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LF27CPT-TR

STMicroelectronics

LF27CPT-TR by STMicroelectronics

LF27CPT-TR by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 2.7 V and a max output current of 0.5 A. It operates in temperatures from -40 °C to 125 °C, featuring a low dropout voltage of just 0.4 V. Ideal for compact applications, it comes in a small outline package with gull-wing terminals for easy surface mounting.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 4,601 parts In-Stock

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4,601

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Digiode

USA . 4,365 parts In-Stock

1+ parts

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1k+ parts

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4,365

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Anansix

USA . 1,713 parts In-Stock

1+ parts

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1,713

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,694 parts In-Stock

1+ parts

$1.999

100+ parts

-

1k+ parts

$1.799

10k+ parts

-

1,694

$1.999

-

$1.799

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MKK Technologies

India . 1,513 parts In-Stock

1+ parts

$3.759

100+ parts

-

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-

10k+ parts

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1,513

$3.759

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DigiPath Technology Company

USA . 1,513 parts In-Stock

1+ parts

$3.759

100+ parts

-

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10k+ parts

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1,513

$3.759

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Corphita

USA . 4,853 parts In-Stock

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4,853

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Parana Technologies

USA . 916 parts In-Stock

1+ parts

-

100+ parts

$2.390

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916

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$2.390

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Overview

Experience the reliability and efficiency of the LF27CPT-TR from STMicroelectronics, a trusted leader in semiconductor solutions. This compact LDO regulator delivers stable voltage with minimal dropout, making it perfect for power-sensitive applications in consumer electronics, automotive, and industrial devices. Elevate your designs with proven quality and performance, ensuring longevity and peace of mind for every project. Choose LF27CPT-TR for seamless integration and optimal results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction that provides reliability in various environments.

Maximum Dropout Voltage: 0.7 V

Offers improved efficiency by reducing voltage loss, making it suitable for battery-operated devices.

Surface Mount: YES

Facilitates compact designs and is easier to integrate into modern circuitry.

Operating Temperature (TJ-Max): 125 °C

Ensures stable performance even in high-temperature environments.

Technology: BIPOLAR

Known for good performance characteristics, enhancing robustness in application.

Package Shape: RECTANGULAR

Provides efficient space utilization on PCBs, suitable for high-density layouts.

Terminal Form: GULL WING

Ensures secure soldering, optimizing reliability and performance.

Operating Temperature (TJ-Min): -40 °C

Wide operating temperature range allows usage in harsh conditions.

Packing Method: TR

Tape and Reel method ensures easy handling and accurate placement during assembly.

Minimum Output Voltage: 2.592 V

Suitable for applications requiring precise low-output voltage.

Maximum Voltage Tolerance: 4 %

Greater tolerance indicates flexibility in design, accommodating variations in supply voltage.

Nominal Output Voltage: 2.7 V

Stable output voltage ideal for various electronic components needing consistent power.

No. of Terminals: 4

Four terminals provide versatility in connections and additional design flexibility.

Package Style (Meter): SMALL OUTLINE

Compact package style is space-efficient, perfect for portable applications.

Adjustability: FIXED

Fixed output voltage simplifies the design process, providing reliability with less design complexity.

Terminal Pitch: 1.27 mm

Appropriate terminal spacing is compatible with a variety of PCB designs.

Maximum Line Regulation: 0.013 %

Exceptional line regulation ensures minimal output voltage variation with changes in input voltage.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Designed specifically for applications requiring stable fixed output; minimizes design iterations.

Terminal Finish: MATTE TIN

Durable finish that enhances solderability and improves long-term reliability.

Terminal Position: SINGLE

Enables straightforward integration into designs, reducing complexity.

Maximum Output Voltage: 2.808 V

Ensures compatibility for a range of electronic components needing different voltage levels.

Maximum Seated Height: 2.63 mm

Low profile height is ideal for compact designs, conserving space on PCBs.

Width: 6.1 mm

Narrow width allows for greater flexibility in routing on dense printed circuit boards.

Maximum Load Regulation: 0.013 %

High load regulation guarantees stable performance even with load changes.

Minimum Input Voltage: 3.7 V

Allows for usage in a variety of systems operating above this voltage threshold.

Maximum Output Current: 0.5 A

Adequate output current for powering applications with moderate power demands.

Maximum Time At Peak Reflow Temperature: 40 s

Supports compatibility with standard reflow soldering processes.

Peak Reflow Temperature: 260 °C

High temperature rating is suitable for robust soldering methods, ensuring reliable connections.

Nominal Dropout Voltage: 0.4 V

Low dropout voltage makes it efficient for applications with tight voltage margins.

Length: 6.5 mm

Compact length enhances the integration capacity on small PCBs.

Maximum Input Voltage: 16 V

High input voltage tolerance allows for versatility in different power supply scenarios.

Maximum Input Voltage Absolute: 40 V

Robust input voltage handling offers additional protection in unpredictable power environments.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LF27CPT-TR attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Adjustability:

FIXED

Maximum Dropout Voltage-1:

.7 V

Nominal Dropout Voltage-1:

.4 V

Maximum Input Voltage Absolute:

Maximum Input Voltage:

16 V

Minimum Input Voltage:

3.7 V

JESD-30 Code:

R-PSSO-G4

JESD-609 Code:

e3

Length:

6.5 mm

Maximum Line Regulation:

.013 %

Maximum Load Regulation:

.013 %

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Outputs:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

2.808 V

Minimum Output Voltage-1:

2.592 V

Nominal Output Voltage-1:

2.7 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SMSIP5H,.37,50TB

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Qualification Status:

Not Qualified

Maximum Seated Height:

2.63 mm

Sub-Category:

Other Regulators

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

40

Maximum Voltage Tolerance:

4 %

Width:

6.1 mm

Trade Compliance

LF27CPT-TR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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