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74VHCT08AMTR

STMicroelectronics

74VHCT08AMTR by STMicroelectronics

74VHCT08AMTR from STMicroelectronics is a CMOS logic gate with a propagation delay of just 9 ns, operating at a nominal voltage of 5V. It features 4 functions and supports dual inputs in a compact SO package. Ideal for military applications, it withstands temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 5,336 parts In-Stock

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Digiode

USA . 3,114 parts In-Stock

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Anansix

USA . 1,082 parts In-Stock

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Microfarads

USA . 25 parts In-Stock

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Microchip USA

USA . 294 parts In-Stock

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$0.498

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294

$0.498

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IDEA Electronic Components Group

UK . 774 parts In-Stock

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$10.127

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$9.115

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774

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AZTECH Wire

Italy . 766 parts In-Stock

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$14.260

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MKK Technologies

India . 1,608 parts In-Stock

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$19.044

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$19.044

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DigiPath Technology Company

USA . 1,608 parts In-Stock

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$19.044

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$19.044

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Component Stockers USA

USA . 209 parts In-Stock

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$99.990

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Native Components

USA . 112 parts In-Stock

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$180.110

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$172.906

112

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$172.906

Northwest PG Solutions

USA . 358 parts In-Stock

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$198.121

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Perfect Parts

USA . 3,754 parts In-Stock

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Corphita

USA . 3,533 parts In-Stock

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Parana Technologies

USA . 37 parts In-Stock

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$12.109

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Overview

Unlock exceptional performance with the 74VHCT08AMTR from STMicroelectronics, a trusted leader in semiconductor innovation. This dual-input logic gate enhances your designs with rapid propagation delay and robust temperature resilience, ensuring reliability in various applications—from automotive systems to industrial automation. Experience the perfect blend of quality and efficiency that elevates your projects while optimizing power consumption—your gateway to smarter solutions!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package material ensures durability and lightweight design, making it suitable for various applications.

Propagation Delay At Nominal Supply: 9 ns

A propagation delay of just 9 ns allows for high-speed operation, making this logic gate ideal for time-sensitive electronic applications.

Surface Mount: YES

Surface mount technology enables efficient space-saving in PCB designs, enhancing overall circuit density.

No. of Functions: 4

With 4 functions, this logic gate offers versatility, allowing for multiple logical operations within a single component.

No. of Inputs: 2

Having 2 inputs makes it compatible with various configurations and easy to integrate into most logic circuits.

Package Shape: RECTANGULAR

The rectangular shape allows for easy layout and design in compact spaces, improving manufacturing efficiency.

Nominal Supply Voltage / Vsup (V): 5

A nominal supply voltage of 5 V is standard in many digital circuits, ensuring compatibility with widely used components.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF is favorable for performance, allowing for faster signal transitions and reduced power consumption.

Power Supplies (V): 5

This product can operate consistently on a standard 5V power supply, making it easy to integrate into common electronic systems.

No. of Terminals: 14

With 14 terminals, the design accommodates multiple input/output functions, providing flexibility for complex circuit designs.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint, enabling compact designs in densely packed circuits.

Maximum I (ol): 8 Amp

A maximum output current of 8 Amps allows for substantial load driving capability, suitable for high-power applications.

Propagation Delay (tpd): 9 ns

A consistent propagation delay of 9 ns ensures reliability and performance in high-speed digital applications.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this product can function reliably in high-heat environments, enhancing its versatility.

Minimum Operating Temperature: -55 °C

The ability to operate at temperatures as low as -55 °C makes this logic gate suitable for extreme conditions, such as aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The high-quality terminal finish ensures excellent conductivity and resistance to corrosion, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for straightforward PCB design and easy integration into existing systems.

Maximum Seated Height: 1.75 mm

A maximum seated height of 1.75 mm supports low-profile designs, contributing to compact electronic assemblies.

Width: 3.9 mm

A width of 3.9 mm is ideal for making effective use of space in tight layouts, supporting modern miniaturization trends.

Minimum Supply Voltage (Vsup): 4.5 V

The ability to operate down to 4.5 V ensures compatibility with a broad range of digital circuit designs.

Maximum Time At Peak Reflow Temperature (s): 40

Supports a peak reflow temperature durability of 40 seconds, ensuring robustness during assembly processes.

Peak Reflow Temperature °C: 260

Ability to withstand a peak reflow temperature of 260 °C guarantees that this component can be soldered using modern techniques without damage.

Length: 8.65 mm

A moderate length of 8.65 mm strikes a balance between functionality and compact design, fitting well into various layouts.

Temperature Grade: MILITARY

MILITARY grade assurance means this logic gate meets rigorous reliability standards, making it suitable for critical applications.

Technology: CMOS

CMOS technology offers lower power consumption and higher efficiency, contributing to longer battery life in portable devices.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and reduces the risk of damage, promoting reliability in connections.

Packing Method: TR

Tape and reel (TR) packing allows for automated assembly processes, enhancing manufacturing efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm is suitable for standard PCB designs, making integration easier and cost-effective.

Maximum Supply Voltage (Vsup): 5.5 V

Capable of top supply voltage up to 5.5 V, providing flexibility in diverse circuit scenarios.

Technical Specifications

Logic Gates 74VHCT08AMTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHCT/VHCT

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

8.65 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

5

Propagation Delay At Nominal Supply:

9 ns

Propagation Delay (tpd):

9 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.75 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

3.9 mm

Trade Compliance

74VHCT08AMTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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