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L293DD1

STMicroelectronics

L293DD1 by STMicroelectronics

STMicroelectronics L293DD1 is a Motion Control IC with 20 terminals in a small outline package. It operates on 5V and 24V power supplies, featuring bipolar technology and tin/lead terminal finish. Ideal for applications requiring precise motion control in compact spaces.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,671 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,671

-

-

-

-

Anansix

USA . 1,595 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,595

-

-

-

-

Digiode

USA . 896 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

896

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 655 parts In-Stock

1+ parts

$14.102

100+ parts

-

1k+ parts

$12.692

10k+ parts

-

655

$14.102

-

$12.692

-

MKK Technologies

India . 166 parts In-Stock

1+ parts

$26.517

100+ parts

-

1k+ parts

-

10k+ parts

-

166

$26.517

-

-

-

DigiPath Technology Company

USA . 166 parts In-Stock

1+ parts

$26.517

100+ parts

-

1k+ parts

-

10k+ parts

-

166

$26.517

-

-

-

Parana Technologies

USA . 1,171 parts In-Stock

1+ parts

-

100+ parts

$16.861

1k+ parts

-

10k+ parts

-

1,171

-

$16.861

-

-

Corphita

USA . 340 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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340

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-

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-

Overview

Unleash the power of motion control with the L293DD1 by STMicroelectronics. This high-quality IC offers unparalleled performance and reliability, thanks to the expertise of its renowned manufacturer. Ideal for a wide range of applications, this product provides exceptional value and benefits to customers looking for precision and efficiency in their designs. Whether you're working on robotics, automation, or any other motion control project, the L293DD1 is the perfect choice to take your creations to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the IC, making it suitable for a variety of applications.

Surface Mount: YES

Allows for easy and convenient installation on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular shape ensures compatibility with standard PCB layouts and maximizes space efficiency.

Power Supplies (V): 5,24

Supports a wide range of power supply voltages, giving flexibility in design and compatibility with different systems.

No. of Terminals: 20

Sufficient number of terminals for connecting various components and peripherals, increasing versatility in applications.

Package Style (Meter): SMALL OUTLINE

Compact form factor saves space on the PCB and allows for efficient utilization of board real estate.

Terminal Finish: Tin/Lead (Sn/Pb)

Provides good conductivity and solderability, ensuring reliable connections and long-term performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in mounting orientation, accommodating different PCB layouts and designs.

Technology: BIPOLAR

Bipolar technology provides high-speed performance and precise control, making it ideal for motion control applications.

Terminal Form: GULL WING

Gull wing terminals are robust and easy to solder, enhancing reliability and simplifying assembly processes.

Terminal Pitch: 1.27 mm

Standardized pitch for ease of PCB layout and compatibility with common manufacturing processes, reducing design complexity.

Technical Specifications

Motion Control ICs L293DD1 attributes and parameters. Explore more Motion Control ICs devices from STMicroelectronics

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e0

No. of Terminals:

20

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

5,24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Surface Mount:

YES

Technology:

BIPOLAR

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Trade Compliance

L293DD1 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

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