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E-L6221AS

STMicroelectronics

E-L6221AS by STMicroelectronics

E-L6221AS by STMicroelectronics is a versatile peripheral driver with a max supply voltage of 5.5V and supports up to 1.8A output current. It features built-in protections against transient, overcurrent, and thermal issues. Ideal for buffer/inverter applications, it operates efficiently within a 4.5-5.5V range.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,087 parts In-Stock

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2,087

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ComSIT Distribution GmbH

Germany . 700 parts In-Stock

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700

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ComSIT USA

USA . 700 parts In-Stock

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700

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Vyrian

USA . 623 parts In-Stock

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623

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Anansix

USA . 553 parts In-Stock

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553

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Prism Electronics

USA . 64 parts In-Stock

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64

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 619 parts In-Stock

1+ parts

$10.312

100+ parts

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1k+ parts

$9.281

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619

$10.312

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$9.281

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MKK Technologies

India . 2,197 parts In-Stock

1+ parts

$19.392

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2,197

$19.392

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DigiPath Technology Company

USA . 2,197 parts In-Stock

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$19.392

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2,197

$19.392

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Corphita

USA . 2,882 parts In-Stock

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2,882

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Northwest PG Solutions

USA . 1,761 parts In-Stock

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$3.686

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1,761

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$3.686

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Parana Technologies

USA . 895 parts In-Stock

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$12.330

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895

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$12.330

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Native Components

USA . 728 parts In-Stock

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$3.648

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728

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$3.648

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Overview

Elevate your projects with the E-L6221AS from STMicroelectronics, a leader in innovation and reliability. This versatile peripheral driver combines robust built-in protections with exceptional performance, ensuring your designs are not only efficient but also safe. Ideal for various applications, its dual-terminal design and compact form factor provide seamless integration into any project. Trust in STMicroelectronics to deliver unmatched quality and value that empowers your creativity and enhances system reliability.

Feature Benefit Bullets

Maximum Supply Voltage: 5.5 V

This allows for compatibility with standard 5V systems while providing a margin for voltage fluctuations.

No. of Functions: 4

Offers versatile functionality, making it suitable for various applications without needing multiple components.

Package Shape: RECTANGULAR

The rectangular package shape is optimized for space efficiency on PCBs.

Built-in Protections: TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Multiple built-in protection features enhance reliability and prevent damage in adverse conditions.

Power Supplies (V): 5

Designed specifically for 5V power supplies, ensuring easy integration into existing systems.

No. of Terminals: 16

A higher number of terminals provides greater flexibility for connections and interfacing.

Package Style (Meter): IN-LINE

The in-line package style is ideal for straightforward mounting and less obstruction on PCBs.

Minimum Supply Voltage: 4.5 V

Allows operation under a manageable voltage range, increasing suitability for battery-powered applications.

Terminal Finish: NICKEL PALLADIUM GOLD

This high-quality terminal finish provides excellent conductivity and resistance to corrosion.

Terminal Position: DUAL

Dual terminal positioning allows for easier wiring and better layout flexibility on circuits.

Maximum Seated Height: 5.1 mm

A low profile helps save space on crowded PCBs and supports compact design requirements.

Maximum Output Current: 1.8 A

A higher maximum output current facilitates powering more demanding devices or loads effectively.

Technology: BIPOLAR

Bipolar technology ensures fast switching speeds and efficient current handling for peripheral applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and reliable connections in a variety of applications.

Nominal Supply Voltage: 5 V

A standard nominal supply voltage of 5V makes it ideal for widespread use in consumer electronics.

Turn-on Time: 2 us

Rapid turn-on time enhances responsiveness in dynamic applications such as communication interfaces.

Terminal Pitch: 2.54 mm

The standard terminal pitch simplifies soldering and ensures compatibility with a range of circuit boards.

Driver No. of Bits: 4

A 4-bit driver configuration allows for efficient data transfer and control in digital applications.

Interface IC Type: BUFFER OR INVERTER BASED PERIPHERAL DRIVER

This versatile interface enables a wide range of signal conditioning applications, improving system performance.

Turn-off Time: 5 us

Quick turn-off time ensures minimal latency in applications requiring rapid on/off signal transitions.

Output Current Flow Direction: SINK

The capability to sink current is ideal for controlling various loads efficiently in electronic designs.

Technical Specifications

Peripheral Drivers E-L6221AS attributes and parameters. Explore more Peripheral Drivers devices from STMicroelectronics

Specs

Built-in Protections:

TRANSIENT; OVER CURRENT; THERMAL; UNDER VOLTAGE

Driver No. of Bits:

4

JESD-30 Code:

R-XDIP-T16

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Terminals:

16

Output Current Flow Direction:

SINK

Maximum Output Current:

1.8 A

Package Body Material:

UNSPECIFIED

Package Code:

DIP

Package Equivalence Code:

DIP16,.3

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.1 mm

Sub-Category:

Peripheral Drivers

Maximum Supply Voltage:

5.5 V

Minimum Supply Voltage:

4.5 V

Nominal Supply Voltage:

5 V

Surface Mount:

NO

Technology:

BIPOLAR

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Turn-off Time:

5 us

Turn-on Time:

2 us

Trade Compliance

E-L6221AS Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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