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CPL-WB-00C2

STMicroelectronics

CPL-WB-00C2 by STMicroelectronics

CPL-WB-00C2 by STMicroelectronics is a directional coupler designed for RF applications, operating b/w 824 MHz and 2170 MHz. It handles up to 35 dBm input power with a low insertion loss of just 0.2 dB. This component operates reliably in temperatures from -30 °C to 85°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Dan-Mar Components

USA . 5,000 parts In-Stock

1+ parts

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5,000

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Digiode

USA . 4,427 parts In-Stock

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4,427

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Vyrian

USA . 3,047 parts In-Stock

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3,047

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Cyclops Electronics Ltd

UK . 3,000 parts In-Stock

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3,000

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Anansix

USA . 2,805 parts In-Stock

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2,805

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Distributors (Availability)

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IDEA Electronic Components Group

UK . 509 parts In-Stock

1+ parts

$1.460

100+ parts

-

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$1.314

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509

$1.460

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$1.314

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MKK Technologies

India . 2,003 parts In-Stock

1+ parts

$2.746

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2,003

$2.746

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DigiPath Technology Company

USA . 2,003 parts In-Stock

1+ parts

$2.746

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2,003

$2.746

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Native Components

USA . 217 parts In-Stock

1+ parts

$16.185

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217

$16.185

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Northwest PG Solutions

USA . 819 parts In-Stock

1+ parts

$17.804

100+ parts

$16.024

1k+ parts

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819

$17.804

$16.024

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A-Z Elektronik GmbH

Germany . 6,701 parts In-Stock

1+ parts

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6,701

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Alle Elektronik GmbH

Germany . 4,467 parts In-Stock

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4,467

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Kepictronics

USA . 3,500 parts In-Stock

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3,500

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Parana Technologies

USA . 915 parts In-Stock

1+ parts

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$1.746

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915

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$1.746

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Corphita

USA . 494 parts In-Stock

1+ parts

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494

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Overview

Unlock unparalleled performance with the CPL-WB-00C2 from STMicroelectronics, a leader in innovation and quality. This directional coupler excels in RF/microwave applications, offering exceptional reliability and minimal insertion loss. Designed to operate seamlessly between -30 °C and 85°C, it ensures robust functionality in diverse environments. Elevate your technology with this product that enhances signal integrity, providing superior value and benefits for engineers and developers alike.

Feature Benefit Bullets

Maximum Input Power (CW): 35 dBm

With a maximum input power rating of 35 dBm, this coupler ensures reliable performance even under high-power conditions, making it suitable for demanding applications.

Construction: COMPONENT

Being a component-level coupler, this product offers flexibility in system design, allowing integration into various setups without compromising performance.

Maximum Operating Temperature: 85 °C

The ability to operate at temperatures up to 85 °C ensures durability and reliability in harsh environments, making it a robust choice for industrial applications.

Minimum Operating Temperature: -30 °C

With a minimum operating temperature of -30 °C, this coupler can perform efficiently in extreme cold conditions, broadening its usability in diverse climates.

Maximum Insertion Loss: 0.2 dB

A maximum insertion loss of only 0.2 dB indicates high efficiency, ensuring minimal signal degradation which is crucial for maintaining signal integrity in RF systems.

RF or Microwave Device Type: DIRECTIONAL COUPLER

As a directional coupler, it provides valuable signal conditioning capabilities such as signal sampling and isolation, making it ideal for monitoring and testing applications.

Characteristic Impedance: 50 ohm

With a characteristic impedance of 50 ohms, this coupler is compatible with standard RF equipment, facilitating easy integration into existing systems.

Minimum Operating Frequency: 824 MHz

The minimum operating frequency of 824 MHz allows for applications in mobile communication and other RF services, increasing its versatility in deployment.

Maximum Operating Frequency: 2170 MHz

Reaching up to 2170 MHz, this coupler supports a wide range of frequency applications, making it suitable for both commercial and consumer RF solutions.

Technical Specifications

RF/Microwave Couplers CPL-WB-00C2 attributes and parameters. Explore more RF/Microwave Couplers devices from STMicroelectronics

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

35 dBm

Maximum Insertion Loss:

.2 dB

Maximum Operating Frequency:

2170 MHz

Minimum Operating Frequency:

824 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

RF or Microwave Device Type:

Trade Compliance

CPL-WB-00C2 RF & Microwave trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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