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L6221CD013TR

STMicroelectronics

L6221CD013TR by STMicroelectronics

STMicroelectronics L6221CD013TR is a 20-terminal peripheral driver with 4 functions, operating at supply voltages b/w 4.5V to 5.5V. It features AND gate based interface IC type, with output peak current limit of 2.2A and turn-on time of 2000µs. Ideal for applications requiring sink output current flow direction in compact designs.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,695 parts In-Stock

1+ parts

-

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1k+ parts

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4,695

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Vyrian

USA . 4,217 parts In-Stock

1+ parts

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-

1k+ parts

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4,217

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Anansix

USA . 957 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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957

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,267 parts In-Stock

1+ parts

$5.936

100+ parts

-

1k+ parts

$5.342

10k+ parts

-

1,267

$5.936

-

$5.342

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MKK Technologies

India . 153 parts In-Stock

1+ parts

$11.162

100+ parts

-

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153

$11.162

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DigiPath Technology Company

USA . 153 parts In-Stock

1+ parts

$11.162

100+ parts

-

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153

$11.162

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AZTECH Wire

Italy . 859 parts In-Stock

1+ parts

$14.330

100+ parts

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859

$14.330

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Component Stockers USA

USA . 598 parts In-Stock

1+ parts

$99.990

100+ parts

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598

$99.990

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Corphita

USA . 3,024 parts In-Stock

1+ parts

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3,024

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QUARKTWIN TECHNOLOGY LTD

USA . 2,861 parts In-Stock

1+ parts

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2,861

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Parana Technologies

USA . 732 parts In-Stock

1+ parts

-

100+ parts

$7.097

1k+ parts

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10k+ parts

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732

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$7.097

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Overview

Discover the unmatched quality and reliability of the L6221CD013TR by STMicroelectronics, a leading manufacturer in the industry. As a top-of-the-line Peripheral Driver, this product offers unparalleled performance and efficiency for a variety of applications. With its advanced features and design, customers can expect seamless integration and optimal functionality. Experience the value and benefits that this product brings, providing you with a competitive edge in your projects. Choose STMicroelectronics for cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to heat, making the product reliable for long-term use.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and reducing assembly time.

Maximum Supply Voltage: 5.5 V

The higher maximum supply voltage allows for greater flexibility in the power source selection while still maintaining optimal performance.

No. of Functions: 4

Having multiple functions in one driver simplifies the circuit design, reduces the number of components needed, and improves overall system efficiency.

Package Shape: RECTANGULAR

The rectangular package shape is commonly used and easy to work with, fitting well into most electronic systems.

No. of Terminals: 20

Having a larger number of terminals provides more connection options, enabling greater flexibility in circuit design and customization.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the circuit board, ideal for applications where size constraints are a consideration.

Minimum Supply Voltage: 4.5 V

The lower minimum supply voltage ensures compatibility with a wide range of power sources, increasing the product's versatility.

Terminal Position: DUAL

The dual terminal position allows for more secure and stable connections, reducing the risk of disconnection and signal loss.

Maximum Seated Height: 2.65 mm

The low maximum seated height helps in maintaining a compact and slim profile, making it suitable for applications with height restrictions.

Width: 7.5 mm

The moderate width provides a good balance between space-saving and ease of handling during installation and assembly.

Length: 12.8 mm

The medium length allows for adequate spacing between components on the circuit board, preventing interference and ensuring proper functioning.

Terminal Form: GULL WING

The gull wing terminal form offers strong mechanical support and easy soldering, enhancing the overall reliability and durability of the product.

Nominal Supply Voltage: 5 V

The standard nominal supply voltage of 5V is commonly used in many electronic systems, ensuring compatibility and widespread applicability.

Turn-on Time: 2000 us

The quick turn-on time of 2000 microseconds reduces delays in signal processing and improves the responsiveness of the peripheral driver.

Terminal Pitch: 1.27 mm

The small terminal pitch allows for high-density mounting, maximizing the use of available space on the circuit board and providing more design flexibility.

Nominal Output Peak Current Limit: 2.2 A

The high nominal output peak current limit of 2.2A ensures that the driver can handle demanding applications and deliver robust performance.

Interface IC Type: AND GATE BASED PERIPHERAL DRIVER

The use of AND gate based peripheral driver interface IC type enables logical operations and signal processing, making it suitable for advanced control and automation applications.

Turn-off Time: 5 us

The fast turn-off time of 5 microseconds ensures quick response and precise control over the output, enhancing the overall efficiency and accuracy of the driver.

Output Current Flow Direction: SINK

The sink output current flow direction allows the driver to control and regulate current flow effectively, ensuring stable operation and reliable performance.

Technical Specifications

Peripheral Drivers L6221CD013TR attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G20

Length:

12.8 mm

No. of Functions:

4

No. of Terminals:

20

Output Current Flow Direction:

SINK

Nominal Output Peak Current Limit:

2.2 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Turn-off Time:

5 us

Turn-on Time:

2000 us

Width:

7.5 mm

Trade Compliance

L6221CD013TR Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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