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74VHC86TTR

STMicroelectronics

74VHC86TTR by STMicroelectronics

74VHC86TTR by STMicroelectronics is a CMOS logic gate with a propagation delay of just 10 ns, operating b/w 2-5.5 V. It features four functions and two inputs in a compact 14-terminal package, ideal for high-speed applications. Its robust design supports extreme temperatures from -55 °C to 125°C.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 7,771 parts In-Stock

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Anansix

USA . 847 parts In-Stock

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Digiode

USA . 460 parts In-Stock

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Native Components

USA . 507 parts In-Stock

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$0.205

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$0.196

507

$0.205

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$0.196

Northwest PG Solutions

USA . 139 parts In-Stock

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$0.225

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$0.198

139

$0.225

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$0.198

AZTECH Wire

Italy . 51 parts In-Stock

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$16.170

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$16.170

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Microchip USA

USA . 448 parts In-Stock

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$18.725

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$18.725

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IDEA Electronic Components Group

UK . 1,181 parts In-Stock

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$24.330

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$21.897

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Ampacity Inc.

Singapore . 1,343 parts In-Stock

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$44.000

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MKK Technologies

India . 320 parts In-Stock

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$45.752

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DigiPath Technology Company

USA . 320 parts In-Stock

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$45.752

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Perfect Parts

USA . 4,413 parts In-Stock

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Corphita

USA . 4,003 parts In-Stock

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Parana Technologies

USA . 2,043 parts In-Stock

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$29.091

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Overview

Unlock the power of precision with the 74VHC86TTR from STMicroelectronics, your go-to solution for reliable logic gates. Engineered with superior quality and backed by a trusted manufacturer, this versatile component ensures fast propagation delays and operates seamlessly in various environments—from automotive systems to consumer electronics. Enhance your designs with its compact footprint, energy efficiency, and robust performance, delivering unmatched value and reliability for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures a lightweight and cost-effective product, ideal for various applications.

Propagation Delay At Nominal Supply: 10 ns

A low propagation delay means faster signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for more compact designs and improves assembly efficiency.

No. of Functions: 4

Having multiple functions in one package provides flexibility and reduces the need for additional components.

No. of Inputs: 2

Two inputs allow for versatile logic operations, making it adaptable for various circuit designs.

Package Shape: RECTANGULAR

The rectangular shape enables efficient space usage on PCB layouts.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a nominal voltage of 3.3 V makes it ideal for modern electronic applications requiring low power.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for compatibility with a wide range of devices, ensuring reliable operation.

Power Supplies (V): 2/5.5

The versatility in power supply range accommodates diverse application needs.

No. of Terminals: 14

Having 14 terminals provides extensive connectivity options for integration into circuit designs.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact and thin profile allows for higher component density on PCBs, maximizing space utilization.

Maximum I (ol): 8 Amp

A high output current capability of 8 Amps supports applications requiring significant drive strength.

Propagation Delay (tpd): 16.5 ns

Although higher than the nominal delay, it still maintains a fast response suitable for many applications.

Maximum Operating Temperature: 125 °C

The ability to operate in high temperatures makes it reliable for automotive and industrial applications.

Minimum Operating Temperature: -55 °C

This wide temperature range increases the device's applicability in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

The high-quality terminal finish enhances solderability and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

Dual terminal positioning facilitates flexible layout designs for various applications.

Maximum Seated Height: 1.2 mm

Low seated height supports compact designs and minimizes overall assembly height.

Width: 4.4 mm

A narrow width allows for smaller PCB designs, accommodating more components in limited spaces.

Minimum Supply Voltage (Vsup): 2 V

With a lower voltage threshold, this product can operate with a variety of power sources.

Length: 5 mm

Compact length contributes to reduced footprint on PCBs, ideal for size-constrained applications.

Temperature Grade: MILITARY

Designed to meet military specifications ensures reliability in demanding conditions.

Technology: CMOS

CMOS technology offers low power consumption while maintaining high-speed functionality.

Terminal Form: GULL WING

Gull wing terminals provide excellent mechanical stability and ease of soldering.

Packing Method: TR

Tape and reel packing ensures efficient handling and placement during automated assembly.

Terminal Pitch: 0.65 mm

A small terminal pitch allows for high-density layouts, essential for modern microelectronics.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum voltage rating enhances compatibility with a variety of devices and applications.

Technical Specifications

Logic Gates 74VHC86TTR attributes and parameters. Explore more Logic Gates devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Length:

5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Functions:

4

No. of Inputs:

2

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

10 ns

Propagation Delay (tpd):

16.5 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

1.2 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Width:

4.4 mm

Trade Compliance

74VHC86TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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