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74VHC245TTR

STMicroelectronics

74VHC245TTR by STMicroelectronics

74VHC245TTR by STMicroelectronics is an 8-bit bus driver with a propagation delay of just 8.5 ns, operating b/w 2-5.5 V. It features a compact SOIC package and supports bidirectional data transfer, making it ideal for high-speed communication in digital circuits. With a max temp of 125 °C, it's suitable for military applications.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,669 parts In-Stock

1+ parts

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4,669

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Digiode

USA . 2,629 parts In-Stock

1+ parts

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2,629

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Diverse Electronics

Canada . 2,500 parts In-Stock

1+ parts

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2,500

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Anansix

USA . 2,008 parts In-Stock

1+ parts

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2,008

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 97 parts In-Stock

1+ parts

$0.480

100+ parts

-

1k+ parts

-

10k+ parts

$0.461

97

$0.480

-

-

$0.461

Northwest PG Solutions

USA . 377 parts In-Stock

1+ parts

$0.528

100+ parts

-

1k+ parts

-

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$0.466

377

$0.528

-

-

$0.466

Andel Nordic

Denmark . 420 parts In-Stock

1+ parts

$4.585

100+ parts

-

1k+ parts

$4.402

10k+ parts

$4.402

420

$4.585

-

$4.402

$4.402

Microchip USA

USA . 265 parts In-Stock

1+ parts

$5.719

100+ parts

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265

$5.719

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IDEA Electronic Components Group

UK . 1,076 parts In-Stock

1+ parts

$8.982

100+ parts

-

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$8.084

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1,076

$8.982

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$8.084

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MKK Technologies

India . 1,464 parts In-Stock

1+ parts

$16.890

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1,464

$16.890

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DigiPath Technology Company

USA . 1,464 parts In-Stock

1+ parts

$16.890

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1,464

$16.890

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AZTECH Wire

Italy . 840 parts In-Stock

1+ parts

$17.600

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840

$17.600

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Ampacity Inc.

Singapore . 1,240 parts In-Stock

1+ parts

$38.000

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1,240

$38.000

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Kepictronics

USA . 41,763 parts In-Stock

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41,763

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Perfect Parts

USA . 12,103 parts In-Stock

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Corphita

USA . 2,594 parts In-Stock

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2,594

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Parana Technologies

USA . 751 parts In-Stock

1+ parts

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100+ parts

$10.739

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751

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$10.739

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Overview

Elevate your designs with the 74VHC245TTR from STMicroelectronics, a trusted leader in innovative semiconductor solutions. This high-performance bus driver enhances data transfer efficiency across multiple applications, thanks to its robust architecture and low propagation delay. With superior temperature tolerance and reliable performance, it’s perfect for automotive and industrial uses. Experience unparalleled quality and reliability that empowers your projects to excel.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable construction that offers good mechanical strength and thermal stability.

Propagation Delay At Nominal Supply: 8.5 ns

Fast signal processing, making it suitable for high-speed applications.

Surface Mount: YES

Compatible with modern manufacturing processes, allowing for smaller circuit designs.

Package Shape: RECTANGULAR

Efficient use of PCB space, ideal for compact designs.

No. of Bits: 8

Facilitates the transfer of data across 8 bits simultaneously, maximizing throughput.

Nominal Supply Voltage / Vsup (V): 3.3

Designed for low power consumption applications, supporting energy-efficient designs.

Power Supplies (V): 2/5.5

Wide voltage range offers flexibility in power supply design.

No. of Terminals: 20

Provides sufficient connectivity options for various applications.

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact package style allows for high-density circuit layouts.

Maximum I (ol): 8 Amp

Can handle high output currents, making it suitable for demanding applications.

Propagation Delay (tpd): 13.5 ns

Maintains fast signal integrity for reliable performance in high-speed communications.

Maximum Operating Temperature: 125 °C

Can operate in high-temperature environments, suitable for demanding industrial applications.

Output Characteristics: 3-STATE

Allows for bus sharing among multiple drivers, enhancing design flexibility.

Minimum Operating Temperature: -55 °C

Reliable performance in extreme cold conditions, making it ideal for military and aerospace applications.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides excellent conductivity and corrosion resistance for improved longevity.

Terminal Position: DUAL

Facilitates easy routing on the PCB and enhances overall design efficiency.

No. of Ports: 2

Enables communication across two channels, adding to versatility in design.

Maximum Seated Height: 1.2 mm

Allows for low-profile design requirements, beneficial for space-constrained applications.

Width: 4.4 mm

Compact width suits more intricate circuit designs without sacrificing performance.

Output Polarity: TRUE

Standard output configuration provides compatibility with a variety of interface logic.

Minimum Supply Voltage (Vsup): 2 V

Supports low-voltage applications, helping to minimize power consumption in battery-powered devices.

Maximum Time At Peak Reflow Temperature (s): 40

Designed for robust handling during solder reflow processes, ensuring reliability.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes without damage, enhancing manufacturing yield.

Length: 6.5 mm

Short length is conducive for use in compact applications and small form factors.

Temperature Grade: MILITARY

Meets stringent military specifications for reliability in extreme conditions.

Technology: CMOS

Offers low power dissipation and high noise immunity, making it suitable for diverse applications.

Terminal Form: GULL WING

Facilitates better surface mount assembly and improves solder joint reliability.

Terminal Pitch: 0.65 mm

Allows for fine pitch designs essential for high-density applications.

Count Direction: BIDIRECTIONAL

Supports flexible data transfer in both directions, enhancing application versatility.

Control Type: COMMON CONTROL

Simplifies circuit design by allowing common control signals across multiple devices.

Maximum Supply Voltage (Vsup): 5.5 V

Provides headroom for increased power supply options, suitable for various applications.

Technical Specifications

Bus Driver & Transceivers 74VHC245TTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Additional Features:

WITH DIRECTION CONTROL

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

Family:

AHC/VHC/H/U/V

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

6.5 mm

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

8

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP20,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

13.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

40

Width:

4.4 mm

Trade Compliance

74VHC245TTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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