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L6717

STMicroelectronics

L6717 by STMicroelectronics

L6717 by STMicroelectronics is a dual switching controller designed for efficient voltage regulation in compact applications. It features a max switching frequency of 575 kHz, operates b/w 10.2V-13.8V, and supports surface mount with a very thin profile. Ideal for high-performance power management in commercial electronics.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 6,489 parts In-Stock

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6,489

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Anansix

USA . 1,991 parts In-Stock

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1,991

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Digiode

USA . 1,931 parts In-Stock

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1,931

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 773 parts In-Stock

1+ parts

$11.820

100+ parts

-

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773

$11.820

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IDEA Electronic Components Group

UK . 670 parts In-Stock

1+ parts

$16.783

100+ parts

-

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$15.104

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670

$16.783

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$15.104

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MKK Technologies

India . 2,099 parts In-Stock

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$31.559

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2,099

$31.559

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DigiPath Technology Company

USA . 2,099 parts In-Stock

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$31.559

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2,099

$31.559

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Microchip USA

USA . 2,531 parts In-Stock

1+ parts

$206.700

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2,531

$206.700

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Authorized Procurement Solutions

USA . 7,500 parts In-Stock

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7,500

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Corphita

USA . 3,508 parts In-Stock

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3,508

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Parana Technologies

USA . 1,158 parts In-Stock

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$20.066

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1,158

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$20.066

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Kepictronics

USA . 341 parts In-Stock

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341

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RC Electronics

USA . 200 parts In-Stock

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200

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Overview

Unlock unparalleled performance and efficiency with the L6717 from STMicroelectronics, a trusted leader in semiconductor innovation. Engineered for high-demand applications, this advanced switching regulator delivers reliable voltage control while ensuring optimal thermal management. Its compact design and robust features make it perfect for everything from telecommunications to automotive systems. Experience enhanced productivity and reduced energy costs—transform your projects with the L6717 today!

Feature Benefit Bullets

Surface Mount: YES

The surface mount design allows for easier integration into compact spaces and enhances automated assembly.

Package Shape: SQUARE

The square package shape offers effective heat dissipation and can be efficiently integrated into modern circuit layouts.

No. of Terminals: 48

With 48 terminals, this product can support complex circuitry, providing flexibility and functionality in advanced designs.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

This package style helps in thermal management and reduces the overall height of the device, ideal for space-constrained applications.

Maximum Operating Temperature: 70 °C

A higher maximum operating temperature ensures reliable performance in a variety of environments without thermal failure.

Control Mode: VOLTAGE-MODE

Voltage-mode control provides stable regulation and is effective for various load conditions, making it user-friendly.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature extends the usability of the device in cooler environments or applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish enhances corrosion resistance and provides superior conductivity for reliable connections.

Terminal Position: QUAD

Quad terminal positioning supports better space management on PCBs and simplifies routing for signal connections.

Maximum Seated Height: 1 mm

The low seated height allows for a flush fit on PCBs, making it suitable for slim profile designs.

Width: 7 mm

A compact width enables design flexibility in tight layouts and can contribute to overall product miniaturization.

Other IC type: DUAL SWITCHING CONTROLLER

Dual switching controller functionality allows multiple outputs from one device, increasing design efficiency and reducing component count.

Nominal Input Voltage: 12 V

Designed for a common voltage level, it simplifies integration into standard power supply configurations across various applications.

Maximum Time At Peak Reflow Temperature: 30 s

This specification ensures robust solder joint integrity while maintaining component reliability during manufacturing processes.

Peak Reflow Temperature: 260 °C

High peak reflow tolerance makes this product suitable for lead-free soldering processes, aligning with industry standards.

Length: 7 mm

The compact length allows for efficient space usage on PCBs, particularly in high-density designs.

Temperature Grade: COMMERCIAL

This grade indicates the device is suitable for a wide range of commercial applications and reliable for everyday use.

Maximum Switching Frequency: 575 kHz

A high switching frequency supports better transient response and enables use in fast-demand applications.

Terminal Form: NO LEAD

No-lead configuration minimizes the footprint and simplifies assembly, contributing to a cleaner PCB design.

Control Technique: PULSE WIDTH MODULATION

PWM control technique provides high efficiency and flexibility in adjusting output voltage according to load requirements.

Switcher Config: PHASE-SHIFT

Phase-shift configuration can improve system performance, reduce electromagnetic interference and optimize heat distribution.

Terminal Pitch: 0.5 mm

A tight terminal pitch allows for high-density layouts, making it easier to design compact electronic systems.

Minimum Input Voltage: 10.2 V

This feature enables operation in a variety of input scenarios, allowing for a wider range of application compatibility.

Maximum Input Voltage: 13.8 V

A generous maximum input voltage allows for flexibility in sourcing power, accommodating various supply configurations.

Technical Specifications

Switching Regulators & Controllers L6717 attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

VOLTAGE-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

13.8 V

Minimum Input Voltage:

10.2 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-XQCC-N48

JESD-609 Code:

e4

Length:

7 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

48

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC48,.27SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

575 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7 mm

Trade Compliance

L6717 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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