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L9686D

STMicroelectronics

L9686D by STMicroelectronics

STMicroelectronics L9686D is a peripheral driver with 8 terminals, operating voltage range of 8-18V, and built-in transient protection. It comes in a small outline package with nickel palladium gold finish. Ideal for buffer or inverter-based interface IC applications in automotive electronics due to its compact size and wide temperature range (-20 to 100 °C).

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,544 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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2,544

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-

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Anansix

USA . 155 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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155

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Digiode

USA . 71 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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71

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 754 parts In-Stock

1+ parts

$7.806

100+ parts

-

1k+ parts

$7.026

10k+ parts

-

754

$7.806

-

$7.026

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MKK Technologies

India . 586 parts In-Stock

1+ parts

$14.679

100+ parts

-

1k+ parts

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10k+ parts

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586

$14.679

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DigiPath Technology Company

USA . 586 parts In-Stock

1+ parts

$14.679

100+ parts

-

1k+ parts

-

10k+ parts

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586

$14.679

-

-

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Corphita

USA . 3,174 parts In-Stock

1+ parts

-

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3,174

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Parana Technologies

USA . 393 parts In-Stock

1+ parts

-

100+ parts

$9.334

1k+ parts

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393

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$9.334

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Overview

Unleash the power of innovation with the L9686D by STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-notch quality in peripheral drivers. This versatile product is designed to provide seamless operation and reliability in a wide range of applications. With built-in protections against transients, this small outline package offers customers peace of mind and exceptional value. Elevate your projects with the L9686D and experience superior performance like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and ensures the product is lightweight.

Surface Mount: YES

Being surface mountable makes installation and assembly easier and more efficient.

Maximum Supply Voltage: 18 V

The high maximum supply voltage allows for flexibility in different power supply configurations.

Package Shape: RECTANGULAR

The rectangular shape enables easy integration and placement within electronic circuits.

Built-in Protections: TRANSIENT

The built-in transient protection enhances the reliability and longevity of the product by safeguarding against voltage spikes.

No. of Terminals: 8

Having 8 terminals provides ample connectivity options for interfacing with other components.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space and allows for compact designs in electronic systems.

Minimum Supply Voltage: 8 V

The low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 100 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions.

Minimum Operating Temperature: -20 °C

The product's ability to operate at low temperatures makes it suitable for use in various environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel palladium gold terminal finish offers excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Having dual terminal positions enhances the product's versatility in circuit connections.

Maximum Seated Height: 1.75 mm

The low maximum seated height allows for a slim profile and space-saving installation.

Width: 3.9 mm

The compact width of the product enables efficient use of space on circuit boards.

Length: 4.9 mm

The length of 4.9 mm provides a compact footprint for the product in electronic assemblies.

Terminal Form: GULL WING

The gull wing terminal form facilitates easy soldering and robust mechanical connection.

Nominal Supply Voltage: 13.5 V

The nominal supply voltage of 13.5 V is ideal for stable and efficient operation of the product.

Terminal Pitch: 1.27 mm

The small terminal pitch of 1.27 mm allows for dense packing and high connectivity in circuit layouts.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type of buffer or inverter-based peripheral driver enables efficient signal processing and control in electronic systems.

Technical Specifications

Peripheral Drivers L9686D attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

8 V

Nominal Supply Voltage:

13.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.9 mm

Trade Compliance

L9686D Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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