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LDFM33DT-TR

STMicroelectronics

LDFM33DT-TR by STMicroelectronics

LDFM33DT-TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3 V and a max output current of 0.5 A. It operates in -40 °C to 125 °C range, featuring a max dropout voltage of 0.3 V. Ideal for compact electronic applications, it comes in a small outline package with gull wing terminals.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,781 parts In-Stock

1+ parts

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3,781

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Anansix

USA . 1,924 parts In-Stock

1+ parts

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1,924

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Digiode

USA . 1,175 parts In-Stock

1+ parts

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1,175

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 582 parts In-Stock

1+ parts

$5.166

100+ parts

-

1k+ parts

$4.649

10k+ parts

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582

$5.166

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$4.649

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MKK Technologies

India . 1,763 parts In-Stock

1+ parts

$9.714

100+ parts

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1,763

$9.714

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DigiPath Technology Company

USA . 1,763 parts In-Stock

1+ parts

$9.714

100+ parts

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1,763

$9.714

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Corphita

USA . 3,936 parts In-Stock

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3,936

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Parana Technologies

USA . 1,426 parts In-Stock

1+ parts

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100+ parts

$6.176

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1,426

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$6.176

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Overview

Unlock the potential of your projects with the LDFM33DT-TR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This compact LDO regulator delivers reliable performance across diverse applications, ensuring efficient power management with minimal dropout voltage. Designed for durability in extreme temperatures, it enhances circuit efficiency while maximizing output stability. Experience unparalleled quality and elevate your designs with a product that stands out in reliability and versatility!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides durability and resistance to environmental factors, making it suitable for a variety of applications.

Maximum Dropout Voltage: 1.3 V

A low maximum dropout voltage ensures efficient voltage regulation, which is vital for battery-powered devices where minimal voltage drop is required.

Surface Mount: YES

The surface mount capability allows for easy integration into compact designs, facilitating automated assembly and reducing PCB space.

Operating Temperature (TJ-Max): 125 °C

A high maximum operating temperature indicates that this LDO can function effectively in demanding environments, enhancing its reliability.

Package Shape: RECTANGULAR

The rectangular shape is standard in many applications, ensuring compatibility with existing PCB designs and simplifying layout and placement.

Terminal Form: GULL WING

Gull wing terminals provide a strong mechanical connection, improving soldering reliability and long-term performance in the circuit.

Operating Temperature (TJ-Min): -40 °C

With a wide operating temperature range, this regulator is suitable for both extreme cold and hot environments, increasing its application versatility.

Packing Method: TR

A tape and reel packing method facilitates automated assembly processes, reducing manufacturing time and labor costs.

Minimum Output Voltage: 3.201 V

This minimum output voltage is ideal for powering low-voltage circuits, ensuring compatibility with various electronic devices.

Maximum Voltage Tolerance: 3 %

The tight voltage tolerance offers precise regulation, which is crucial for sensitive applications that require stable voltage levels.

Nominal Output Voltage: 3.3 V

A nominal output voltage of 3.3 V is commonly used in many electronic applications, making this LDO a versatile choice for designers.

No. of Terminals: 2

The two-terminal design simplifies application circuit layouts, reducing board complexity and minimizing the potential for errors.

Package Style (Meter): SMALL OUTLINE

The small outline package style supports compact designs, crucial for modern electronics where space is at a premium.

Terminal Pitch: 2.28 mm

A terminal pitch of 2.28 mm balances ease of soldering and space efficiency, making it a practical choice for various PCB designs.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Being a fixed positive LDO simplifies design requirements, ensuring stable output without the need for external components.

Terminal Position: SINGLE

Single terminal position enhances layout efficiency on PCBs, allowing for straightforward integration into various designs.

Maximum Output Voltage: 3.399 V

This maximum output voltage combined with precision regulation ensures reliable performance in a wide range of powered devices.

Maximum Seated Height: 2.4 mm

The low maximum seated height reduces the overall profile of the device on the PCB, making it ideal for compact applications.

Width: 6.1 mm

Compact width ensures that multiple components can be placed closer together on the PCB, optimizing space usage.

Minimum Input Voltage: 2.5 V

A minimum input voltage of 2.5 V allows for flexibility in various power supply designs and can work in low voltage conditions.

Maximum Output Current: 0.5 A

The ability to provide up to 0.5 A output current makes this LDO suitable for powering a range of electronics, from sensors to more power-hungry devices.

Length: 6.5 mm

A moderate length aids in space-efficient designs while maintaining robust connectivity on the PCB.

Maximum Input Voltage: 16 V

A high maximum input voltage allows for flexibility in power supply options, making it suitable for a variety of applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LDFM33DT-TR attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Maximum Dropout Voltage-1:

.3 V

Maximum Input Voltage:

16 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-PSSO-G2

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

2

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

3.399 V

Minimum Output Voltage-1:

3.201 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.4 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

2.28 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

3 %

Width:

6.1 mm

Trade Compliance

LDFM33DT-TR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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