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E-TDA7391PD

STMicroelectronics

E-TDA7391PD by STMicroelectronics

E-TDA7391PD by STMicroelectronics is a compact audio amplifier with a nominal output power of 32 W and operates b/w 8-18 V. It features a small outline package with dual terminals, ideal for space-constrained applications. This versatile amplifier supports surface mount technology, making it suitable for modern audio systems.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,012 parts In-Stock

1+ parts

-

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3,012

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Digiode

USA . 599 parts In-Stock

1+ parts

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599

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Anansix

USA . 249 parts In-Stock

1+ parts

-

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249

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,094 parts In-Stock

1+ parts

$1.260

100+ parts

-

1k+ parts

$1.134

10k+ parts

-

1,094

$1.260

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$1.134

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Native Components

USA . 389 parts In-Stock

1+ parts

$1.472

100+ parts

-

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389

$1.472

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Northwest PG Solutions

USA . 1,657 parts In-Stock

1+ parts

$1.619

100+ parts

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1,657

$1.619

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MKK Technologies

India . 2,004 parts In-Stock

1+ parts

$2.370

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2,004

$2.370

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DigiPath Technology Company

USA . 2,004 parts In-Stock

1+ parts

$2.370

100+ parts

-

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2,004

$2.370

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Component Stockers USA

USA . 3,630 parts In-Stock

1+ parts

$6.710

100+ parts

$6.380

1k+ parts

$6.180

10k+ parts

-

3,630

$6.710

$6.380

$6.180

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AZTECH Wire

Italy . 496 parts In-Stock

1+ parts

$19.200

100+ parts

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496

$19.200

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Microchip USA

USA . 252 parts In-Stock

1+ parts

$39.034

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252

$39.034

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QUARKTWIN TECHNOLOGY LTD

USA . 5,018 parts In-Stock

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5,018

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Corphita

USA . 4,382 parts In-Stock

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4,382

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Kepictronics

USA . 2,294 parts In-Stock

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2,294

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Parana Technologies

USA . 1,478 parts In-Stock

1+ parts

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$1.507

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1,478

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$1.507

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Metaverse IC Inc.

Canada . 1,147 parts In-Stock

1+ parts

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1,147

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Perfect Parts

USA . 58 parts In-Stock

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58

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Overview

Elevate your audio experience with the E-TDA7391PD from STMicroelectronics, a leader in innovative technology. This compact audio amplifier delivers impressive power and clarity, perfect for automotive applications and portable devices. With robust design and reliable performance, customers can trust in its durability and efficiency. Experience superior sound quality that enhances every moment, ensuring your projects resonate with excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy material ensures longevity and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Being surface mountable allows for compact designs, which is essential in modern electronics where space is often a constraint.

Package Shape: RECTANGULAR

The rectangular package shape is ideal for efficient layout design and easy integration into diverse PCB configurations.

General IC Type: AUDIO AMPLIFIER

Designed specifically for audio applications, this amplifier delivers superior sound quality, making it a great choice for audio enthusiasts.

Power Supplies (V): 14.4

Operating at a nominal voltage of 14.4V ensures that the amplifier can produce substantial output power while maintaining efficiency.

No. of Terminals: 20

With 20 terminals, it provides ample connection points for various components, enhancing versatility in circuit design.

Package Style (Meter): SMALL OUTLINE, HEAT SINK/SLUG

The small outline design with heat sink options allows for effective heat dissipation, promoting stability during operation.

Terminal Finish: TIN

Tin terminal finish offers good solderability and ensures robust connections, leading to enhanced reliability in audio applications.

Terminal Position: DUAL

Dual terminal positioning facilitates easier mounting and enhances layout flexibility, making it easier to integrate in tight spaces.

Nominal Output Power: 32 W

A nominal output of 32 watts provides ample power for driving speakers, ensuring clear and loud audio performance.

Maximum Seated Height: 3.6 mm

With a low profile of 3.6 mm, this amplifier is suitable for applications requiring thin designs without compromising on performance.

Width: 11 mm

At just 11 mm wide, it can fit into compact audio systems, making it ideal for modern electronic devices.

Minimum Supply Voltage (Vsup): 8 V

A minimum supply voltage of 8V allows for wider application range, making it compatible with many standard power supplies.

Maximum Time At Peak Reflow Temperature (s): 30

This specification helps ensure proper soldering during assembly, reducing the risk of damage to the IC.

Peak Reflow Temperature °C: 245

The peak reflow temperature of 245 °C ensures that the amplifier can withstand standard soldering processes without issues.

Length: 15.9 mm

With a length of 15.9 mm, it supports easy integration into compact circuits without using unnecessary board space.

Nominal Bandwidth: 0.022 kHz

This bandwidth rating is indicative of optimal frequency response, ensuring that it handles audio signals smoothly.

Terminal Form: GULL WING

Gull wing terminals provide strong mechanical support and excellent electrical conductivity, leading to reliable performance.

Maximum Supply Current: 150 mA

A maximum supply current of 150 mA allows the amplifier to operate efficiently without drawing excessive power.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm aids in compact design while maintaining an ideal distance for standard PCB handling.

Moisture Sensitivity Level (MSL): 3

An MSL of 3 indicates reasonable moisture resistance, making it suitable for a variety of environmental conditions.

Maximum Supply Voltage (Vsup): 18 V

With a maximum supply voltage of 18V, this amplifier provides high flexibility in design while supporting powerful audio output.

Technical Specifications

Audio & Video Amplifiers E-TDA7391PD attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.022 kHz

General IC Type:

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

15.9 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

20

Nominal Output Power:

32 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP20,.56

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG

Peak Reflow Temperature (C):

245

Power Supplies (V):

14.4

Qualification:

Not Qualified

Maximum Seated Height:

3.6 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

150 mA

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

8 V

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

11 mm

Trade Compliance

E-TDA7391PD General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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