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L6713A

STMicroelectronics

L6713A by STMicroelectronics

L6713A by STMicroelectronics is a compact switching regulator designed for efficient power management. It operates with a nominal input voltage of 12V, supports up to 2A output current, and features a max switching frequency of 225kHz. Ideal for applications requiring precise voltage regulation in space-constrained environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 10,635 parts In-Stock

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Digiode

USA . 3,041 parts In-Stock

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Anansix

USA . 1,181 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 156 parts In-Stock

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156

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Bristol Electronics

USA . 156 parts In-Stock

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156

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Dan-Mar Components

USA . 156 parts In-Stock

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LWI Electronics Inc

India . 49 parts In-Stock

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49

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 1,862 parts In-Stock

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$2.353

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$2.118

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$2.118

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Microchip USA

USA . 126 parts In-Stock

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$3.722

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$3.722

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MKK Technologies

India . 1,030 parts In-Stock

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$4.425

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$4.425

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DigiPath Technology Company

USA . 1,030 parts In-Stock

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$4.425

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$4.425

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AZTECH Wire

Italy . 707 parts In-Stock

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$21.720

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707

$21.720

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Component Stockers USA

USA . 689 parts In-Stock

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$99.990

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689

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 19,232 parts In-Stock

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Vigor

Singapore . 10,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,115 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,743 parts In-Stock

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Corphita

USA . 3,802 parts In-Stock

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Metaverse IC Inc.

Canada . 1,378 parts In-Stock

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Parana Technologies

USA . 763 parts In-Stock

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$2.814

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Kepictronics

USA . 350 parts In-Stock

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Overview

Elevate your power management solutions with the L6713A from STMicroelectronics, a leader in innovation and reliability. This advanced switching regulator offers unparalleled efficiency and performance, ensuring your systems run smoothly across various applications—from computers to industrial equipment. With its compact design and superior thermal performance, the L6713A not only optimizes energy usage but also enhances the longevity of your devices, delivering exceptional value and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy enhances durability and provides excellent insulation properties.

Surface Mount: YES

Surface mount technology allows for a more compact design and improved efficiency in production.

Package Shape: SQUARE

The square shape optimizes space utilization on PCBs, allowing for more efficient layout.

No. of Terminals: 64

A higher number of terminals facilitates greater connectivity and flexibility in circuit design.

Package Style (Meter): FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

This versatile package style enables effective heat management and simplifies integration into dense designs.

Maximum Operating Temperature: 70 °C

Operating up to 70 °C ensures reliability in varying thermal environments.

Control Mode: CURRENT-MODE

Current-mode control enhances transient response, making it ideal for power-sensitive applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature increases reliability in cooler environments.

Terminal Finish: NICKEL PALLADIUM GOLD

This finish provides excellent conductivity and corrosion resistance for long-term performance.

Terminal Position: QUAD

Quad terminal positioning supports easier routing on PCBs for complex designs.

Maximum Seated Height: 1.2 mm

A low seated height contributes to a thinner profile, making it suitable for compact applications.

Width: 10 mm

A narrow width allows for high-density circuit designs without consuming excessive board space.

Other IC type: SWITCHING CONTROLLER

As a switching controller, it improves efficiency and reduces heat generation in power regulation.

Nominal Input Voltage: 12 V

Designed for a standard nominal input, making it widely compatible with many applications.

Maximum Time At Peak Reflow Temperature: 30 s

The specified reflow time indicates compatibility with standard soldering processes, enhancing manufacturability.

Peak Reflow Temperature: 260 °C

A high peak reflow temperature ensures stable solder joint reliability during assembly.

Length: 10 mm

A compact length supports space-efficient designs while maintaining performance.

Temperature Grade: COMMERCIAL

Commercial grade guarantees suitability for a variety of consumer and industrial applications.

Maximum Switching Frequency: 225 kHz

A high switching frequency reduces output ripple and enhances efficiency in voltage regulation.

Maximum Output Current: 2 A

A maximum output current of 2 A allows it to drive loads effectively in various applications.

Terminal Form: GULL WING

Gull wing terminals facilitate reliable soldering and support robust connections.

Control Technique: PULSE WIDTH MODULATION

PWM control enables efficient energy conversion and precise control of output voltage.

Switcher Config: PHASE-SHIFT

Phase-shifted switching optimizes efficiency and minimizes electromagnetic interference (EMI).

Terminal Pitch: 0.5 mm

A fine terminal pitch allows for more compact layouts, ideal for modern high-density PCB designs.

Moisture Sensitivity Level (MSL): 3

MSL 3 rating indicates reasonable handling precautions, suitable for many production environments.

Minimum Input Voltage: 10.2 V

This minimum input voltage expands usability in varied supply voltage scenarios.

Maximum Input Voltage: 13.8 V

The maximum input voltage allows for flexibility in sourcing power from standard supplies.

Technical Specifications

Switching Regulators & Controllers L6713A attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

13.8 V

Minimum Input Voltage:

10.2 V

Nominal Input Voltage:

12 V

JESD-30 Code:

S-PQFP-G64

JESD-609 Code:

e4

Length:

10 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

64

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP64,.47SQ

Package Shape:

Package Style (Meter):

FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

225 kHz

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

10 mm

Trade Compliance

L6713A Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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