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LF27CDT-TR

STMicroelectronics

LF27CDT-TR by STMicroelectronics

LF27CDT-TR by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 2.7 V and a max output current of 0.5 A. It operates efficiently in temperatures from -40 °C to 125 °C, featuring a low dropout voltage of just 0.4 V. Ideal for compact applications, it comes in a small outline package with gull-wing terminals for easy surface mounting.

Median Price

-

Lifecycle Status

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4

In-Stock Inventory

1k+

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Vyrian

USA . 3,257 parts In-Stock

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3,257

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Extreme Components

USA . 2,055 parts In-Stock

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2,055

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Anansix

USA . 1,873 parts In-Stock

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1,873

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Digiode

USA . 1,036 parts In-Stock

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1,036

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IDEA Electronic Components Group

UK . 918 parts In-Stock

1+ parts

$2.190

100+ parts

-

1k+ parts

$1.971

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918

$2.190

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$1.971

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MKK Technologies

India . 1,439 parts In-Stock

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$4.117

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1,439

$4.117

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DigiPath Technology Company

USA . 1,439 parts In-Stock

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$4.117

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1,439

$4.117

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AZTECH Wire

Italy . 622 parts In-Stock

1+ parts

$14.480

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622

$14.480

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Microchip USA

USA . 5,043 parts In-Stock

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5,043

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Vigor

Singapore . 4,066 parts In-Stock

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4,066

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Corphita

USA . 2,974 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 765 parts In-Stock

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$2.618

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765

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$2.618

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Overview

Elevate your designs with the LF27CDT-TR from STMicroelectronics—a trusted name in innovation. This fixed positive LDO regulator combines exceptional reliability and efficiency, perfect for a variety of applications including telecommunications and consumer electronics. With its robust temperature range and minimal dropout voltage, it ensures optimal performance under demanding conditions. Experience superior quality tailored for success, enhancing your projects with unmatched stability and power management. Choose STMicroelectronics for unparalleled value and performance!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material provides excellent thermal and electrical insulation, ensuring the long-term reliability of the component.

Maximum Dropout Voltage: 0.7 V

A low dropout voltage allows the regulator to provide stable output even with minimal headroom, enhancing efficiency.

Surface Mount: YES

Surface mount technology enables efficient use of space on PCBs and facilitates automated assembly processes.

Operating Temperature (TJ-Max): 125 °C

The high maximum operating temperature ensures performance in demanding environments, making it suitable for various applications.

Technology: BIPOLAR

Bipolar technology provides excellent transient response and stability, contributing to reliable voltage regulation.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board layout and component placement, enhancing design flexibility.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability, which increases assembly reliability.

Operating Temperature (TJ-Min): -40 °C

The wide temperature range makes this regulator suitable for use in extreme conditions, offering versatility in various applications.

Packing Method: TR

Tape and reel packaging simplifies and streamlines automated handling and assembly operations, reducing production costs.

Minimum Output Voltage: 2.592 V

With a minimum output voltage close to nominal, this LDO is suitable for powering a range of low-voltage components.

Maximum Voltage Tolerance: 4 %

A 4% voltage tolerance ensures stable output under varying load and input conditions, improving overall circuit reliability.

Nominal Output Voltage: 2.7 V

The nominal output voltage of 2.7 V is ideal for many digital circuits, making this LDO a versatile choice.

Number of Terminals: 2

A simple two-terminal design minimizes board space and simplifies circuit design and integration.

Package Style (Meter): SMALL OUTLINE

The small outline package style enables compact designs, critical for modern electronics where space is at a premium.

Adjustability: FIXED

A fixed output voltage simplifies design as no additional components are needed for voltage adjustment, reducing the BOM.

Terminal Pitch: 2.28 mm

The 2.28 mm terminal pitch is compatible with a wide range of PCB designs, facilitating ease of integration.

Maximum Line Regulation: 0.013 %

Excellent line regulation ensures output voltage remains stable under varying input conditions, enhancing performance.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

This type of regulator is ideal for applications needing stable, positive output, providing reliable power supply.

Terminal Finish: MATTE TIN

A matte tin finish enhances solderability, improving assembly yield and reducing the risk of defects.

Terminal Position: SINGLE

Single terminal positioning simplifies connections, contributing to easier assembly and maintenance.

Maximum Output Voltage: 2.808 V

A maximum output voltage that is slightly above the nominal allows for design flexibility when powering various loads.

Maximum Seated Height: 2.63 mm

A low seated height is advantageous for compact designs, allowing for lower profile devices in space-sensitive applications.

Width: 6.1 mm

The moderate width aids in PCB layout flexibility, permitting closer placement of other components.

Maximum Load Regulation: 0.013 %

Great load regulation ensures minimal output voltage change with differing loads, enhancing overall performance.

Minimum Input Voltage: 3.7 V

This minimum input voltage requirement allows the product to be effectively used in a variety of voltage environments.

Maximum Output Current: 0.5 A

A maximum output current of 0.5 A makes this LDO suitable for various small-scale applications where moderate current is needed.

Maximum Time At Peak Reflow Temperature: 30 s

A maximum time at peak reflow offers guidance for manufacturing processes, ensuring proper soldering without damage.

Peak Reflow Temperature: 260 °C

The high reflow temperature tolerance indicates robustness during thermal processing, which increases manufacturing reliability.

Nominal Dropout Voltage: 0.4 V

With a nominal dropout voltage of 0.4 V, this LDO efficiently regulates output voltage even with low input voltage differentials.

Length: 6.5 mm

This length dimension supports a compact footprint on PCB, making it suitable for space-constrained designs.

Maximum Input Voltage: 16 V

A maximum input voltage of 16 V allows it to operate in a wide range of power supply scenarios.

Maximum Input Voltage Absolute: 40 V

The absolute maximum input voltage rating provides significant margin for over-voltage conditions, enhancing durability.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LF27CDT-TR attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.7 V

Nominal Dropout Voltage-1:

.4 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.7 V

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Length:

6.5 mm

Maximum Line Regulation:

.013 %

Maximum Load Regulation:

.013 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

2.808 V

Minimum Output Voltage-1:

2.592 V

Nominal Output Voltage-1:

2.7 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP3H,.38,90TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.63 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

2.28 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Maximum Voltage Tolerance:

4 %

Width:

6.1 mm

Trade Compliance

LF27CDT-TR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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