670 parts In-Stock

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670

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ComSIT Distribution GmbH

Germany . 665 parts In-Stock

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665

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Semi Source

USA . 284 parts In-Stock

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J & M Industries LLC

USA . 90 parts In-Stock

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90

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PC Components Company LLC

USA . 88 parts In-Stock

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R&J Components

USA . 84 parts In-Stock

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84

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LIBRA Elektronik GmbH

Germany . 75 parts In-Stock

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75

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 63 parts In-Stock

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Sunrise Surplus Inc.

USA . 50 parts In-Stock

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50

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NAC Semi

USA . 46 parts In-Stock

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Inland Empire Components Inc.

USA . 28 parts In-Stock

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Electronics Depot

USA . 25 parts In-Stock

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Resion

USA . 24 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 70 parts In-Stock

1+ parts

$4.454

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$4.008

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70

$4.454

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$4.008

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MKK Technologies

India . 2,301 parts In-Stock

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$8.375

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$8.375

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DigiPath Technology Company

USA . 2,301 parts In-Stock

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$8.375

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$8.375

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AZTECH Wire

Italy . 432 parts In-Stock

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$14.690

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$14.690

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Ampacity Inc.

Singapore . 1,306 parts In-Stock

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$16.000

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Microchip USA

USA . 299 parts In-Stock

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$83.400

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299

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 5,905 parts In-Stock

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Parana Technologies

USA . 2,115 parts In-Stock

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$5.325

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Kepictronics

USA . 2,107 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 1,261 parts In-Stock

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Corphita

USA . 755 parts In-Stock

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GreenTree Electronics

Israel . 521 parts In-Stock

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521

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Overview

Unlock the power of advanced data storage with the M24C02-WMN6 EEPROM by STMicroelectronics. Known for their high-quality products, STMicroelectronics delivers top-notch technology in a compact package. Ideal for industrial applications, this EEPROM offers unparalleled durability and reliability. With a wide operating temperature range and impressive memory density, this product provides maximum performance while ensuring data integrity. Say goodbye to data loss worries and experience seamless data management with the M24C02-WMN6.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the EEPROM, ensuring reliable performance even in harsh environments.

Surface Mount: YES

The surface mount feature allows for easy and efficient PCB assembly, saving time and effort during production.

Operating Mode: SYNCHRONOUS

The synchronous operating mode ensures data is transferred and processed in a synchronized manner, leading to efficient performance and data integrity.

Nominal Supply Voltage / Vsup (V): 5

The 5V nominal supply voltage ensures compatibility with standard power sources, making it easy to integrate the EEPROM into various electronic systems.

No. of Terminals: 8

The 8 terminals provide ample connectivity options, allowing for versatile use in different circuit configurations.

Write Protection: HARDWARE

The hardware write protection feature ensures data security by preventing unauthorized write access to the EEPROM, safeguarding important information.

Endurance: 1000000 Write/Erase Cycles

With a high endurance of 1,000,000 write/erase cycles, this EEPROM offers long-lasting reliability and data retention, ideal for applications requiring frequent read/write operations.

Memory IC Type: EEPROM

Being an EEPROM memory IC type, this product offers non-volatile storage capability, retaining data even when the power is turned off, making it suitable for storing critical information.

Technical Specifications

EEPROM M24C02-WMN6 attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e0

Length:

4.9 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Output Characteristics:

OPEN-DRAIN

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Parallel or Serial:

SERIAL

Power Supplies (V):

3/5

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

2 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Maximum Write Cycle Time (tWC):

5 ms

Write Protection:

HARDWARE

Trade Compliance

M24C02-WMN6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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