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74VHCT125AMTR

STMicroelectronics

74VHCT125AMTR by STMicroelectronics

74VHCT125AMTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8.5 ns, supporting up to 8 A output current. It operates b/w -55 °C and 125°C, making it ideal for military applications. This compact device features four functions in a small outline package.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,650 parts In-Stock

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Digiode

USA . 3,515 parts In-Stock

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Anansix

USA . 538 parts In-Stock

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Tectiva GmbH

Germany . 148 parts In-Stock

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Andel Nordic

Denmark . 66 parts In-Stock

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$6.108

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$5.864

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$5.864

66

$6.108

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$5.864

AZTECH Wire

Italy . 795 parts In-Stock

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$16.730

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$16.730

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IDEA Electronic Components Group

UK . 969 parts In-Stock

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$18.335

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$16.501

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Microchip USA

USA . 333 parts In-Stock

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$30.666

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MKK Technologies

India . 1,039 parts In-Stock

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$34.477

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DigiPath Technology Company

USA . 1,039 parts In-Stock

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$34.477

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$34.477

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Corphita

USA . 3,804 parts In-Stock

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Northwest PG Solutions

USA . 2,108 parts In-Stock

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Parana Technologies

USA . 2,029 parts In-Stock

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$21.922

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Native Components

USA . 554 parts In-Stock

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Overview

Elevate your designs with the 74VHCT125AMTR from STMicroelectronics—a premier solution in bus drivers and transceivers. Renowned for their reliability and innovation, STMicroelectronics ensures this component delivers unmatched performance and efficiency, making it perfect for a multitude of applications, from automotive to industrial automation. Experience reduced delays and enhanced durability, all while benefiting from the superior quality and support of a trusted manufacturer. Transform your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy ensures durability and reliability in various applications.

Propagation Delay At Nominal Supply: 8.5 ns

A low propagation delay facilitates fast signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for easy integration into modernPCB designs, saving space and improving performance.

No. of Functions: 4

Multiple functions within a single device increase design flexibility and reduce the need for extra components.

Package Shape: RECTANGULAR

The rectangular package shape optimizes board layout and can enhance thermal management.

Nominal Supply Voltage / Vsup (V): 5

A widely accepted supply voltage makes it compatible with a variety of existing systems.

Load Capacitance (CL): 50 pF

Low load capacitance ensures faster operation and reduced power consumption, ideal for energy-efficient designs.

Power Supplies (V): 5

Designed for standard power supplies, ensuring easy integration with common electronics.

No. of Terminals: 14

With 14 terminals, it offers ample connection options for complex circuitry.

Package Style (Meter): SMALL OUTLINE

A small outline design minimizes space usage and fits well in compact applications.

Maximum I (ol): 8 Amp

High output current capability allows for driving substantial loads, increasing design flexibility.

Propagation Delay (tpd): 8.5 ns

Matching the nominal propagation delay, this ensures consistent performance across operating conditions.

Maximum Operating Temperature: 125 °C

High operating temperature tolerance makes it suitable for use in demanding environments.

Output Characteristics: 3-STATE

3-state output capability enhances system functionality, enabling better control in multi-device applications.

Minimum Operating Temperature: -55 °C

Suitable for extreme conditions, making it a reliable choice for military and industrial applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish ensures excellent conductivity and resistance to corrosion, improving longevity.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible mounting options and improves integration in various layouts.

No. of Ports: 2

Two ports allow for easy data routing and connection, enhancing the versatility of the device.

Maximum Seated Height: 1.75 mm

Low seated height ensures compatibility with slim profile PCB designs.

Width: 3.9 mm

Compact width allows for high-density circuit designs, making it ideal for space-critical applications.

Output Polarity: TRUE

Positive output polarity simplifies design choices in logic-level interfacing.

Minimum Supply Voltage (Vsup): 4.5 V

Flexibility in supply voltage allows for broader compatibility with varied systems.

Maximum Time At Peak Reflow Temperature (s): 40

Extended peak reflow time ensures reliable solder connections during manufacturing processes.

Peak Reflow Temperature °C: 260

High reflow temperature tolerance enables compatibility with modern soldering techniques, ensuring robust assembly.

Length: 8.65 mm

Compact length contributes to efficient space utilization in circuit boards.

Temperature Grade: MILITARY

Military-grade components guarantee performance in harsh conditions, ensuring reliability in critical applications.

Technology: CMOS

CMOS technology provides low power consumption while maintaining high-speed operation, making it energy efficient.

Terminal Form: GULL WING

Gull wing terminals facilitate easy soldering and improve mechanical stability on PCBs.

Packing Method: TR

Tape and reel packaging improves handling and automates assembly processes in manufacturing.

Terminal Pitch: 1.27 mm

Standard terminal pitch enhances compatibility with various PCB designs and reduces layout complexity.

Control Type: ENABLE LOW

Low active control enhances efficiency and simplifies the logic design for system functions.

Maximum Supply Voltage (Vsup): 5.5 V

A flexible maximum supply voltage allows for better design adaptability in mixed-signal applications.

Maximum Power Supply Current (ICC): 1.5 mA

Low power supply current helps to minimize energy usage, ideal for battery-powered systems.

Technical Specifications

Bus Driver & Transceivers 74VHCT125AMTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

1

No. of Functions:

4

No. of Ports:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Maximum Power Supply Current (ICC):

1.5 mA

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

8.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74VHCT125AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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