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LSM6DSV16B

STMicroelectronics

LSM6DSV16B by STMicroelectronics

LSM6DSV16B by STMicroelectronics is a compact accelerometer/gyroscope sensor with a supply voltage range of 1.71-3.6 V and operates b/w -40 °C to 85 °C. It features a digital output and surface mount design, ideal for IoT applications and motion tracking. Its small size (2.5x3 mm) makes it suitable for space-constrained devices.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,688 parts In-Stock

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1,688

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Vyrian

USA . 1,474 parts In-Stock

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1,474

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Anansix

USA . 984 parts In-Stock

1+ parts

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100+ parts

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984

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 3,486 parts In-Stock

1+ parts

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100+ parts

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3,486

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Overview

Unlock a new era of innovation with the LSM6DSV16B from STMicroelectronics, a trusted leader in advanced sensor technology. This cutting-edge accelerometer and gyroscope duo enhances performance in applications ranging from wearables to smart home devices. With its compact design and exceptional reliability, you gain unparalleled accuracy and efficiency. Elevate your projects, save on energy costs, and enjoy seamless integration—experience the advantages that make the LSM6DSV16B your ideal choice for next-generation solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC

The use of plastic for the package body ensures lightweight construction, making it suitable for various applications without adding significant weight.

Maximum Supply Voltage: 3.6 V

A maximum supply voltage of 3.6 V allows for compatibility with common low-power systems, making it ideal for battery-operated devices.

Body Width: 2.5 inch

With a body width of 2.5 inches, this product can fit into compact spaces, ideal for modern electronic devices with limited real estate.

Sensors or Transducers Type: ACCELEROMETER/GYROSCOPE

This dual functionality as an accelerometer and gyroscope makes it versatile for motion sensing applications, enhancing its usability across various projects.

No. of Terminals: 14

The 14 terminals offer ample connectivity options, providing flexibility in interfacing with different systems and facilitating easier integration.

Body Height: 0.74 mm

Its slim body height of 0.74 mm is perfect for applications where space is at a premium, contributing to overall device compactness.

Package Shape or Style: RECTANGULAR

The rectangular package shape allows for efficient layout on PCB designs, optimizing space and improving the product's assembly process.

Minimum Supply Voltage: 1.71 V

A minimum supply voltage of 1.71 V enables operation in low-power environments, contributing to energy efficiency and longer battery life.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, this sensor is suitable for a wide range of environments, allowing it to withstand harsher conditions.

Output Range: 0.20-1.60V

The output range of 0.20-1.60V ensures compatibility with many analog circuits, providing clear and accessible output signals for processing and analysis.

Output Type: DIGITAL VOLTAGE

Digital voltage output simplifies integration with microcontrollers and digital systems, offering quick readings and reducing the complexity of signal processing.

Minimum Operating Temperature: -40 °C

With a minimum operating temperature of -40 °C, this sensor is suited for extreme cold environments, enhancing its versatility for outdoor and industrial applications.

Output (V): DIGITAL

Digital output enhances performance reliability as it is less susceptible to noise, ensuring more accurate readings in various applications.

Technology: CMOS

CMOS technology promotes low power consumption and higher integration capability, leading to improved performance in compact designs.

Body Length/Diameter: 3 mm

At 3 mm in length, this product fits easily into small electronic devices, maximizing design flexibility and minimizing space constraints.

Mounting Feature: SURFACE MOUNT

The surface mount feature allows for easy integration into modern PCB designs, enhancing manufacturing efficiency and reducing space requirements.

Technical Specifications

Other Function Sensors & Transducers LSM6DSV16B attributes and parameters. Explore more Other Function Sensors & Transducers devices from STMicroelectronics

Specs

Additional Features:

SEATED HGT MAX

Body Width:

2.5 inch

Body Height:

.74 mm

Body Length/Diameter:

3 mm

Mounting Feature:

No. of Terminals:

14

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

DIGITAL

Output Range:

Output Type:

Package Body Material:

PLASTIC

Package Equivalence Code:

LCC14,.1X.12,20

Package Shape or Style:

Sensors or Transducers Type:

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

1.71 V

Technology:

CMOS

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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