Loading...

74VHC574TTR

STMicroelectronics

74VHC574TTR by STMicroelectronics

74VHC574TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 12 ns, operating at a nominal voltage of 3.3 V. It features a compact SO package and supports high-speed applications up to 75 MHz. Ideal for military-grade electronics, it ensures reliable performance in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip Stock

USA . 30,743 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

30,743

-

-

-

-

Pegasus Components GmbH

Germany . 5,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,000

-

-

-

-

Vyrian

USA . 4,082 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,082

-

-

-

-

Digiode

USA . 2,602 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,602

-

-

-

-

Anansix

USA . 434 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

434

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 618 parts In-Stock

1+ parts

$0.479

100+ parts

-

1k+ parts

-

10k+ parts

$0.460

618

$0.479

-

-

$0.460

Northwest PG Solutions

USA . 637 parts In-Stock

1+ parts

$0.527

100+ parts

-

1k+ parts

-

10k+ parts

$0.465

637

$0.527

-

-

$0.465

Andel Nordic

Denmark . 549 parts In-Stock

1+ parts

$2.765

100+ parts

-

1k+ parts

$2.654

10k+ parts

$2.654

549

$2.765

-

$2.654

$2.654

AZTECH Wire

Italy . 534 parts In-Stock

1+ parts

$8.550

100+ parts

-

1k+ parts

-

10k+ parts

-

534

$8.550

-

-

-

IDEA Electronic Components Group

UK . 1,519 parts In-Stock

1+ parts

$29.049

100+ parts

-

1k+ parts

$26.144

10k+ parts

-

1,519

$29.049

-

$26.144

-

MKK Technologies

India . 1,413 parts In-Stock

1+ parts

$54.625

100+ parts

-

1k+ parts

-

10k+ parts

-

1,413

$54.625

-

-

-

DigiPath Technology Company

USA . 1,413 parts In-Stock

1+ parts

$54.625

100+ parts

-

1k+ parts

-

10k+ parts

-

1,413

$54.625

-

-

-

Component Stockers USA

USA . 569 parts In-Stock

1+ parts

$99.990

100+ parts

-

1k+ parts

-

10k+ parts

-

569

$99.990

-

-

-

QUARKTWIN TECHNOLOGY LTD

USA . 28,806 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

28,806

-

-

-

-

Kepictronics

USA . 27,243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,243

-

-

-

-

Metaverse IC Inc.

Canada . 27,243 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

27,243

-

-

-

-

Perfect Parts

USA . 4,489 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,489

-

-

-

-

Microchip USA

USA . 4,424 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,424

-

-

-

-

Corphita

USA . 235 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

235

-

-

-

-

Parana Technologies

USA . 100 parts In-Stock

1+ parts

-

100+ parts

$34.732

1k+ parts

-

10k+ parts

-

100

-

$34.732

-

-

Overview

Elevate your designs with the 74VHC574TTR from STMicroelectronics, a trusted leader in innovative electronics. This high-performance bus driver seamlessly integrates into diverse applications, ensuring rapid data transfer with minimal power consumption. Its robust construction and compact design enable effortless integration into tight spaces, delivering reliability even in demanding environments. Experience superior quality and performance that enhances your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body ensures durability and resistance to environmental factors, making it suitable for various applications.

Propagation Delay At Nominal Supply: 12 ns

With a low propagation delay, this product allows for high-speed data transmission, enhancing the overall performance of the system.

Surface Mount: YES

The surface mount design enables easier integration into modern PCB layouts, saving space and improving assembly efficiency.

Package Shape: RECTANGULAR

The rectangular package shape optimizes space utilization on the circuit board while allowing for efficient heat dissipation.

No. of Bits: 8

Being an 8-bit device, it can handle a significant amount of data simultaneously, ideal for complex digital applications.

Nominal Supply Voltage / Vsup: 3.3 V

Operating at a low nominal supply voltage reduces power consumption, contributing to energy efficiency in embedded systems.

Load Capacitance (CL): 50 pF

The specified load capacitance supports reliable signal integrity and performance when interfacing with other components.

Power Supplies (V): 2/5.5 V

Support for a range of supply voltages makes this product versatile and compatible with various circuit designs.

No. of Terminals: 20

With 20 terminals, this device offers multiple connections, facilitating complex interaction within circuits.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

The small outline and thin profile are perfect for compact designs, allowing integration into space-constrained applications.

Maximum I (ol): 8 Amp

Having a maximum output current of 8 Amp allows for driving higher loads, making it suitable for robust applications.

Propagation Delay (tpd): 19 ns

A controlled propagation delay of 19 ns ensures that timing requirements are met in high-speed data environments.

Maximum Operating Temperature: 125 °C

A high operating temperature range ensures reliability in demanding conditions, making it suitable for industrial applications.

Output Characteristics: 3-STATE

3-state output characteristics enable shared bus communication, allowing multiple devices to connect and communicate efficiently.

Trigger Type: POSITIVE EDGE

The positive edge trigger increases design flexibility and responsiveness in digital circuits.

Minimum Operating Temperature: -55 °C

The extended temperature range provides assurance that this product will perform reliably in extreme environments.

Terminal Finish: NICKEL PALLADIUM GOLD

High-quality terminal finish improves connectivity and corrosion resistance, ensuring longevity in electrical performance.

Terminal Position: DUAL

Dual terminal positions facilitate easy access for connections, enhancing the design adaptability.

No. of Ports: 2

Having 2 ports allows for flexible configuration in multi-device applications, fostering enhanced connectivity.

Maximum Seated Height: 1.2 mm

A low seated height contributes to space efficiency in design, making the component suitable for compact assemblies.

Width: 4.4 mm

A compact width ensures that the component can fit comfortably on tight layout boards, optimizing design efficiency.

Output Polarity: TRUE

The true output polarity ensures compatibility with a wide range of applications, allowing straightforward design integration.

Minimum Supply Voltage (Vsup): 2 V

A low minimum supply voltage enables operation in low-power designs, enhancing energy savings in battery-operated devices.

Length: 6.5 mm

A compact length allows for easy integration into small form-factor devices, making it ideal for portable applications.

Temperature Grade: MILITARY

The military-grade specification ensures reliability and robustness for applications in harsh environments, such as aerospace and defense.

Maximum Frequency At Nominal Supply: 75 MHz

A high maximum operating frequency allows for rapid data exchange and efficient performance in high-speed applications.

Technology: CMOS

Utilizing CMOS technology leads to lower power consumption and higher integration capabilities, beneficial for modern electronic designs.

Terminal Form: GULL WING

Gull wing terminals facilitate effective soldering in automated processes, ensuring strong connections and reliability.

Terminal Pitch: 0.65 mm

A 0.65 mm terminal pitch allows for high-density interconnections, suitable for modern compact PCB designs.

Maximum Supply Voltage (Vsup): 5.5 V

The upper limit of the supply voltage ensures compatibility with standard logic levels, providing flexibility in power management.

Technical Specifications

Bus Driver & Transceivers 74VHC574TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

75000000 Hz

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

12 ns

Propagation Delay (tpd):

19 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Trigger Type:

POSITIVE EDGE

Width:

4.4 mm

Trade Compliance

74VHC574TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20