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74VHCT574ATTR

STMicroelectronics

74VHCT574ATTR by STMicroelectronics

74VHCT574ATTR by STMicroelectronics is an 8-bit bus driver with a 5V supply, featuring a fast propagation delay of just 12 ns. It operates in extreme temperatures from -55 °C to 125°C and supports up to 8A output current. Ideal for military applications, it ensures reliable data transmission in compact designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

ACDS - Activité Composants Distribution Service

France . 7,500 parts In-Stock

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7,500

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Vyrian

USA . 5,104 parts In-Stock

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5,104

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Digiode

USA . 3,378 parts In-Stock

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3,378

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Anansix

USA . 2,878 parts In-Stock

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2,878

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ComSIT Distribution GmbH

Germany . 2,500 parts In-Stock

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2,500

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ComSIT USA

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

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Andel Nordic

Denmark . 1,503 parts In-Stock

1+ parts

$1.866

100+ parts

-

1k+ parts

$1.791

10k+ parts

$1.791

1,503

$1.866

-

$1.791

$1.791

AZTECH Wire

Italy . 98 parts In-Stock

1+ parts

$16.780

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98

$16.780

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IDEA Electronic Components Group

UK . 1,834 parts In-Stock

1+ parts

$17.446

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-

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$15.701

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1,834

$17.446

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$15.701

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MKK Technologies

India . 1,168 parts In-Stock

1+ parts

$32.806

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1,168

$32.806

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DigiPath Technology Company

USA . 1,168 parts In-Stock

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$32.806

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1,168

$32.806

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QUARKTWIN TECHNOLOGY LTD

USA . 16,819 parts In-Stock

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16,819

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Perfect Parts

USA . 16,800 parts In-Stock

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16,800

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Cyclops Electronics Ltd (Excess)

UK . 7,500 parts In-Stock

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7,500

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Glotronic Ltd.

UK . 6,000 parts In-Stock

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6,000

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Microchip USA

USA . 4,737 parts In-Stock

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Corphita

USA . 4,473 parts In-Stock

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4,473

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Parana Technologies

USA . 1,220 parts In-Stock

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$20.859

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1,220

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$20.859

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Native Components

USA . 229 parts In-Stock

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229

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Northwest PG Solutions

USA . 24 parts In-Stock

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24

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Overview

Unlock superior performance with the 74VHCT574ATTR from STMicroelectronics—the trusted name in innovative semiconductor solutions. This robust bus driver excels in high-speed applications, providing reliable data transmission while maintaining low power consumption. Its compact design is perfect for tight spaces, ensuring seamless integration into your projects. Choose STMicroelectronics for unmatched quality and elevate your designs with this cutting-edge component that delivers efficiency and reliability where it matters most!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and resistance to environmental factors, making it suitable for various applications.

Surface Mount: YES

Surface mount technology allows for compact designs and efficient use of PCB space, making it ideal for modern electronics.

Package Shape: RECTANGULAR

A rectangular shape facilitates efficient layout on printed circuit boards (PCBs), contributing to better thermal management and routing.

No. of Bits: 8

An 8-bit configuration supports a diverse range of digital signaling applications, providing flexibility in design.

Nominal Supply Voltage / Vsup: 5 V

Operating at a standard 5V supply makes it compatible with a wide variety of digital logic systems.

Load Capacitance (CL): 15 pF

Low load capacitance enables faster signal transitions, contributing to improved performance in high-speed applications.

Power Supplies (V): 5

Powering the device with a consistent voltage of 5V enhances reliability in its operation.

No. of Terminals: 20

With 20 terminals, it allows for extensive connectivity options, suitable for complex circuit implementations.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The thin profile design is ideal for space-constrained applications, enabling compact product designs.

Maximum I (ol): 8 Amp

A maximum output current of 8 Amps supports high-power applications, making this product suitable for demanding tasks.

Propagation Delay (tpd): 12 ns

A low propagation delay enhances signal speed, making it suitable for high-speed communication.

Maximum Operating Temperature: 125 °C

Ability to operate at high temperatures makes this product reliable in harsh environments.

Output Characteristics: 3-STATE

3-state outputs allow multiple devices to connect and communicate on the same bus, optimizing design flexibility.

Trigger Type: POSITIVE EDGE

Positive edge triggering provides precise control in timing-sensitive applications.

Minimum Operating Temperature: -55 °C

With a wide operating temperature range, this product can perform reliably in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish ensures excellent conductivity and resistance to corrosion, enhancing longevity.

Terminal Position: DUAL

Dual terminal positions provide flexibility for various PCB layouts, allowing for optimal design integration.

No. of Ports: 2

Having two ports allows for dual communication paths, enhancing functionality and versatility in circuit designs.

Maximum Seated Height: 1.2 mm

A low seated height supports compact assembly, minimizing height on PCBs for thinner devices.

Width: 4.4 mm

A narrow width helps in optimizing PCB space while facilitating tight layouts.

Output Polarity: TRUE

True output polarity ensures clear and unambiguous signaling for digital circuits.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum operating voltage of 4.5V allows for flexibility in power supply options.

Length: 6.5 mm

Compact length makes it suitable for applications where space is at a premium.

Temperature Grade: MILITARY

Military-grade specification ensures reliability and robustness, meeting rigorous operational standards.

Maximum Frequency At Nominal Supply: 80 MHz

High operating frequency supports fast data transmission, ideal for high-performance applications.

Technology: CMOS

CMOS technology enables low power consumption and high noise immunity, contributing to energy-efficient designs.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and production processes, ensuring reliable connections.

Packing Method: TR

Through-hole packing method simplifies handling and assembly in manufacturing environments.

Terminal Pitch: 0.65 mm

A smaller terminal pitch allows for more compact designs, accommodating more functionality in limited space.

Maximum Supply Voltage (Vsup): 5.5 V

Flexibility in supply voltage allows for wider compatibility with different power supply systems.

Technical Specifications

Bus Driver & Transceivers 74VHCT574ATTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

80000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay (tpd):

12 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74VHCT574ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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