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L6569D013TR

STMicroelectronics

L6569D013TR by STMicroelectronics

L6569D013TR by STMicroelectronics is a robust MOSFET gate driver designed for automotive applications. It operates b/w 10-16.6 V, supports high-side driving, and features a totem-pole output with a peak current limit of 0.275 A. Its compact SO8 package ensures efficient surface mounting in space-constrained designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

A2Z Electronics, Inc.

USA . 72,500 parts In-Stock

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72,500

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Bristol Electronics

USA . 72,500 parts In-Stock

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72,500

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Vyrian

USA . 8,448 parts In-Stock

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8,448

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Digiode

USA . 4,603 parts In-Stock

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4,603

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ComSIT Distribution GmbH

Germany . 3,750 parts In-Stock

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3,750

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ComSIT USA

USA . 3,750 parts In-Stock

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3,750

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ACDS - Activité Composants Distribution Service

France . 2,000 parts In-Stock

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2,000

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Anansix

USA . 1,728 parts In-Stock

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1,728

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 101 parts In-Stock

1+ parts

$8.575

100+ parts

-

1k+ parts

$7.718

10k+ parts

-

101

$8.575

-

$7.718

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AZTECH Wire

Italy . 212 parts In-Stock

1+ parts

$10.410

100+ parts

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212

$10.410

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Microchip USA

USA . 161 parts In-Stock

1+ parts

$11.627

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161

$11.627

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MKK Technologies

India . 1,421 parts In-Stock

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$16.125

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1,421

$16.125

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DigiPath Technology Company

USA . 1,421 parts In-Stock

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$16.125

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1,421

$16.125

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RC Electronics

USA . 73,778 parts In-Stock

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73,778

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Authorized Procurement Solutions

USA . 60,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 5,079 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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4,480

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Corphita

USA . 4,408 parts In-Stock

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4,408

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Alle Elektronik GmbH

Germany . 3,386 parts In-Stock

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3,386

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Vigor

Singapore . 2,500 parts In-Stock

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2,500

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Kepictronics

USA . 2,249 parts In-Stock

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2,249

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Cyclops Electronics Ltd (Excess)

UK . 2,000 parts In-Stock

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2,000

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Parana Technologies

USA . 1,881 parts In-Stock

1+ parts

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$10.253

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1,881

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$10.253

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Overview

Unlock the potential of your designs with the L6569D013TR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance MOSFET gate driver combines exceptional reliability and efficiency, ideal for automotive and industrial applications. Its compact footprint and advanced technology ensure optimal thermal management, empowering you to create robust systems that excel under pressure. Elevate your projects with the quality and engineering excellence that only STMicroelectronics can deliver!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures lightweight and cost-effective packaging, making it suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration into modern compact PCB designs, optimizing space and assembly efficiency.

Maximum Supply Voltage: 16.6 V

With a maximum supply voltage of 16.6 V, the driver can support a wide range of applications and voltage levels.

Package Shape: RECTANGULAR

The rectangular package shape is popular for space-efficient layouts and improves thermal performance.

Power Supplies (V): 12

Designed for a nominal supply voltage of 12 V, this driver is compatible with standard automotive and industrial power supplies.

No. of Terminals: 8

Having 8 terminals allows for versatile connections and easy interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE

The small outline package style enhances space-saving capabilities and supports high-density designs.

Minimum Supply Voltage: 10 V

A minimum supply voltage of 10 V ensures stable operation in various environments, particularly in automotive applications.

Maximum Operating Temperature: 125 °C

Withstanding up to 125 °C makes this driver suitable for high-temperature applications, ensuring reliability in harsh conditions.

Output Characteristics: TOTEM-POLE

Totem-pole output configuration allows for faster switching speeds and helps to minimize power loss.

Minimum Operating Temperature: -40 °C

The ability to function at -40 °C is crucial for automotive and outdoor applications requiring robust performance in extreme cold.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality finish enhances solderability and ensures long-term reliability of connections.

Terminal Position: DUAL

Dual terminal position allows for flexible mounting options, enhancing design versatility within PCBs.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm contributes to a low-profile design, ideal for space-constrained applications.

Width: 3.9 mm

With a compact width of 3.9 mm, this product fits seamlessly into tight enclosures without compromising performance.

High Side Driver: YES

As a high-side driver, it simplifies driving high-side MOSFETs, enhancing design flexibility in power management schemes.

Maximum Time At Peak Reflow Temperature (s): 40

Supporting a peak reflow time of 40 seconds ensures compatibility with modern soldering processes and reliability.

Peak Reflow Temperature °C: 260

A peak reflow temperature of 260 °C supports the latest soldering techniques, ensuring durability and performance.

Length: 4.9 mm

A length of 4.9 mm contributes to an overall compact design, facilitating miniaturization in electronic applications.

Temperature Grade: AUTOMOTIVE

Rated automotive-grade ensures the component is designed to withstand the rigorous demands of automotive environments.

Technology: MOS

Utilizing MOS technology offers high efficiency, lower power loss, and fast switching capabilities, enhancing system performance.

Terminal Form: GULL WING

Gull wing terminals provide ease of soldering and better mechanical robustness during PCB assembly.

Input Characteristics: SCHMITT TRIGGER

The integrated Schmitt trigger input improves noise immunity and signal integrity, enhancing overall system reliability.

Nominal Supply Voltage: 12 V

Optimized for a nominal supply voltage of 12 V, ensuring compatibility with industry standards and minimal design changes.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for close placement on PCBs without significant layout constraints.

Nominal Output Peak Current Limit: 0.275 A

A peak current limit of 0.275 A is suitable for driving various MOSFETs effectively, ensuring efficient operation.

Interface IC Type: HALF BRIDGE BASED MOSFET DRIVER

Half bridge-based design enables flexible control of motor drivers and high-efficiency supply applications.

Technical Specifications

MOSFET Gate Drivers L6569D013TR attributes and parameters. Explore more MOSFET Gate Drivers devices from STMicroelectronics

Specs

High Side Driver:

YES

Input Characteristics:

SCHMITT TRIGGER

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.9 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Output Characteristics:

TOTEM-POLE

Nominal Output Peak Current Limit:

.275 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

DIP8,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

MOSFET Drivers

Maximum Supply Voltage:

16.6 V

Minimum Supply Voltage:

10 V

Nominal Supply Voltage:

12 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

L6569D013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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