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EF6850FN

STMicroelectronics

EF6850FN by STMicroelectronics

STMicroelectronics EF6850FN is a Serial Communication Controller with 28 terminals, operating at 5V. It features MOS technology, operates b/w 0-70 °C, and has a square chip carrier package. Ideal for commercial applications requiring reliable serial communication in a compact form factor.

Median Price

$8.775

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 117 parts In-Stock

1+ parts

$8.775

100+ parts

$5.265

1k+ parts

-

10k+ parts

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117

$8.775

$5.265

-

-

Vyrian

USA . 3,898 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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3,898

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Anansix

USA . 2,797 parts In-Stock

1+ parts

-

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2,797

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-

-

-

Digiode

USA . 688 parts In-Stock

1+ parts

-

100+ parts

-

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688

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Lakeland Logistics Inc

USA . 117 parts In-Stock

1+ parts

-

100+ parts

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117

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ComSIT Distribution GmbH

Germany . 52 parts In-Stock

1+ parts

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52

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 337 parts In-Stock

1+ parts

$35.554

100+ parts

-

1k+ parts

$31.999

10k+ parts

-

337

$35.554

-

$31.999

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MKK Technologies

India . 798 parts In-Stock

1+ parts

$66.858

100+ parts

-

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10k+ parts

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798

$66.858

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DigiPath Technology Company

USA . 798 parts In-Stock

1+ parts

$66.858

100+ parts

-

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10k+ parts

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798

$66.858

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Corphita

USA . 3,984 parts In-Stock

1+ parts

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3,984

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Parana Technologies

USA . 1,288 parts In-Stock

1+ parts

-

100+ parts

$42.511

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1,288

-

$42.511

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Northwest PG Solutions

USA . 966 parts In-Stock

1+ parts

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966

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Native Components

USA . 801 parts In-Stock

1+ parts

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801

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Overview

Unlock seamless and reliable communication with the EF6850FN by STMicroelectronics. Crafted with precision and expertise, this serial communication controller boasts unparalleled quality and performance. Ideal for a wide range of applications, this product offers unmatched value and benefits to customers looking for efficient and cost-effective solutions. Embrace innovation and elevate your projects with the EF6850FN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for portable and rugged applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing overall product size.

Package Shape: SQUARE

The square package shape ensures uniformity in design and simplifies PCB layout for a neat and organized appearance.

Power Supplies (V): 5

Operating at a voltage of 5V makes the product compatible with common power sources, offering ease of integration.

No. of Terminals: 28

Having 28 terminals provides versatile connectivity options, allowing for a wide range of communication interfaces.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers enhanced thermal performance and reliability, making it suitable for continuous operation.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70 °C, the product can withstand high temperatures, ensuring reliable performance in varying environments.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0 °C allows the product to function effectively in both cold and warm conditions, providing flexibility in usage.

Terminal Finish: Tin/Lead (Sn/Pb)

The tin/lead terminal finish enhances solderability and ensures stable electrical connections, contributing to the product's overall reliability.

Terminal Position: QUAD

The quad terminal position simplifies PCB assembly and facilitates efficient routing of signal traces, optimizing performance and reliability.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that the product is suitable for standard operating conditions, making it widely applicable in commercial applications.

Technology: MOS

Utilizing MOS technology improves power efficiency and enables high-speed data transmission, enhancing the overall performance of the product.

Terminal Form: J BEND

The J bend terminal form allows for easy insertion and removal during PCB assembly, streamlining the manufacturing process and reducing assembly time.

Nominal Supply Voltage: 5 V

Being designed for a nominal supply voltage of 5V ensures compatibility with standard power sources, facilitating seamless integration into various systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27mm enables precise and secure connections, contributing to the product's overall reliability and signal integrity.

Technical Specifications

Serial Communication Controllers EF6850FN attributes and parameters. Explore more Serial Communication Controllers devices from STMicroelectronics

Specs

JESD-30 Code:

S-PQCC-J28

JESD-609 Code:

e0

No. of Terminals:

28

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LDCC28,.5SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Serial IO/Communication Controllers

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

MOS

Temperature Grade:

Terminal Finish:

Tin/Lead (Sn/Pb)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Trade Compliance

EF6850FN Peripheral ICs trade compliance attributes, and parameters.

HTS

8542.31.00.01

SB

8542.31.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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