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74VHC273MTR

STMicroelectronics

74VHC273MTR by STMicroelectronics

74VHC273MTR by STMicroelectronics is an 8-bit positive edge-triggered latch with a propagation delay of 12.5 ns and operates at a supply voltage of 3.3 V. It features surface mount packaging and supports high-speed applications up to 70 MHz. Ideal for military-grade electronics, it ensures reliable performance in extreme temperatures from -55 °C to 125°C.

Median Price

$11.957

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 350 parts In-Stock

1+ parts

$11.957

100+ parts

$10.881

1k+ parts

$9.805

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350

$11.957

$10.881

$9.805

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 428 parts In-Stock

1+ parts

$11.359

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428

$11.359

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Vyrian

USA . 7,500 parts In-Stock

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7,500

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Anansix

USA . 1,526 parts In-Stock

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LWI Electronics Inc

India . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Microchip USA

USA . 165 parts In-Stock

1+ parts

$7.810

100+ parts

$7.810

1k+ parts

$7.810

10k+ parts

$7.810

165

$7.810

$7.810

$7.810

$7.810

AZTECH Wire

Italy . 1,035 parts In-Stock

1+ parts

$9.180

100+ parts

-

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1,035

$9.180

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IDEA Electronic Components Group

UK . 966 parts In-Stock

1+ parts

$9.325

100+ parts

-

1k+ parts

$8.393

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966

$9.325

-

$8.393

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Corohmni

South Africa . 420 parts In-Stock

1+ parts

$9.669

100+ parts

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420

$9.669

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Corphita

USA . 4,088 parts In-Stock

1+ parts

$10.761

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4,088

$10.761

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$11.957

100+ parts

$10.881

1k+ parts

$9.805

10k+ parts

-

350

$11.957

$10.881

$9.805

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MKK Technologies

India . 1,828 parts In-Stock

1+ parts

$17.535

100+ parts

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1,828

$17.535

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DigiPath Technology Company

USA . 1,828 parts In-Stock

1+ parts

$17.535

100+ parts

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1,828

$17.535

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Component Stockers USA

USA . 348 parts In-Stock

1+ parts

$99.990

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348

$99.990

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QUARKTWIN TECHNOLOGY LTD

USA . 28,004 parts In-Stock

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28,004

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Perfect Parts

USA . 4,847 parts In-Stock

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4,847

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Assy Fe

Spain . 2,000 parts In-Stock

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2,000

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Northwest PG Solutions

USA . 1,337 parts In-Stock

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1,337

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Parana Technologies

USA . 450 parts In-Stock

1+ parts

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$11.150

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450

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$11.150

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Native Components

USA . 355 parts In-Stock

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355

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Overview

Elevate your designs with the 74VHC273MTR from STMicroelectronics, a premier choice in latches and flip-flops. Renowned for their commitment to quality, STMicroelectronics delivers unmatched reliability and performance. This 8-bit device excels in applications requiring swift data handling, making it ideal for consumer electronics, automotive systems, and industrial control. Experience superior efficiency, robust temperature range, and effortless integration—all while reducing time-to-market and maximizing product longevity!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material offers reliable protection and durability, making it suitable for various environmental conditions.

Propagation Delay At Nominal Supply: 12.5 ns

A low propagation delay enhances performance in high-speed applications, ensuring swift signal processing.

Surface Mount: YES

Surface mount capability allows for efficient use of board space and facilitates automated assembly, reducing manufacturing costs.

Package Shape: RECTANGULAR

The rectangular package shape contributes to space efficiency and layout flexibility on printed circuit boards (PCBs).

No. of Bits: 8

An 8-bit configuration allows for effective data handling and compatibility with a variety of digital applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal supply voltage of 3.3V is ideal for low-power applications, maximizing efficiency and battery life.

Load Capacitance (CL): 50 pF

Low load capacitance helps improve switching speeds and overall circuit performance in high-frequency applications.

Power Supplies (V): 2/5.5

Wide power supply range indicates versatility, allowing the product to be used in diverse applications.

No. of Terminals: 20

With 20 terminals, the device can accommodate more complex functions and connections, enhancing design capabilities.

Package Style (Meter): SMALL OUTLINE

The small outline package style minimizes footprint on PCBs, making it advantageous for compact designs.

Maximum I (ol): 8 Amp

A high maximum output current capability allows the latch or flip-flop to drive large loads, improving efficiency in power applications.

Propagation Delay (tpd): 19.5 ns

The propagation delay of 19.5 ns ensures quick signal transitions while still maintaining reliability, useful for high-speed digital circuits.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature suggests robust performance in extreme conditions, suitable for industrial applications.

Trigger Type: POSITIVE EDGE

Positive edge triggering is widely used in digital electronics, offering reliable and predictable performance for synchronous circuits.

Minimum Operating Temperature: -55 °C

Operation at lower temperatures ensures reliability in harsh environments, making it ideal for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

This terminal finish provides excellent corrosion resistance and ensures good conductivity, essential for dependable connections.

Terminal Position: DUAL

Dual terminal positions facilitate flexible routing options in PCB layout, enhancing design versatility.

Maximum Seated Height: 2.65 mm

A compact seated height aids in minimizing overall PCB height, an advantage in space-constrained applications.

Width: 7.5 mm

A width of 7.5 mm allows for easy integration into various designs while maintaining a compact form factor.

Output Polarity: TRUE

True output polarity indicates straightforward signal processing without complex inversions, simplifying design requirements.

Minimum Supply Voltage (Vsup): 2 V

Low minimum supply voltage helps in battery-operated devices, enhancing overall energy efficiency.

Maximum Time At Peak Reflow Temperature (s): 30

The limit on time at peak reflow temperature indicates compatibility with modern surface mounting processes, ensuring reliable soldering.

Peak Reflow Temperature °C: 260

High reflow temperature capability ensures the product can withstand the demands of high-temperature soldering processes.

Length: 12.8 mm

A controlled length of 12.8 mm optimizes fitting on standard PCB layouts while aiding in effective heat dissipation.

Temperature Grade: MILITARY

Military grade specifications ensure high reliability and performance in demanding environments, suitable for defense applications.

Maximum Frequency At Nominal Supply: 70000000 Hz

A high maximum frequency capability allows for effective use in high-speed digital circuits, enhancing performance in data processing.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, making it an excellent choice for modern digital circuits.

Terminal Form: GULL WING

Gull wing terminals enhance solder joint reliability and facilitate easier inspection and repair, benefiting manufacturing processes.

Packing Method: TR

Tape and reel (TR) packing method supports automated assembly processes, improving production efficiency.

Terminal Pitch: 1.27 mm

A terminal pitch of 1.27 mm allows for compact layouts while providing good access for soldering and probing.

Minimum fmax: 100 MHz

The minimum frequency capability of 100 MHz ensures the component can support high-speed applications while maintaining reliable performance.

Moisture Sensitivity Level (MSL): 3

MSL level 3 indicates reasonable handling requirements, allowing for flexible production and storage options.

Maximum Supply Voltage (Vsup): 5.5 V

The wide supply voltage range from 2V to 5.5V makes it versatile for different power supply settings in various applications.

Technical Specifications

Latches & Flip-Flops 74VHC273MTR attributes and parameters. Explore more Latches & Flip-Flops devices from STMicroelectronics

Specs

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum Frequency At Nominal Supply:

70000000 Hz

Maximum I (ol):

8 Amp

Moisture Sensitivity Level (MSL):

3

No. of Bits:

8

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

12.5 ns

Propagation Delay (tpd):

19.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

FF/Latches

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trigger Type:

POSITIVE EDGE

Width:

7.5 mm

Minimum fmax:

100 MHz

Trade Compliance

74VHC273MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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