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L4947PD013TR

STMicroelectronics

L4947PD013TR by STMicroelectronics

L4947PD013TR by STMicroelectronics is a fixed positive LDO regulator with a nominal output voltage of 5V and a max output current of 0.5A. It operates in temperatures from -40 °C to 125°C, featuring a compact surface mount design. Ideal for powering sensitive electronics, it ensures stable performance with low dropout voltage of 0.75V.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 9,241 parts In-Stock

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Digiode

USA . 1,563 parts In-Stock

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1,563

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Anansix

USA . 1,286 parts In-Stock

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1,286

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ComSIT Distribution GmbH

Germany . 20 parts In-Stock

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20

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Distributors (Availability)

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Microchip USA

USA . 434 parts In-Stock

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$6.842

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434

$6.842

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IDEA Electronic Components Group

UK . 1,626 parts In-Stock

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$8.164

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$7.348

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1,626

$8.164

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$7.348

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AZTECH Wire

Italy . 548 parts In-Stock

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$9.810

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548

$9.810

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MKK Technologies

India . 251 parts In-Stock

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$15.352

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251

$15.352

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DigiPath Technology Company

USA . 251 parts In-Stock

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$15.352

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$15.352

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Component Stockers USA

USA . 394 parts In-Stock

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$99.990

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$99.990

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Corphita

USA . 4,067 parts In-Stock

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4,067

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Parana Technologies

USA . 1,948 parts In-Stock

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$9.761

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$9.761

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Vigor

Singapore . 1,429 parts In-Stock

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Kepictronics

USA . 100 parts In-Stock

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Overview

Unlock the power of reliable performance with the L4947PD013TR from STMicroelectronics, a trusted leader in innovative solutions. This high-quality LDO regulator is designed for stability and efficiency, ensuring your applications run smoothly even in challenging environments. With exceptional thermal handling and a compact footprint, it seamlessly integrates into any project, providing a robust output for your electronic designs. Experience the difference with ST's commitment to excellence!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures reliability and longevity, making it suitable for various electronic devices.

Maximum Dropout Voltage: 0.75 V

Low dropout voltage improves efficiency, especially when operating near the input voltage.

Surface Mount: YES

Surface mount design enables easy integration into compact circuit boards.

Operating Temperature (TJ-Max): 125 °C

High maximum operating temperature allows for use in demanding environments without risk of failure.

Package Shape: RECTANGULAR

Rectangular shape aids in space-efficient layouts on printed circuit boards.

Terminal Form: GULL WING

Gull wing terminals facilitate automated soldering processes, enhancing manufacturing efficiency.

Operating Temperature (TJ-Min): -40 °C

Wide temperature range ensures functionality in both extreme cold and hot conditions.

Packing Method: TR

Tape and reel packaging optimizes the assembly process in high-volume production.

Minimum Output Voltage: 4.8 V

Offers flexible output choices to accommodate various application requirements.

Maximum Voltage Tolerance: 4%

Tightly controlled output voltage tolerance ensures consistent performance across applications.

Nominal Output Voltage: 5 V

Standard output voltage suitable for most digital circuits and devices.

No. of Terminals: 20

Adequate number of terminals allows for versatile circuit connectivity.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

Compact package style with a heat sink/slug option helps in thermal management.

Terminal Pitch: 1.27 mm

Standard pitch size ensures compatibility with common PCB designs.

Regulator Type: FIXED POSITIVE SINGLE OUTPUT LDO REGULATOR

Fixed output regulation provides stability and simplicity in circuit design.

Terminal Finish: TIN

Tin finish enhances solderability and helps prevent corrosion.

Terminal Position: DUAL

Dual terminal positioning facilitates better access and layout adaptability.

Maximum Output Voltage: 5.2 V

Allows for slight variations in output, accommodating variations in circuit demand.

Moisture Sensitivity Level (MSL): 3

Suitable for standard packaging and handling practices, ensuring reliability during storage.

Maximum Seated Height: 3.6 mm

Low height design is well-suited for space-constrained applications.

Width: 11 mm

Compact width enables denser PCB layouts without sacrificing performance.

Minimum Input Voltage: 6 V

Requires a modest input voltage for stable operation, making it versatile for various power sources.

Maximum Output Current: 0.5 A

Sufficient output current capacity for low to moderate power applications.

Maximum Time At Peak Reflow Temperature: 10 s

Supports thermal management standards for automated assembly practices.

Peak Reflow Temperature: 225 °C

Can withstand high temperatures during assembly, ensuring reliable solder joints.

Length: 15.9 mm

Compact length improves layout flexibility in PCB designs.

Maximum Input Voltage: 26 V

High input voltage tolerance makes it suitable for various applications with varying power inputs.

Technical Specifications

Fixed Regulators - Positive Single Output LDO L4947PD013TR attributes and parameters. Explore more Fixed Regulators - Positive Single Output LDO devices from STMicroelectronics

Specs

Maximum Dropout Voltage-1:

.75 V

Maximum Input Voltage:

26 V

Minimum Input Voltage:

6 V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Operating Temperature (TJ-Max):

125 Cel

Operating Temperature (TJ-Min):

-40 Cel

Maximum Output Current-1:

.5 A

Maximum Output Voltage-1:

5.2 V

Minimum Output Voltage-1:

4.8 V

Nominal Output Voltage-1:

5 V

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Packing Method:

TR

Peak Reflow Temperature (C):

225

Qualification Status:

Not Qualified

Maximum Seated Height:

3.6 mm

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Maximum Voltage Tolerance:

4 %

Width:

11 mm

Trade Compliance

L4947PD013TR Regulators trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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