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74VHCT32AMTR

STMicroelectronics

74VHCT32AMTR by STMicroelectronics

74VHCT32AMTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 9 ns, operating at a nominal voltage of 5V. It features four functions and supports dual inputs in a compact SO package. Ideal for high-speed applications, it operates b/w -55 °C to 125°C.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 4,496 parts In-Stock

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Digiode

USA . 4,032 parts In-Stock

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Anansix

USA . 1,631 parts In-Stock

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Native Components

USA . 417 parts In-Stock

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$8.171

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Northwest PG Solutions

USA . 1,703 parts In-Stock

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$8.988

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$8.089

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$10.338

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$10.234

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$9.821

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50

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IDEA Electronic Components Group

UK . 645 parts In-Stock

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$21.284

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$19.156

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AZTECH Wire

Italy . 379 parts In-Stock

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$21.980

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Corohmni

South Africa . 62 parts In-Stock

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$28.109

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MKK Technologies

India . 367 parts In-Stock

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$40.024

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DigiPath Technology Company

USA . 367 parts In-Stock

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$40.024

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Microchip USA

USA . 5,496 parts In-Stock

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Kepictronics

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Parana Technologies

USA . 1,309 parts In-Stock

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Corphita

USA . 507 parts In-Stock

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Overview

Unlock unparalleled performance with the 74VHCT32AMTR from STMicroelectronics, a leader in high-quality semiconductor solutions. This versatile logic gate offers rapid switching for various applications, ensuring efficiency and reliability in your designs. With exceptional temperature resilience and robust construction, it guarantees longevity and peak performance. Elevate your projects with cutting-edge technology that delivers both power and precision, maximizing your innovation potential!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and lightweight construction, making it suitable for various applications.

Propagation Delay At Nominal Supply: 9 ns

A low propagation delay of 9 ns indicates fast switching speeds, which enhances the performance of digital circuits requiring quick response times.

Surface Mount: YES

Being surface mount technology (SMT) compatible allows for compact designs and easier integration into modern circuit boards.

No. of Functions: 4

Having four functions in one package offers versatility and reduces the number of components needed, simplifying design and assembly.

No. of Inputs: 2

With two inputs, this product can handle a variety of logical conditions, making it adaptable for many logic circuit applications.

Package Shape: RECTANGULAR

The rectangular shape favors straightforward placement in circuit layouts, optimizing board space and enhancing connectivity.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V makes it compatible with standard digital logic levels, ensuring easy integration into existing systems.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for stable operation while interfacing with other components, ensuring reliable performance.

Power Supplies (V): 5

Requiring a 5V supply ensures compatibility with common power systems and easy sourcing of necessary voltages.

No. of Terminals: 14

The 14-terminal configuration allows for various interconnections, making it suitable for complex logic designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style is ideal for applications where space is limited, such as portable devices.

Maximum I (ol): 8 Amp

A maximum output current of 8 Amps allows it to drive larger loads, which is beneficial for power applications.

Propagation Delay (tpd): 9 ns

The consistency of 9 ns propagation delay across parameters indicates reliable performance and predictability in operation.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, it can sustain high-temperature environments, making it suitable for industrial applications.

Minimum Operating Temperature: -55 °C

The ability to function at temperatures as low as -55 °C ensures reliability in extreme conditions, which is crucial for military or aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish helps to ensure good conductivity and resistance to oxidation, enhancing the longevity and performance of connections.

Terminal Position: DUAL

Dual-terminal positioning enhances flexibility in layout and ease of soldering during assembly.

Maximum Seated Height: 1.75 mm

A low maximum seated height of 1.75 mm contributes to the slim profile of the device, optimizing space in compact designs.

Width: 3.9 mm

The width of 3.9 mm allows for efficient board utilization without compromising on performance.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V provides flexibility in power supply designs while ensuring reliable operation.

Maximum Time At Peak Reflow Temperature (s): 40

A maximum time of 40 seconds at peak reflow temperature ensures proper soldering without damaging the device.

Peak Reflow Temperature °C: 260

The capability to withstand up to 260 °C during reflow soldering makes this component suitable for modern assembly processes.

Length: 8.65 mm

The compact length of 8.65 mm facilitates high-density designs while maintaining functional performance.

Temperature Grade: MILITARY

The military-grade specification assures robust performance and reliability under harsh conditions, vital for defense applications.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it ideal for battery-operated devices.

Terminal Form: GULL WING

Gull wing terminals provide excellent soldering surface area, enhancing the reliability of electrical connections.

Packing Method: TR

Taking advantage of tape and reel (TR) packing facilitates automated handling and ease of assembly in high-volume manufacturing.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm offers a balance between density and ease of soldering, making it user-friendly for designers.

Maximum Supply Voltage (Vsup): 5.5 V

The upper limit for supply voltage at 5.5V gives flexibility in choosing the operating voltage within standard ranges.

Technical Specifications

Logic Gates 74VHCT32AMTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74VHCT32AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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