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L99DZ70XP

STMicroelectronics

L99DZ70XP by STMicroelectronics

L99DZ70XP by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 28V and built-in overcurrent and thermal protections. It features a compact 36-terminal design, ideal for space-constrained applications. This device operates efficiently in automotive and industrial systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,549 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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4,549

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-

-

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Vyrian

USA . 2,805 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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2,805

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Anansix

USA . 1,664 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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1,664

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,025 parts In-Stock

1+ parts

$4.225

100+ parts

-

1k+ parts

$3.802

10k+ parts

-

2,025

$4.225

-

$3.802

-

Vigor

Singapore . 4,975 parts In-Stock

1+ parts

$4.990

100+ parts

-

1k+ parts

-

10k+ parts

-

4,975

$4.990

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-

-

Component Stockers USA

USA . 2,300 parts In-Stock

1+ parts

$6.200

100+ parts

$5.890

1k+ parts

$5.710

10k+ parts

-

2,300

$6.200

$5.890

$5.710

-

MKK Technologies

India . 1,956 parts In-Stock

1+ parts

$7.944

100+ parts

-

1k+ parts

-

10k+ parts

-

1,956

$7.944

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-

-

DigiPath Technology Company

USA . 1,956 parts In-Stock

1+ parts

$7.944

100+ parts

-

1k+ parts

-

10k+ parts

-

1,956

$7.944

-

-

-

AZTECH Wire

Italy . 1,059 parts In-Stock

1+ parts

$8.420

100+ parts

-

1k+ parts

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10k+ parts

-

1,059

$8.420

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Microchip USA

USA . 2,545 parts In-Stock

1+ parts

$18.572

100+ parts

-

1k+ parts

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10k+ parts

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2,545

$18.572

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

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100+ parts

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20,000

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Kepictronics

USA . 3,500 parts In-Stock

1+ parts

-

100+ parts

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3,500

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-

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A-Z Elektronik GmbH

Germany . 2,760 parts In-Stock

1+ parts

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2,760

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Corphita

USA . 2,664 parts In-Stock

1+ parts

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100+ parts

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2,664

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Alle Elektronik GmbH

Germany . 1,840 parts In-Stock

1+ parts

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1,840

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Perfect Parts

USA . 1,007 parts In-Stock

1+ parts

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1,007

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Parana Technologies

USA . 907 parts In-Stock

1+ parts

-

100+ parts

$5.051

1k+ parts

-

10k+ parts

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907

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$5.051

-

-

Overview

Elevate your designs with the L99DZ70XP from STMicroelectronics, a trusted leader in innovative solutions. This high-quality peripheral driver promises reliability and versatility, seamlessly powering applications from automotive systems to industrial automation. With built-in protections against overcurrent and thermal events, it ensures robust performance. Experience enhanced efficiency and peace of mind, knowing you’ve chosen a product backed by excellence and cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and thermal stability, making this peripheral driver suitable for various environments.

Surface Mount: YES

Surface mount technology enables compact designs and efficient soldering processes, ideal for modern electronic devices.

Maximum Supply Voltage: 5.3 V

A maximum supply voltage of 5.3 V allows flexibility in power supply options while protecting against potential over-voltage scenarios.

Package Shape: RECTANGULAR

Rectangular packaging offers better space management on PCBs, contributing to the overall design efficiency of the application.

Built-in Protections: OVER CURRENT; THERMAL

Incorporated over-current and thermal protections enhance reliability and safety in operation, preventing damage to connected components.

Maximum Supply Voltage-1: 28 V

The ability to handle up to 28 V makes this driver versatile for applications requiring higher voltage thresholds.

No. of Terminals: 36

With 36 terminals, this driver supports complex configurations and multiple connections, making it suitable for advanced designs.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch facilitate high-density mounting on PCBs, crucial for minimizing the footprint of modern electronics.

Minimum Supply Voltage-1: 7 V

Support for a minimum supply voltage of 7 V provides design flexibility in applications with varying power supply requirements.

Minimum Supply Voltage: 4.5 V

A minimum supply voltage of 4.5 V ensures compatibility with a wide range of devices, advantageous for designers.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish enhances solderability and ensures reliable connections, critical for long-term performance.

Terminal Position: DUAL

Dual terminal positioning increases the options for PCB layout and connectivity, aiding in versatile design implementations.

Maximum Seated Height: 2.5 mm

A maximum seated height of just 2.5 mm allows for low-profile applications, perfect for space-constrained designs.

Width: 7.5 mm

A compact width of 7.5 mm aids in maintaining a tight design architecture, essential for minimizing electronic device dimensions.

Maximum Time At Peak Reflow Temperature (s): 30

A 30-second limit at peak reflow temperature ensures compatibility with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260 °C withstands modern soldering techniques, ensuring reliability during assembly.

Length: 10.3 mm

The length of 10.3 mm adds to the compact design, making it adaptable for various layouts in electronic projects.

Terminal Form: GULL WING

Gull wing terminals provide stable and easy soldering, ensuring connections can be reliably made during assembly.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5 V aligns with common industry practices, simplifying power management in designs.

Terminal Pitch: 0.5 mm

A terminal pitch of 0.5 mm allows for high-density interconnections, catering to the needs of compact electronic devices.

Nominal Supply Voltage-1: 16 V

The additional nominal supply voltage of 16 V expands the application range, accommodating devices requiring slightly higher operating voltages.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates moderate moisture sensitivity, ensuring proper handling and storage during manufacturing and assembly processes.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

As a buffer or inverter based peripheral driver, this IC is designed for reliable signal amplification, which is vital in peripheral applications.

Output Current Flow Direction: SOURCE AND SINK

The capability to source and sink current enhances its versatility, allowing it to interact effectively with various components in different configurations.

Technical Specifications

Peripheral Drivers L99DZ70XP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e3

Length:

10.3 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Output Current Flow Direction:

SOURCE AND SINK

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

2.5 mm

Maximum Supply Voltage:

5.3 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Maximum Supply Voltage-1:

28 V

Minimum Supply Voltage-1:

7 V

Nominal Supply Voltage-1:

16 V

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7.5 mm

Trade Compliance

L99DZ70XP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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