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M24C02-RDS6TG

STMicroelectronics

M24C02-RDS6TG by STMicroelectronics

M24C02-RDS6TG from STMicroelectronics is a 2048-bit EEPROM with I2C interface, ideal for industrial applications. It operates at a supply voltage of 2.5V and features a max clock frequency of 0.4 MHz. With a temperature range of -40 °C to 85 °C, it ensures reliability in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 9,746 parts In-Stock

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9,746

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Anansix

USA . 2,128 parts In-Stock

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2,128

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Digiode

USA . 823 parts In-Stock

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823

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,305 parts In-Stock

1+ parts

$2.774

100+ parts

-

1k+ parts

$2.496

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-

1,305

$2.774

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$2.496

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Microchip USA

USA . 287 parts In-Stock

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$3.286

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287

$3.286

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MKK Technologies

India . 1,987 parts In-Stock

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$5.216

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1,987

$5.216

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DigiPath Technology Company

USA . 1,987 parts In-Stock

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$5.216

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1,987

$5.216

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AZTECH Wire

Italy . 61 parts In-Stock

1+ parts

$20.660

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61

$20.660

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Component Stockers USA

USA . 244 parts In-Stock

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$99.990

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244

$99.990

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Corphita

USA . 2,869 parts In-Stock

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2,869

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Parana Technologies

USA . 1,914 parts In-Stock

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$3.316

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1,914

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$3.316

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Overview

Unlock unparalleled performance with the M24C02-RDS6TG EEPROM from STMicroelectronics, a leader renowned for its commitment to quality and innovation. This compact, durable memory solution excels across diverse applications, from consumer electronics to industrial automation, ensuring reliability in extreme conditions. Experience efficient data processing with low power consumption and robust write protection, elevating your projects while optimizing operational costs. Trust in STMicroelectronics, where excellence meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures reliable performance in various conditions, making it suitable for a broad range of applications.

Surface Mount: YES

The surface mount design allows for compact integration into electronic devices, saving space on circuit boards.

Package Shape: SQUARE

The square shape aids in efficient layout design, contributing to a smaller footprint on PCBs.

Operating Mode: SYNCHRONOUS

Synchronous operation allows for faster data transfer rates, enhancing overall system performance.

Nominal Supply Voltage / Vsup (V): 2.5

The nominal supply voltage is low, which helps reduce power consumption in battery-operated devices.

Power Supplies (V): 2/5

Flexible power supply options (2V to 5V) enhance compatibility with various systems and designs.

No. of Terminals: 8

With 8 terminals, this component provides sufficient connections for various functionalities while remaining compact.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style allows for high-density mounting and is ideal for modern compact electronic devices.

Maximum Operating Temperature: 85 °C

The high operating temperature threshold ensures reliability in harsh environments and industrial applications.

Organization: 256X8

This organization allows for efficient data storage and retrieval, suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The wide temperature range makes this EEPROM suitable for extreme environmental conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish provides excellent corrosion resistance and enhances solderability for reliable connections.

I2C Control Byte: 1010DDDR

Utilizing the I2C protocol simplifies communication with microcontrollers and other devices, making integration easier.

Terminal Position: DUAL

Dual terminal positioning enhances mounting flexibility, allowing for easier PCB layout and design.

Write Protection: HARDWARE

Hardware write protection ensures data integrity and security, making it suitable for critical applications.

Maximum Seated Height: 1.1 mm

The low seated height facilitates compact designs and helps maintain a low profile for electronic devices.

Maximum Clock Frequency (fCLK): 0.4 MHz

The maximum clock frequency allows for reliable operation while accommodating moderate data transfer needs.

Width: 3 mm

The compact 3 mm width supports dense packing on PCBs, beneficial for space-constrained designs.

Minimum Supply Voltage (Vsup): 1.8 V

A minimum supply voltage of 1.8 V allows for versatility in low-power applications.

Length: 3 mm

The 3 mm length further contributes to the small form factor, maintaining compatibility with compact designs.

Temperature Grade: INDUSTRIAL

Industrial temperature grading makes this product ideal for applications in demanding environments.

Technology: CMOS

CMOS technology leads to lower power consumption and high reliability, essential for modern electronic designs.

Parallel or Serial: SERIAL

Serial communication reduces pin count and simplifies circuit design, streamlining integration into systems.

Terminal Form: GULL WING

Gull wing terminals ease the soldering process and enhance mechanical stability during operation.

Maximum Supply Current: 0.8 mA

The low supply current helps extend battery life in portable applications, which is crucial for energy efficiency.

No. of Words: 256 words

With 256 words of storage, this EEPROM strikes a balance between capacity and space efficiency.

Memory Width: 8

An 8-bit memory width optimizes data handling, making it versatile for various applications.

Minimum Data Retention Time: 40

A substantial data retention time guarantees the longevity of stored information, minimizing data loss risks.

Terminal Pitch: 0.65 mm

A 0.65 mm pitch is standard in many designs, facilitating compatibility with existing PCB layouts.

No. of Words Code: 256

The coding capability enables efficient storage management for diverse applications.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V allows flexibility and adaptability in various electronic systems.

Endurance: 1000000 Write/Erase Cycles

An impressive write/erase endurance ensures long-term reliability and reduces the need for replacements.

Serial Bus Type: I2C

The I2C bus type facilitates simple multi-device interfacing, enhancing design flexibility.

Maximum Write Cycle Time (tWC): 10 ms

A quick write cycle time improves the efficiency of data operations, making it suitable for time-sensitive applications.

Memory Density: 2048 bit

With a memory density of 2048 bits, this EEPROM provides ample storage for various digital applications.

Memory IC Type: EEPROM

As an EEPROM, it allows for non-volatile storage, retaining information even without power.

Maximum Standby Current: 0.000001 Amp

The ultra-low standby current enhances energy efficiency, making it ideal for power-sensitive applications.

Technical Specifications

EEPROM M24C02-RDS6TG attributes and parameters. Explore more EEPROM devices from STMicroelectronics

Specs

Maximum Clock Frequency (fCLK):

.4 MHz

Minimum Data Retention Time:

40

Endurance:

1000000 Write/Erase Cycles

I2C Control Byte:

1010DDDR

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e4

Length:

3 mm

Memory Density:

2048 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

No. of Words:

256 words

No. of Words Code:

256

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256X8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.19

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Parallel or Serial:

SERIAL

Power Supplies (V):

2/5

Qualification:

Not Qualified

Maximum Seated Height:

1.1 mm

Serial Bus Type:

I2C

Maximum Standby Current:

.000001 Amp

Sub-Category:

EEPROMs

Maximum Supply Current:

.8 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.8 V

Nominal Supply Voltage / Vsup (V):

2.5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

3 mm

Maximum Write Cycle Time (tWC):

10 ms

Write Protection:

HARDWARE

Trade Compliance

M24C02-RDS6TG Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.51

SB

8542.32.00.50

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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