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LDFM33PT-TR

STMicroelectronics

LDFM33PT-TR by STMicroelectronics

LDFM33PT-TR by STMicroelectronics is a fixed positive single output LDO regulator with a nominal output voltage of 3.3 V and a max dropout voltage of 0.3 V. It operates b/w -40 °C to 125 °C, supporting up to 0.5 A output current. Ideal for compact electronic applications, it features a surface mount design in a small outline package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,315 parts In-Stock

1+ parts

-

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3,315

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Anansix

USA . 921 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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921

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Vyrian

USA . 458 parts In-Stock

1+ parts

-

100+ parts

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458

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,989 parts In-Stock

1+ parts

$5.178

100+ parts

-

1k+ parts

$4.660

10k+ parts

-

1,989

$5.178

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$4.660

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MKK Technologies

India . 1,022 parts In-Stock

1+ parts

$9.736

100+ parts

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10k+ parts

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1,022

$9.736

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DigiPath Technology Company

USA . 1,022 parts In-Stock

1+ parts

$9.736

100+ parts

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10k+ parts

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1,022

$9.736

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Corphita

USA . 2,189 parts In-Stock

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2,189

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Parana Technologies

USA . 182 parts In-Stock

1+ parts

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100+ parts

$6.191

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182

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$6.191

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Overview

Elevate your designs with the LDFM33PT-TR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This compact and efficient LDO regulator delivers stable 3.3V output with exceptional dropout voltage and temperature resilience, making it ideal for a range of applications—from portable devices to industrial equipment. Experience reliability and performance that enhance your projects while enjoying the peace of mind that comes with ST's commitment to quality and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and resistance to environmental factors, making it reliable for long-term performance in various applications.

Maximum Dropout Voltage: 1.3 V

A low maximum dropout voltage allows for efficient operation even when the input voltage is close to the output voltage, enhancing overall efficiency and reducing power loss.

Surface Mount: YES

Surface mount capability facilitates easy integration into modern circuit boards, supporting high-density designs and automated assembly processes.

Operating Temperature (TJ-Max): 125 °C

With a high maximum operating temperature, this LDO can function effectively in demanding thermal environments, enhancing reliability in various applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes board space usage, making it advantageous for compact electronic designs.

Terminal Form: GULL WING

Gull-wing terminal form provides excellent mechanical strength and solderability, ensuring robust connections on the PCB.

Operating Temperature (TJ-Min): -40 °C

The wide operating temperature range makes this regulator suitable for harsh environments, including automotive and industrial applications.

Packing Method: TR

Taped and reeled packing is ideal for automated pick-and-place assembly, enhancing manufacturing efficiency.

Minimum Output Voltage: 3.2505 V

This specification ensures that the device can effectively regulate down to a level suitable for many sensitive electronic components.

Maximum Voltage Tolerance: 1.5%

High voltage tolerance ensures stable performance and reliability in various conditions, minimizing the risk of failure.

Nominal Output Voltage: 3.3 V

3.3 V output is a standard voltage level that is widely used in many digital circuits, making this LDO versatile for various applications.

No. of Terminals: 4

Having four terminals provides enhanced flexibility for circuit designers when it comes to placement and routing.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline and heat sink/slug design improve thermal dissipation, which helps maintain performance under load.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is compatible with a wide range of PCB designs, facilitating easy integration and standardized layout.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

A fixed positive output provides straightforward integration and reliable voltage regulation for various load conditions.

Terminal Position: SINGLE

Single terminal position simplifies PCB layout and reduces potential errors during assembly.

Maximum Output Voltage: 3.3495 V

A maximum output voltage very close to nominal output ensures that the regulator delivers voltage precisely as needed for the application.

Maximum Seated Height: 2.4 mm

Low seated height is beneficial for space-constrained designs, allowing for tighter component placement on the PCB.

Width: 6.1 mm

A compact width helps in maintaining smaller PCB footprints while ensuring reliability and performance.

Minimum Input Voltage: 2.5 V

The low minimum input voltage requirement allows for a broader range of input power sources, providing versatility in application.

Maximum Output Current: 0.5 A

With a maximum output current of 0.5 A, this LDO is well-suited for driving medium loads, making it versatile in various electronic circuits.

Length: 6.5 mm

The compact length contributes to space efficiency, allowing for denser circuit designs without sacrificing performance.

Maximum Input Voltage: 16 V

A high maximum input voltage offers flexibility in power supply selection, accommodating various designs and applications.

Technical Specifications

Fixed Regulators - Positive Single Output LDO LDFM33PT-TR attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Maximum Dropout Voltage-1:

.3 V

Maximum Input Voltage:

16 V

Minimum Input Voltage:

2.5 V

JESD-30 Code:

R-PSSO-G4

Length:

6.5 mm

No. of Functions:

1

No. of Terminals:

4

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

3.3495 V

Minimum Output Voltage-1:

3.2505 V

Nominal Output Voltage-1:

3.3 V

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

TR

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

2.4 mm

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Maximum Voltage Tolerance:

Width:

6.1 mm

Trade Compliance

LDFM33PT-TR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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