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CPL-WB-00D3

STMicroelectronics

CPL-WB-00D3 by STMicroelectronics

STMicroelectronics' CPL-WB-00D3 is a 50 ohm directional coupler with max input power of 35 dBm, insertion loss of 0.2 dB, and operating frequency range from 824 MHz to 2170 MHz. Ideal for RF applications where precise power monitoring and signal distribution are required in temperature range -30 °C to 85°C.

Median Price

$0.190

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 5,000 parts In-Stock

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$0.190

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5,000

$0.190

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Chip1Stop

Japan . 10,000 parts In-Stock

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Verical

USA . 5,000 parts In-Stock

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$0.190

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5,000

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$0.190

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Distributors (In-Stock)

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Digiode

USA . 150 parts In-Stock

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$0.179

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$0.179

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Lantek

USA . 10,545 parts In-Stock

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10,545

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Vyrian

USA . 4,539 parts In-Stock

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Anansix

USA . 936 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,940 parts In-Stock

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$0.169

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3,940

$0.169

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IDEA Electronic Components Group

UK . 1,857 parts In-Stock

1+ parts

$1.355

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$1.220

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1,857

$1.355

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MKK Technologies

India . 774 parts In-Stock

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$2.548

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774

$2.548

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DigiPath Technology Company

USA . 774 parts In-Stock

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$2.548

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774

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AZTECH Wire

Italy . 1,174 parts In-Stock

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$11.740

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Native Components

USA . 75 parts In-Stock

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$22.590

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$22.590

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Northwest PG Solutions

USA . 1,203 parts In-Stock

1+ parts

$24.849

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$22.364

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$24.849

$22.364

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GreenTree Electronics

Israel . 10,545 parts In-Stock

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Perfect Parts

USA . 2,411 parts In-Stock

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Parana Technologies

USA . 512 parts In-Stock

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$1.620

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512

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$1.620

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Overview

Elevate your RF/Microwave coupler game with the CPL-WB-00D3 by STMicroelectronics. Renowned for their high-quality construction and reliable performance, STMicroelectronics delivers cutting-edge technology in the field of RF components. Ideal for applications requiring maximum input power of 35 dBm, this directional coupler offers minimal insertion loss of only 0.2 dB. From telecommunications to wireless networking, this versatile component ensures seamless connectivity and optimal signal transmission. Upgrade to the CPL-WB-00D3 today and experience the difference in quality and performance that STMicroelectronics brings to the table.

Feature Benefit Bullets

Maximum Input Power (CW): 35 dBm

With a high maximum input power capacity of 35 dBm, this coupler can handle high power levels without getting damaged, providing reliable performance in demanding RF/microwave applications.

Construction: COMPONENT

Being a component-based coupler, this product allows for easy integration into existing RF/microwave systems, making it a versatile choice for various setups.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature of 85 °C ensures that this coupler can withstand elevated temperatures without performance degradation, making it suitable for harsh environments.

Minimum Operating Temperature: -30 °C

With a low minimum operating temperature of -30 °C, this coupler can also operate in cold conditions, offering flexibility in terms of deployment locations.

Maximum Insertion Loss: 0.2 dB

The low maximum insertion loss of 0.2 dB ensures minimal signal loss during the coupling process, maintaining signal integrity and efficiency in the RF/microwave system.

RF or Microwave Device Type: DIRECTIONAL COUPLER

Being a directional coupler, this product allows for the monitoring and coupling of RF/microwave signals in a specific direction, enabling precise signal control and measurements.

Characteristic Impedance: 50 ohm

With a standard characteristic impedance of 50 ohms, this coupler can easily interface with various RF/microwave components and systems, ensuring compatibility and reliable signal transfer.

Minimum Operating Frequency: 824 MHz

With a low minimum operating frequency of 824 MHz, this coupler is suitable for a wide range of RF/microwave applications, including cellular and wireless communication systems.

Maximum Operating Frequency: 2170 MHz

With a high maximum operating frequency of 2170 MHz, this coupler can handle high-frequency signals used in modern RF/microwave systems, making it ideal for broadband applications.

Technical Specifications

RF/Microwave Couplers CPL-WB-00D3 attributes and parameters. Explore more RF/Microwave Couplers devices from STMicroelectronics

Specs

Characteristic Impedance:

50 ohm

Construction:

COMPONENT

Maximum Input Power (CW):

35 dBm

Maximum Insertion Loss:

.2 dB

Maximum Operating Frequency:

2170 MHz

Minimum Operating Frequency:

824 MHz

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-30 Cel

RF or Microwave Device Type:

PCN

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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