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E-TDA7297D

STMicroelectronics

E-TDA7297D by STMicroelectronics

E-TDA7297D by STMicroelectronics is a compact audio amplifier with 10 W output power and 2 channels, ideal for consumer electronics. It operates b/w 6.5 V to 18 V and features low harmonic distortion at 10%. Its small outline design ensures easy surface mounting in various applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,646 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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3,646

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Digiode

USA . 1,728 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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1,728

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Anansix

USA . 848 parts In-Stock

1+ parts

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848

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 944 parts In-Stock

1+ parts

$3.257

100+ parts

-

1k+ parts

$2.931

10k+ parts

-

944

$3.257

-

$2.931

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MKK Technologies

India . 950 parts In-Stock

1+ parts

$6.124

100+ parts

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950

$6.124

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DigiPath Technology Company

USA . 950 parts In-Stock

1+ parts

$6.124

100+ parts

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950

$6.124

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Native Components

USA . 513 parts In-Stock

1+ parts

$12.770

100+ parts

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513

$12.770

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Northwest PG Solutions

USA . 2,090 parts In-Stock

1+ parts

$14.047

100+ parts

$12.642

1k+ parts

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2,090

$14.047

$12.642

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Corphita

USA . 4,871 parts In-Stock

1+ parts

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4,871

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Parana Technologies

USA . 649 parts In-Stock

1+ parts

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$3.894

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649

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$3.894

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Overview

Elevate your audio experience with the E-TDA7297D from STMicroelectronics, a renowned leader in innovative electronics. This compact audio amplifier delivers exceptional sound quality while ensuring reliability across various applications—from home theaters to portable speakers. Its robust design minimizes distortion, making every note crystal clear. Choose the E-TDA7297D for unmatched performance and bring your audio projects to life with ease!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides a lightweight and durable casing, which makes the amplifier suitable for various applications while ensuring resilience.

Surface Mount: YES

Surface mount technology allows for compact design and easy integration into modern electronic devices, offering flexibility in circuit design.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on the PCB, making it ideal for space-constrained applications.

General IC Type: AUDIO AMPLIFIER

As an audio amplifier, it delivers clear and powerful sound, making it perfect for audio applications in consumer electronics.

Harmonic Distortion: 10 %

With a harmonic distortion of 10%, this amplifier maintains audio quality, ensuring a pleasant listening experience without significant distortion.

No. of Terminals: 20

Having 20 terminals allows for multiple connections, enhancing versatility and enabling complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on PCBs, making it suitable for designing compact audio devices.

Maximum Operating Temperature: 70 °C

A maximum operating temperature of 70 °C ensures reliable performance in various environmental conditions, enhancing durability.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0 °C, this amplifier can function effectively in a wide range of environments.

Terminal Finish: MATTE TIN

Matte tin terminal finish enhances solderability and corrosion resistance, contributing to the product's longevity and reliability.

Terminal Position: DUAL

Dual terminal positioning allows for flexible board layout options, making installation easier in various applications.

Nominal Output Power: 10 W

An output power of 10 W is adequate for driving medium-sized speakers, ensuring that the amplifier can deliver quality sound performance.

Maximum Seated Height: 3.5 mm

A maximum seated height of just 3.5 mm allows for low-profile designs in compact devices.

Width: 11 mm

At only 11 mm wide, this amplifier is suitable for tight spaces, making it ideal for portable audio applications.

Minimum Supply Voltage (Vsup): 6.5 V

A lower minimum supply voltage of 6.5 V enables operation in battery-powered devices, enhancing energy efficiency.

Length: 15.9 mm

The compact length of 15.9 mm contributes to the overall space efficiency of the design, ideal for modern electronics.

Temperature Grade: COMMERCIAL

Rated for commercial temperature ranges, it's reliable for general use in consumer products.

No. of Channels: 2

With two channels, this amplifier is perfect for stereo applications, providing superior sound imaging.

Nominal Bandwidth: 0.02 kHz

A nominal bandwidth of 0.02 kHz supports low-frequency audio applications, ensuring rich sound reproduction.

Terminal Form: GULL WING

Gull wing terminals offer excellent mechanical stability and ease of soldering, ensuring strong connections.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is standard for many PCB designs, facilitating compatibility and ease of assembly.

Gain: 32 dB

With a gain of 32 dB, this amplifier effectively boosts audio signals, providing strong output to speakers.

Maximum Supply Voltage (Vsup): 18 V

A maximum supply voltage of 18 V allows for flexibility in power supply options, maximizing performance in various setups.

Technical Specifications

Audio & Video Amplifiers E-TDA7297D attributes and parameters. Explore more Audio & Video Amplifiers devices from STMicroelectronics

Specs

Nominal Bandwidth:

.02 kHz

General IC Type:

Gain:

32 dB

Harmonic Distortion:

10 %

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e3

Length:

15.9 mm

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Nominal Output Power:

10 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Qualification:

Not Qualified

Maximum Seated Height:

3.5 mm

Maximum Supply Voltage (Vsup):

18 V

Minimum Supply Voltage (Vsup):

6.5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

11 mm

Trade Compliance

E-TDA7297D General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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