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LSM6DSV16BX

STMicroelectronics

LSM6DSV16BX by STMicroelectronics

LSM6DSV16BX by STMicroelectronics is a compact accelerometer/gyroscope sensor with a supply voltage range of 1.71-3.6 V and operates b/w -40 °C to 85 °C. Its digital output and surface mount design make it ideal for IoT applications. With dimensions of 2.5x3 mm, it's perfect for space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Anansix

USA . 2,877 parts In-Stock

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2,877

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Vyrian

USA . 2,515 parts In-Stock

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2,515

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Digiode

USA . 374 parts In-Stock

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374

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 277 parts In-Stock

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277

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Overview

Unlock the potential of your designs with the LSM6DSV16BX from STMicroelectronics, a leader in sensor technology. This compact accelerometer and gyroscope offers unparalleled accuracy and reliability, making it ideal for applications ranging from wearable devices to smart home solutions. With its robust performance across extreme temperatures and minimal power consumption, elevate your projects while enjoying enhanced functionality and longevity. Choose quality, choose innovation!

Feature Benefit Bullets

Package Body Material: PLASTIC

The use of plastic for the package body ensures lightweight design and cost-effectiveness, making it suitable for various applications.

Maximum Supply Voltage: 3.6 V

The maximum supply voltage of 3.6 V allows for compatibility with low-power systems, enhancing battery life in portable devices.

Body Width: 2.5 inch

A body width of 2.5 inches makes it compact enough for integration into various electronic devices.

Sensors or Transducers Type: ACCELEROMETER/GYROSCOPE

This combination allows for precise motion tracking and orientation sensing, ideal for applications in smartphones, drones, and wearable devices.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options for flexibility in circuit design and integration.

Body Height: 0.74 mm

The slim profile of 0.74 mm enhances its suitability for space-constrained applications, allowing for sleek device designs.

Package Shape or Style: RECTANGULAR

The rectangular package shape aids in efficient PCB layout and component arrangement.

Minimum Supply Voltage: 1.71 V

With a low minimum supply voltage, this product can function effectively in a variety of low-voltage environments.

Maximum Operating Temperature: 85 °C

An operating temperature of up to 85 °C ensures reliability in high-temperature applications, suitable for automotive and industrial environments.

Output Range: 0.20-1.60V

The specified output range allows for a versatile signal that can easily interface with a variety of processors and controllers.

Output Type: DIGITAL VOLTAGE

Digital output simplifies integration with digital systems, ensuring compatibility with modern electronics.

Minimum Operating Temperature: -40 °C

The ability to operate as low as -40 °C makes it suitable for extreme environments, including outdoor and industrial settings.

Output (V): DIGITAL

Digital output guarantees precise measurements and easier signal processing, making it user-friendly.

Body Length/Diameter: 3 mm

With a length of just 3 mm, this product is extremely compact, enabling its use in miniaturized designs.

Mounting Feature: SURFACE MOUNT

Surface mount technology allows for automated assembly processes, reducing manufacturing costs and improving reliability.

Technical Specifications

Other Function Sensors & Transducers LSM6DSV16BX attributes and parameters. Explore more Other Function Sensors & Transducers devices from STMicroelectronics

Specs

Additional Features:

SEATED HGT MAX

Body Width:

2.5 inch

Body Height:

.74 mm

Body Length/Diameter:

3 mm

Mounting Feature:

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

DIGITAL

Output Range:

Output Type:

Package Body Material:

PLASTIC

Package Equivalence Code:

LCC14,.1X.12,20

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Trade Compliance

LSM6DSV16BX Sensors & Transducers trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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