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L9678P-S

STMicroelectronics

L9678P-S by STMicroelectronics

STMicroelectronics L9678P-S is a 64-terminal consumer IC with AEC-Q100 screening for industrial use. It operates b/w -40 to 95°C, with Vsup ranging from 6V to 18V. The flatpack package has a low profile of 1.6mm and fine pitch of 0.5mm, making it suitable for various consumer circuit applications.

Median Price

$5.591

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 650 parts In-Stock

1+ parts

$5.591

100+ parts

-

1k+ parts

-

10k+ parts

-

650

$5.591

-

-

-

Vyrian

USA . 4,686 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,686

-

-

-

-

Anansix

USA . 2,171 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

-

2,171

-

-

-

-

Digiode

USA . 55 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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55

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 150 parts In-Stock

1+ parts

$0.158

100+ parts

-

1k+ parts

-

10k+ parts

-

150

$0.158

-

-

-

IDEA Electronic Components Group

UK . 787 parts In-Stock

1+ parts

$1.446

100+ parts

-

1k+ parts

$1.302

10k+ parts

-

787

$1.446

-

$1.302

-

Corohmni

South Africa . 228 parts In-Stock

1+ parts

$1.739

100+ parts

-

1k+ parts

-

10k+ parts

-

228

$1.739

-

-

-

MKK Technologies

India . 1,182 parts In-Stock

1+ parts

$2.720

100+ parts

-

1k+ parts

-

10k+ parts

-

1,182

$2.720

-

-

-

DigiPath Technology Company

USA . 1,182 parts In-Stock

1+ parts

$2.720

100+ parts

-

1k+ parts

-

10k+ parts

-

1,182

$2.720

-

-

-

Vigor

Singapore . 5,184 parts In-Stock

1+ parts

$5.050

100+ parts

-

1k+ parts

-

10k+ parts

-

5,184

$5.050

-

-

-

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$5.591

100+ parts

$5.479

1k+ parts

-

10k+ parts

-

2,000

$5.591

$5.479

-

-

Continental Prestige Electronics

USA . 1,560 parts In-Stock

1+ parts

$5.591

100+ parts

-

1k+ parts

-

10k+ parts

$5.479

1,560

$5.591

-

-

$5.479

Ampacity Inc.

Singapore . 723 parts In-Stock

1+ parts

$8.800

100+ parts

-

1k+ parts

-

10k+ parts

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723

$8.800

-

-

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Microchip USA

USA . 1,924 parts In-Stock

1+ parts

$16.124

100+ parts

-

1k+ parts

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10k+ parts

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1,924

$16.124

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-

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AZTECH Wire

Italy . 630 parts In-Stock

1+ parts

$17.739

100+ parts

-

1k+ parts

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10k+ parts

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630

$17.739

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-

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Component Stockers USA

USA . 894 parts In-Stock

1+ parts

$70.260

100+ parts

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1k+ parts

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894

$70.260

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-

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Lixinc

USA . 5,779 parts In-Stock

1+ parts

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100+ parts

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5,779

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Argo Parts USA

USA . 4,641 parts In-Stock

1+ parts

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100+ parts

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4,641

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-

-

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Corphita

USA . 4,298 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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4,298

-

-

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Robosynatics

Brazil . 1,361 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

-

10k+ parts

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1,361

-

-

-

-

Lucentia Tech

USA . 1,361 parts In-Stock

1+ parts

-

100+ parts

$3.635

1k+ parts

$3.561

10k+ parts

$3.561

1,361

-

$3.635

$3.561

$3.561

Parana Technologies

USA . 836 parts In-Stock

1+ parts

-

100+ parts

$1.729

1k+ parts

-

10k+ parts

-

836

-

$1.729

-

-

Overview

Elevate your consumer electronics with the L9678P-S by STMicroelectronics. Crafted with precision and expertise, this consumer IC offers unparalleled quality and reliability for a wide range of applications. With a compact design and advanced features, this product provides exceptional value and benefits to customers seeking top-notch performance and efficiency. Experience the advantages of STMicroelectronics' cutting-edge technology with the L9678P-S, where innovation meets excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as package body material provides durability and protection for the integrated circuit, ensuring a long lifespan for the product.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, making it suitable for automated manufacturing processes.

Screening Level: AEC-Q100

AEC-Q100 screening level ensures high quality and reliability, making this product ideal for automotive applications where consistent performance is crucial.

Package Shape: SQUARE

The square package shape allows for optimal use of space on the circuit board, making it suitable for compact designs.

No. of Terminals: 64

Having 64 terminals provides ample connectivity options, allowing for versatile usage in a variety of consumer electronic applications.

Package Style (Meter): FLATPACK, LOW PROFILE, FINE PITCH

The flatpack, low profile, and fine pitch package style makes this product suitable for applications requiring a compact form factor and high-density integration.

Maximum Operating Temperature: 95 °C

With a maximum operating temperature of 95°C, this product can perform reliably even in hot environments, ensuring stability under varying conditions.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C makes this product versatile and suitable for use in a wide range of environments.

Terminal Position: QUAD

The quad terminal position allows for efficient routing of connections, facilitating easy integration into circuit designs.

Maximum Seated Height: 1.6 mm

The low maximum seated height of 1.6 mm helps in minimizing the overall profile of the product, making it suitable for slim and compact designs.

Width: 10 mm

The compact width of 10 mm enables the efficient use of space on the circuit board, making this product ideal for applications with space constraints.

Minimum Supply Voltage (Vsup): 6 V

The low minimum supply voltage requirement of 6 V allows for flexibility in power supply options, making this product suitable for a wide range of applications.

Length: 10 mm

The small length of 10 mm contributes to the compact form factor of the product, making it suitable for space-constrained applications.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this product can withstand harsh operating conditions, making it reliable for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides mechanical stability and ease of soldering, ensuring reliable connections for the integrated circuit.

Terminal Pitch: 0.5 mm

With a terminal pitch of 0.5 mm, this product allows for high-density packaging, enabling compact and efficient circuit designs.

Maximum Supply Voltage (Vsup): 18 V

The high maximum supply voltage of 18 V allows for compatibility with a wide range of power sources, making this product versatile for different applications.

Technical Specifications

Other Function Consumer ICs L9678P-S attributes and parameters. Explore more Other Function Consumer ICs devices from STMicroelectronics

Specs

General IC Type:

JESD-30 Code:

S-PQFP-G64

Length:

10 mm

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

FLATPACK, LOW PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.6 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

10 mm

Trade Compliance

L9678P-S General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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