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74VHCT16373ATTR

STMicroelectronics

74VHCT16373ATTR by STMicroelectronics

74VHCT16373ATTR by STMicroelectronics is a CMOS bus driver with an 8-bit capacity, featuring a fast propagation delay of 10.5 ns and operating b/w -55 °C to 125 °C. It supports dual ports and has a compact SO package for efficient space utilization. Ideal for military applications requiring reliable data transmission.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 3,733 parts In-Stock

1+ parts

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3,733

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Digiode

USA . 3,073 parts In-Stock

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3,073

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Anansix

USA . 626 parts In-Stock

1+ parts

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626

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Andel Nordic

Denmark . 5,214 parts In-Stock

1+ parts

$1.790

100+ parts

-

1k+ parts

$1.719

10k+ parts

$1.719

5,214

$1.790

-

$1.719

$1.719

Native Components

USA . 989 parts In-Stock

1+ parts

$17.232

100+ parts

-

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989

$17.232

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AZTECH Wire

Italy . 935 parts In-Stock

1+ parts

$18.880

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935

$18.880

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Northwest PG Solutions

USA . 1,936 parts In-Stock

1+ parts

$18.955

100+ parts

$17.060

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-

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1,936

$18.955

$17.060

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IDEA Electronic Components Group

UK . 1,480 parts In-Stock

1+ parts

$22.692

100+ parts

-

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$20.423

10k+ parts

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1,480

$22.692

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$20.423

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MKK Technologies

India . 1,452 parts In-Stock

1+ parts

$42.670

100+ parts

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1,452

$42.670

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DigiPath Technology Company

USA . 1,452 parts In-Stock

1+ parts

$42.670

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1,452

$42.670

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Microchip USA

USA . 155 parts In-Stock

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$47.132

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155

$47.132

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Component Stockers USA

USA . 710 parts In-Stock

1+ parts

$99.990

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710

$99.990

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Corphita

USA . 2,491 parts In-Stock

1+ parts

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2,491

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Parana Technologies

USA . 2,038 parts In-Stock

1+ parts

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$27.132

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2,038

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$27.132

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Overview

Unlock unparalleled efficiency with the 74VHCT16373ATTR from STMicroelectronics, a leader in cutting-edge semiconductor solutions. This robust bus driver and transceiver is designed for high-speed performance in demanding applications, ensuring reliable data transfer while maintaining optimal power efficiency. Experience seamless integration in communication systems, automotive electronics, and industrial controls, all backed by ST’s commitment to quality and innovation. Elevate your projects and drive success with this versatile component!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable plastic/epoxy material ensures long-lasting performance in various environments.

Propagation Delay At Nominal Supply: 10.5 ns

Fast propagation delay enhances the speed of data transfer, making it suitable for high-frequency applications.

Surface Mount: YES

Surface mount design allows for easier installation and better space efficiency on PCBs.

No. of Functions: 2

Dual function capability provides versatility for multiple applications in a single component.

Package Shape: RECTANGULAR

Rectangular package shape optimizes PCB layout and maximizes available space.

No. of Bits: 8

8-bit width supports a variety of data communication needs, suitable for parallel data transmission.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply makes it compatible with most digital systems.

Load Capacitance (CL): 50 pF

Low load capacitance supports higher data rates and improves signal integrity.

Power Supplies (V): 5

Single power supply requirement simplifies circuit design and reduces component count.

No. of Terminals: 48

48 terminals provide ample connections for complex circuitry and increased functionality.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Thin profile and shrink pitch facilitate compact designs for space-constrained applications.

Maximum I (ol): 8 Amp

High maximum output current allows for powering of multiple devices or heavy loads.

Propagation Delay (tpd): 10.5 ns

Consistent propagation delay ensures predictable performance in timing-critical applications.

Maximum Operating Temperature: 125 °C

High operating temperature rating ensures reliability in demanding environments.

Output Characteristics: 3-STATE

3-state output allows for advanced bus configurations and shared data lines.

Minimum Operating Temperature: -55 °C

Wide temperature range makes it suitable for use in harsh conditions, including extreme cold.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish provides excellent conductivity and corrosion resistance.

Terminal Position: DUAL

Dual terminal positioning enhances flexibility in PCB design and layout.

No. of Ports: 2

Two ports facilitate communication between multiple devices, enhancing system design options.

Maximum Seated Height: 1.2 mm

Low seated height allows for ultra-thin applications without compromising performance.

Width: 6.1 mm

Compact width allows for integration in tight spaces while maintaining functionality.

Output Polarity: TRUE

True output polarity ensures compatibility with a wide range of digital systems.

Minimum Supply Voltage (Vsup): 4.5 V

Flexibility in supply voltage allows for operation across a range of systems and conditions.

Length: 12.5 mm

Compact length optimizes space on PCB while maintaining performance reliability.

Temperature Grade: MILITARY

Military-grade specifications offer assurance of high reliability and durability in critical applications.

Technology: CMOS

CMOS technology allows for low power consumption while maintaining high performance.

Terminal Form: GULL WING

Gull wing terminal form enhances soldering reliability and stability on PCBs.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for higher density layouts and more efficient use of PCB space.

Maximum Supply Voltage (Vsup): 5.5 V

Tolerance for higher supply voltage ensures robustness and compatibility with different systems.

Technical Specifications

Bus Driver & Transceivers 74VHCT16373ATTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G48

JESD-609 Code:

e4

Length:

12.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

48

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP48,.3,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

10.5 ns

Propagation Delay (tpd):

10.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

6.1 mm

Trade Compliance

74VHCT16373ATTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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