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L6712ADTR

STMicroelectronics

L6712ADTR by STMicroelectronics

L6712ADTR by STMicroelectronics is a robust switching controller designed for automotive applications, featuring a max output current of 2A and a wide input voltage range (10.8V-13.2V). It operates at a max frequency of 178kHz with current-mode control. This compact, surface-mount device ensures reliable performance in demanding environments with temperatures from -40 °C to 125 °C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,805 parts In-Stock

1+ parts

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1k+ parts

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10k+ parts

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2,805

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Vyrian

USA . 1,859 parts In-Stock

1+ parts

-

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-

1k+ parts

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10k+ parts

-

1,859

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-

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Anansix

USA . 1,839 parts In-Stock

1+ parts

-

100+ parts

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1,839

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,315 parts In-Stock

1+ parts

$11.740

100+ parts

-

1k+ parts

$10.566

10k+ parts

-

1,315

$11.740

-

$10.566

-

MKK Technologies

India . 435 parts In-Stock

1+ parts

$22.077

100+ parts

-

1k+ parts

-

10k+ parts

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435

$22.077

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-

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DigiPath Technology Company

USA . 435 parts In-Stock

1+ parts

$22.077

100+ parts

-

1k+ parts

-

10k+ parts

-

435

$22.077

-

-

-

Vigor

Singapore . 7,500 parts In-Stock

1+ parts

-

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7,500

-

-

-

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Microchip USA

USA . 5,219 parts In-Stock

1+ parts

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5,219

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Corphita

USA . 3,170 parts In-Stock

1+ parts

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3,170

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Perfect Parts

USA . 2,132 parts In-Stock

1+ parts

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1k+ parts

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2,132

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Parana Technologies

USA . 952 parts In-Stock

1+ parts

-

100+ parts

$14.037

1k+ parts

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10k+ parts

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952

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$14.037

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Overview

Unlock unmatched efficiency and reliability with the L6712ADTR from STMicroelectronics, a leader in semiconductor innovation. Designed for automotive applications, this superior switching regulator excels in performance across a wide temperature range, ensuring robust operation even in extreme conditions. With its compact design and advanced current-mode control, it simplifies your power management while delivering exceptional output. Elevate your projects—experience the quality that drives success!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and longevity in various operating environments.

Surface Mount: YES

Facilitates compact designs and efficient use of PCB space, making it ideal for modern applications.

Package Shape: RECTANGULAR

Standard shape enhances compatibility with existing layouts and designs.

No. of Terminals: 28

Provides flexibility for a variety of circuit configurations and connections.

Package Style (Meter): SMALL OUTLINE

Enables a smaller footprint on circuit boards, accommodating high-density applications.

Maximum Operating Temperature: 125 °C

High temperature rating allows operation in demanding environments, supporting automotive applications.

Control Mode: CURRENT-MODE

Enhances performance and stability in power regulation applications.

Minimum Operating Temperature: -40 °C

Wide temperature range supports operation in harsh conditions, ensuring reliability in automotive uses.

Terminal Finish: NICKEL PALLADIUM GOLD

Offers excellent corrosion resistance and reliable connections over time.

Terminal Position: DUAL

Supports better electrical performance and thermal management in circuit designs.

Maximum Seated Height: 2.65 mm

Compact height enables the integration into thin-profile applications.

Width: 7.5 mm

Narrow width provides flexibility in tight layouts or high-density boards.

Other IC type: SWITCHING CONTROLLER

Specialized for efficient regulation, optimizing power delivery in various applications.

Nominal Input Voltage: 12 V

Standard input voltage suitable for automotive applications, ensuring widespread compatibility.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for careful soldering processes, ensuring robust connections during manufacturing.

Peak Reflow Temperature: 250

Works with high-temperature soldering processes for dependable assembly.

Length: 17.9 mm

Compact length aids in the design of smaller and denser printed circuit boards.

Temperature Grade: AUTOMOTIVE

Designed to meet strict automotive requirements, ensuring reliability in critical applications.

Maximum Switching Frequency: 178 kHz

Enables efficient power conversion, enhancing performance in demanding systems.

Maximum Output Current: 2 A

Sufficient current capability for a wide range of applications, providing flexibility.

Technology: BCDMOS

Advanced technology allows for integration of digital and analog functions, improving efficiency.

Terminal Form: GULL WING

Facilitates easy soldering and enhances thermal performance in PCB layout.

Control Technique: PULSE WIDTH MODULATION

Provides precise control over output voltage, enhancing regulation and performance.

Switcher Config: PHASE-SHIFT

Optimizes efficiency and reduces electromagnetic interference (EMI) for improved operation.

Terminal Pitch: 1.27 mm

Standard pitch allows for compatibility with a wide range of PCB designs.

Moisture Sensitivity Level (MSL): 3

Indicates reasonable handling and storage conditions, simplifying production processes.

Minimum Input Voltage: 10.8 V

Flexible input voltage range supports various applications beyond standard levels.

Maximum Input Voltage: 13.2 V

Accommodates a range of automotive systems, ensuring reliable performance under varying conditions.

Technical Specifications

Switching Regulators & Controllers L6712ADTR attributes and parameters. Explore more Switching Regulators & Controllers devices from STMicroelectronics

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Maximum Input Voltage:

13.2 V

Minimum Input Voltage:

10.8 V

Nominal Input Voltage:

12 V

JESD-30 Code:

R-PDSO-G28

JESD-609 Code:

e4

Length:

17.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

28

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP28,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

250

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Switching Regulator or Controllers

Surface Mount:

YES

Switcher Config:

PHASE-SHIFT

Maximum Switching Frequency:

178 kHz

Technology:

BCDMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

7.5 mm

Trade Compliance

L6712ADTR Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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