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E-TDA7563

STMicroelectronics

E-TDA7563 by STMicroelectronics

E-TDA7563 by STMicroelectronics is a 4-channel audio amplifier with a nominal output power of 46 W and a gain of 30 dB. It operates within a supply voltage range of 8-18 V, featuring low harmonic distortion at 10%. Ideal for high-quality audio applications, it comes in a flange mount package.

Median Price

$20.943

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,734 parts In-Stock

1+ parts

$20.943

100+ parts

$18.526

1k+ parts

$17.173

10k+ parts

-

1,734

$20.943

$18.526

$17.173

-

Digiode

USA . 3,534 parts In-Stock

1+ parts

-

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-

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3,534

-

-

-

-

Anansix

USA . 2,730 parts In-Stock

1+ parts

-

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-

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2,730

-

-

-

-

Lakeland Logistics Inc

USA . 1,734 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,734

-

-

-

-

Vyrian

USA . 694 parts In-Stock

1+ parts

-

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-

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694

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 408 parts In-Stock

1+ parts

$2.032

100+ parts

-

1k+ parts

$1.829

10k+ parts

-

408

$2.032

-

$1.829

-

MKK Technologies

India . 808 parts In-Stock

1+ parts

$3.822

100+ parts

-

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-

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808

$3.822

-

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DigiPath Technology Company

USA . 808 parts In-Stock

1+ parts

$3.822

100+ parts

-

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-

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808

$3.822

-

-

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

1+ parts

-

100+ parts

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20,000

-

-

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Northwest PG Solutions

USA . 1,862 parts In-Stock

1+ parts

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1,862

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Corphita

USA . 846 parts In-Stock

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846

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Native Components

USA . 491 parts In-Stock

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491

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Parana Technologies

USA . 96 parts In-Stock

1+ parts

-

100+ parts

$2.430

1k+ parts

-

10k+ parts

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96

-

$2.430

-

-

Overview

Elevate your audio experience with the E-TDA7563 from STMicroelectronics, a leader in innovative semiconductor solutions. This powerful audio amplifier redefines sound quality with its low distortion and high efficiency, perfect for home theater systems, automotive audio, and professional applications. Crafted with precision and supported by ST's commitment to excellence, the E-TDA7563 ensures reliable performance and an immersive listening experience that will resonate with every enthusiast.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable plastic/epoxy materials ensures longevity and reliability in various environments, making it suitable for both home and professional audio systems.

Package Shape: RECTANGULAR

A rectangular shape allows for easy integration into various chassis designs, providing flexibility in installation.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, this IC is specifically designed to enhance sound quality and power, making it ideal for audio-centric applications.

Harmonic Distortion: 10%

A harmonic distortion rate of 10% is reasonable for consumer applications, ensuring distortion levels remain low for clear audio playback.

No. of Terminals: 27

With 27 terminals, this amplifier offers ample connectivity options, allowing for versatile wiring and configuration.

Package Style (Meter): FLANGE MOUNT

Flange mount design provides secure installation options and enhances mechanical stability during operation.

Terminal Position: ZIG-ZAG

Zig-zag terminal positioning optimizes space and allows for organized layout, facilitating easier connections.

Nominal Output Power: 46 W

Nominal output power of 46 W makes this amplifier suitable for driving a wide range of speakers, providing strong and clear sound.

Minimum Supply Voltage (Vsup): 8 V

Operating at a minimum supply voltage of 8 V allows for compatibility with a variety of power sources, enhancing flexibility in design.

No. of Channels: 4

With 4 channels, this amplifier can support multi-channel audio systems, allowing for immersive sound experiences.

Technology: BCDMOS

BCD technology combines the advantages of bipolar and CMOS processes, delivering better performance and efficiency.

Nominal Bandwidth: 0.022 kHz

The nominal bandwidth ensures the amplifier can effectively process a wide range of audio frequencies.

Terminal Form: THROUGH-HOLE

Through-hole terminals allow for robust connections and are suited for various PCB designs, ensuring reliable solder joints.

Gain: 30 dB

A gain of 30 dB enables the amplifier to significantly enhance weak audio signals, resulting in powerful output.

Maximum Supply Voltage (Vsup): 18 V

The ability to handle a maximum supply voltage of 18 V provides flexibility in power supply options while ensuring optimal performance.

Technical Specifications

Audio & Video Amplifiers E-TDA7563 attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

Gain:

30 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PZFM-T27

No. of Channels:

4

No. of Functions:

1

No. of Terminals:

27

Nominal Output Power:

46 W

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

FLANGE MOUNT

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

NO

Technology:

BCDMOS

Terminal Form:

Terminal Position:

ZIG-ZAG

Trade Compliance

E-TDA7563 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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