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L6221AD

STMicroelectronics

L6221AD by STMicroelectronics

L6221AD by STMicroelectronics is a peripheral driver with 4 functions, operating at supply voltages b/w 4.5V to 5.5V. It features a max output current of 1.8A and a turn-on time of 2us, making it suitable for applications requiring high-speed signal buffering or inversion in compact designs. The small outline package style with gull wing terminals and sink output current flow direction enhances its versatility in various electronic systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 5,728 parts In-Stock

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Digiode

USA . 3,174 parts In-Stock

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Bristol Electronics

USA . 2,851 parts In-Stock

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Anansix

USA . 1,415 parts In-Stock

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1,415

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ComSIT Distribution GmbH

Germany . 40 parts In-Stock

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40

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ComSIT USA

USA . 40 parts In-Stock

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40

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Speed Components Ltd

Israel . 7 parts In-Stock

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7

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Electronic Expediters

USA . 5 parts In-Stock

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 568 parts In-Stock

1+ parts

$11.122

100+ parts

-

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$10.010

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568

$11.122

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$10.010

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AZTECH Wire

Italy . 896 parts In-Stock

1+ parts

$12.210

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896

$12.210

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MKK Technologies

India . 1,110 parts In-Stock

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$20.914

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$20.914

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DigiPath Technology Company

USA . 1,110 parts In-Stock

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$20.914

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$20.914

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QUARKTWIN TECHNOLOGY LTD

USA . 5,704 parts In-Stock

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Corphita

USA . 4,773 parts In-Stock

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Kepictronics

USA . 4,248 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,196 parts In-Stock

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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Parana Technologies

USA . 1,684 parts In-Stock

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$13.298

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Alle Elektronik GmbH

Germany . 1,464 parts In-Stock

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Metaverse IC Inc.

Canada . 928 parts In-Stock

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Assy Fe

Spain . 585 parts In-Stock

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Infinite Electronics LLP (Excess)

. 205 parts In-Stock

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Overview

Unlock the full potential of your electronic devices with the high-quality L6221AD peripheral driver from STMicroelectronics. Designed with precision and reliability in mind, this versatile component is perfect for a wide range of applications. With its innovative technology and top-notch performance, this product offers unmatched value and benefits to customers looking to enhance their electronic projects. Experience seamless operation and improved efficiency with the L6221AD - the ultimate choice for all your peripheral driver needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable devices.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 5.5 V

Can handle high supply voltages, providing flexibility in different circuit configurations.

No. of Functions: 4

Multiple functions in a single device can save board space and reduce component count.

Package Shape: RECTANGULAR

Rectangular shape provides for efficient use of space on the PCB, allowing for more components to be placed closer together.

Power Supplies (V): 5

Operates at a standard voltage level, making it compatible with a wide range of systems and applications.

No. of Terminals: 20

Having 20 terminals allows for versatile connectivity options and integration with other components.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, ideal for compact designs.

Minimum Supply Voltage: 4.5 V

Can operate at low supply voltages, offering compatibility with different power sources.

Terminal Finish: NICKEL PALLADIUM GOLD

Provides excellent conductivity and corrosion resistance, ensuring reliable performance over time.

Terminal Position: DUAL

Dual terminal position allows for more secure and stable connections on the PCB.

Maximum Seated Height: 2.65 mm

Low seated height enables a slim and compact profile, suitable for space-constrained applications.

Width: 7.5 mm

Narrow width saves space on the PCB and allows for tighter placement of components.

Length: 12.8 mm

Compact length facilitates efficient use of PCB real estate, accommodating other components easily.

Maximum Output Current: 1.8 A

High output current capability enables driving of power-hungry peripherals or multiple loads.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and precise control over the driver functions.

Terminal Form: GULL WING

Gull wing terminal form provides mechanical strength and easy soldering during assembly.

Nominal Supply Voltage: 5 V

Stable nominal supply voltage ensures consistent performance in various operating conditions.

Turn-on Time: 2 us

Fast turn-on time ensures quick response and efficient operation of the device.

Terminal Pitch: 1.27 mm

Fine terminal pitch allows for compact design and high-density PCB layouts.

Driver No. of Bits: 4

With 4 bits, the driver can handle a range of operations with precision and flexibility.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

Versatile interface IC type enables seamless integration with various systems and peripherals.

Turn-off Time: 5 us

Quick turn-off time helps in controlling the output signals effectively and efficiently.

Output Current Flow Direction: SINK

Sink output current flow direction allows for driving and controlling external loads with ease.

Technical Specifications

Peripheral Drivers L6221AD attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Driver No. of Bits:

4

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Maximum Output Current:

1.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

5 us

Turn-on Time:

2 us

Width:

7.5 mm

Trade Compliance

L6221AD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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