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L9305QFP

STMicroelectronics

L9305QFP by STMicroelectronics

STMicroelectronics L9305QFP is a 48-terminal peripheral driver with built-in protections for over current and thermal issues. It operates b/w -40 to 135 °C with a supply voltage range of 4.75-5.5 V, making it ideal for automotive applications requiring reliable performance in harsh conditions. The driver features a flatpack package style with gull wing terminals and offers true output polarity, suitable for various interface IC types needing source and sink current flow control.

Median Price

$12.090

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 494 parts In-Stock

1+ parts

$12.090

100+ parts

$7.780

1k+ parts

$5.940

10k+ parts

-

494

$12.090

$7.780

$5.940

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,976 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,976

-

-

-

-

Vyrian

USA . 919 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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919

-

-

-

-

Anansix

USA . 677 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

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677

-

-

-

-

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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100

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,338 parts In-Stock

1+ parts

$6.933

100+ parts

-

1k+ parts

$6.240

10k+ parts

-

1,338

$6.933

-

$6.240

-

MKK Technologies

India . 667 parts In-Stock

1+ parts

$13.037

100+ parts

-

1k+ parts

-

10k+ parts

-

667

$13.037

-

-

-

DigiPath Technology Company

USA . 667 parts In-Stock

1+ parts

$13.037

100+ parts

-

1k+ parts

-

10k+ parts

-

667

$13.037

-

-

-

AZTECH Wire

Italy . 539 parts In-Stock

1+ parts

$14.217

100+ parts

-

1k+ parts

-

10k+ parts

-

539

$14.217

-

-

-

Ampacity Inc.

Singapore . 141 parts In-Stock

1+ parts

$35.500

100+ parts

-

1k+ parts

-

10k+ parts

-

141

$35.500

-

-

-

Continental Prestige Electronics

USA . 5,530 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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5,530

-

-

-

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Argo Parts USA

USA . 3,771 parts In-Stock

1+ parts

-

100+ parts

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3,771

-

-

-

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Corphita

USA . 1,482 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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1,482

-

-

-

-

Parana Technologies

USA . 577 parts In-Stock

1+ parts

-

100+ parts

$8.290

1k+ parts

-

10k+ parts

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577

-

$8.290

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-

Bastille Electronics

Australia . 65 parts In-Stock

1+ parts

-

100+ parts

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65

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Overview

Discover the power of the L9305QFP by STMicroelectronics, a top-quality peripheral driver that offers unmatched reliability and performance. With built-in protections against overcurrent and thermal issues, this innovative product ensures safety and longevity for your applications. From automotive to industrial projects, the L9305QFP excels in a variety of settings, providing customers with a versatile solution for their needs. Trust in STMicroelectronics' reputation for excellence and choose the L9305QFP for your next project - where quality meets value.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the peripheral driver lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, saving time and labor costs.

Maximum Supply Voltage: 5.5 V

Can handle higher supply voltages, providing flexibility in power source selection.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high reliability and quality, suitable for automotive applications.

Built-in Protections: OVER CURRENT; THERMAL

Built-in protections enhance the safety and longevity of the peripheral driver, reducing the risk of damage from overcurrent or excessive heat.

No. of Terminals: 48

Having a higher number of terminals allows for more connectivity options and functionality in the peripheral driver.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

The various package styles provide versatility in mounting and space-saving options for different design constraints.

Maximum Operating Temperature: 135 °C

With a high maximum operating temperature, the peripheral driver can withstand harsh environmental conditions without performance degradation.

Minimum Operating Temperature: -40 °C

The wide range of operating temperatures ensures reliable operation in extreme cold environments.

Terminal Position: QUAD

The quad terminal position allows for easy and secure connections on the PCB.

Maximum Seated Height: 1.2 mm

The low seated height enables a compact and space-saving design for the peripheral driver assembly.

Width: 7 mm

The compact width of 7mm makes the peripheral driver suitable for applications with space constraints.

Output Polarity: TRUE

The true output polarity ensures accurate signal transmission and compatibility with other components in the system.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical support and easy soldering during assembly.

Maximum Supply Current: 40 mA

The peripheral driver can handle a maximum supply current of 40mA, suitable for low-power applications.

Input Characteristics: STANDARD

Standard input characteristics ensure compatibility with a wide range of input signals and devices.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V is a common standard in many electronic systems, ensuring widespread compatibility.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5mm allows for high-density mounting and compact PCB designs.

Driver No. of Bits: 4

With 4 bits, the peripheral driver can handle multiple digital signals efficiently.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The interface IC type provides flexibility in signal processing and can be adapted to different communication protocols.

Output Current Flow Direction: SOURCE AND SINK

The ability to source and sink current allows for bidirectional signal control and flexibility in driving various loads.

Technical Specifications

Peripheral Drivers L9305QFP attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

OVER CURRENT; THERMAL

Driver No. of Bits:

4

Input Characteristics:

STANDARD

JESD-30 Code:

R-PQFP-G48

Length:

7 mm

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

135 Cel

Minimum Operating Temperature:

-40 Cel

Output Current Flow Direction:

SOURCE AND SINK

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP48,.35SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Current:

40 mA

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.75 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7 mm

Trade Compliance

L9305QFP Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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