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L9305

STMicroelectronics

L9305 by STMicroelectronics

STMicroelectronics L9305 is a 16-terminal peripheral driver with built-in thermal and overvoltage protections. It operates b/w -55 to 150 °C, supporting supply voltages from 3.5V to 18V. Ideal for military-grade applications requiring a max output current of 1.2A in an in-line package style.

Median Price

-

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,962 parts In-Stock

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4,962

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Vyrian

USA . 3,026 parts In-Stock

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3,026

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Anansix

USA . 1,869 parts In-Stock

1+ parts

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1,869

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GES GmbH

Germany . 23 parts In-Stock

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23

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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19

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LittleDiode

UK . 2 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,841 parts In-Stock

1+ parts

$3.337

100+ parts

-

1k+ parts

$3.003

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1,841

$3.337

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$3.003

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MKK Technologies

India . 221 parts In-Stock

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$6.275

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221

$6.275

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DigiPath Technology Company

USA . 221 parts In-Stock

1+ parts

$6.275

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221

$6.275

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Authorized Procurement Solutions

USA . 15,000 parts In-Stock

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15,000

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Parana Technologies

USA . 2,287 parts In-Stock

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$3.990

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2,287

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$3.990

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Corphita

USA . 867 parts In-Stock

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867

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Kepictronics

USA . 800 parts In-Stock

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800

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Overview

Enhance your electronic designs with the L9305 peripheral driver by STMicroelectronics. Crafted from high-quality ceramic material and featuring built-in protections against thermal issues and over-voltage scenarios, this versatile component offers reliability and peace of mind. With a wide operating voltage range and military-grade temperature capabilities, the L9305 is ideal for a variety of applications. Trust STMicroelectronics to deliver superior performance and value with the L9305 peripheral driver.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packaging provides excellent durability and thermal properties, making the product resistant to high temperatures and physical stress.

Maximum Supply Voltage: 18V

Allows for a wide range of input voltage, making this peripheral driver suitable for various applications without the risk of damage from high voltages.

Built-in Protections: THERMAL; OVER VOLTAGE

The built-in protections ensure the safety and longevity of the peripheral driver by preventing potential damage from overheating or excessive voltage.

Maximum Output Current: 1.2A

With a high maximum output current, this peripheral driver can support devices that require higher power consumption, making it versatile for different types of peripherals.

Minimum Operating Temperature: -55 °C

The wide operating temperature range allows the peripheral driver to function reliably in extreme cold conditions, making it suitable for use in various environments.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

The buffer or inverter based interface IC type provides flexibility in connecting different types of peripherals to the driver, making it compatible with a wide range of devices.

Technical Specifications

Peripheral Drivers L9305 attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

THERMAL; OVER VOLTAGE

Driver No. of Bits:

2

Input Characteristics:

SCHMITT TRIGGER

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e0

No. of Functions:

1

No. of Terminals:

16

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Output Current Flow Direction:

SINK

Maximum Output Current:

1.2 A

Nominal Output Peak Current Limit:

2.5 A

Output Polarity:

COMPLEMENTARY

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

3.5/18

Qualification:

Not Qualified

Sub-Category:

Peripheral Drivers

Maximum Supply Current:

30 mA

Maximum Supply Voltage:

18 V

Minimum Supply Voltage:

3.5 V

Nominal Supply Voltage:

14.4 V

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

L9305 Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5920-66-089-2211, 5920660892211

NIIN

660892211

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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