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74VHC240MTR

STMicroelectronics

74VHC240MTR by STMicroelectronics

74VHC240MTR by STMicroelectronics is a CMOS bus driver with a propagation delay of just 8.5 ns, supporting dual 4-bit functions. It operates b/w 2-5.5 V and features a compact SO package, ideal for high-speed data transmission in military applications.

Median Price

$13.524

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 23 parts In-Stock

1+ parts

$13.524

100+ parts

$12.307

1k+ parts

$11.090

10k+ parts

-

23

$13.524

$12.307

$11.090

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,131 parts In-Stock

1+ parts

$12.848

100+ parts

-

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4,131

$12.848

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Vyrian

USA . 5,228 parts In-Stock

1+ parts

-

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5,228

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Anansix

USA . 1,527 parts In-Stock

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1,527

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 862 parts In-Stock

1+ parts

$1.164

100+ parts

-

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862

$1.164

-

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Northwest PG Solutions

USA . 1,015 parts In-Stock

1+ parts

$1.280

100+ parts

-

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1,015

$1.280

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Andel Nordic

Denmark . 1,626 parts In-Stock

1+ parts

$1.359

100+ parts

-

1k+ parts

$1.304

10k+ parts

$1.304

1,626

$1.359

-

$1.304

$1.304

Corphita

USA . 2,661 parts In-Stock

1+ parts

$12.172

100+ parts

-

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2,661

$12.172

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Advanced Electronics

New Zealand . 23 parts In-Stock

1+ parts

$13.524

100+ parts

$12.307

1k+ parts

$11.090

10k+ parts

-

23

$13.524

$12.307

$11.090

-

Corohmni

South Africa . 32 parts In-Stock

1+ parts

$14.561

100+ parts

-

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32

$14.561

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IDEA Electronic Components Group

UK . 2,165 parts In-Stock

1+ parts

$16.616

100+ parts

-

1k+ parts

$14.955

10k+ parts

-

2,165

$16.616

-

$14.955

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AZTECH Wire

Italy . 627 parts In-Stock

1+ parts

$17.950

100+ parts

-

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627

$17.950

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Aztec Data Supply Inc.

USA . 650 parts In-Stock

1+ parts

$29.341

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650

$29.341

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MKK Technologies

India . 746 parts In-Stock

1+ parts

$31.246

100+ parts

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746

$31.246

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DigiPath Technology Company

USA . 746 parts In-Stock

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$31.246

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746

$31.246

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Microchip USA

USA . 3,258 parts In-Stock

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3,258

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Parana Technologies

USA . 614 parts In-Stock

1+ parts

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100+ parts

$19.867

1k+ parts

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614

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$19.867

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Overview

Unlock exceptional performance with the 74VHC240MTR from STMicroelectronics, a top-tier bus driver and transceiver that seamlessly integrates into your applications. This reliable device ensures swift signal transmission with minimal propagation delay, enhancing system efficiency. Designed for versatility and robust operation in demanding environments, it’s ideal for automotive, industrial, and consumer electronics. Trust in STMicroelectronics' legacy of quality and innovation to elevate your designs with unparalleled value and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The durable plastic/epoxy body ensures long-lasting performance and protection for the internal components.

Propagation Delay At Nominal Supply: 8.5 ns

The low propagation delay allows for faster signal transmission, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology enables compact designs and facilitates automated assembly, reducing production costs.

No. of Functions: 2

Having multiple functions helps in reducing component count, saving space and costs in circuit design.

Package Shape: RECTANGULAR

The rectangular shape aids in efficient layout planning on PCB, optimizing space usage.

No. of Bits: 4

The 4-bit architecture provides flexibility for various data transfer needs, suitable for a range of applications.

Nominal Supply Voltage / Vsup (V): 3.3

Operating at a nominal voltage of 3.3V makes it compatible with modern low-power digital circuits.

Load Capacitance (CL): 50 pF

A load capacitance of 50 pF allows for high-speed data handling with minimal signal distortion.

Power Supplies (V): 2/5.5

Wide power supply range provides flexibility in various environments, accommodating diverse application needs.

No. of Terminals: 20

Twenty terminals provide ample connection options for complex circuit designs, enhancing connectivity.

Package Style (Meter): SMALL OUTLINE

The small outline package allows for space-efficient designs, ideal for compact electronic devices.

Maximum I (ol): 8 Amp

With a high output load current capability of 8 Amps, this product can drive significant loads efficiently.

Propagation Delay (tpd): 12.5 ns

A propagation delay of 12.5 ns ensures rapid data transfer speeds, enhancing overall system performance.

Maximum Operating Temperature: 125 °C

A high maximum operating temperature makes this product suitable for demanding environments and applications.

Output Characteristics: 3-STATE

3-state outputs provide greater control in multi-device communication applications, enhancing versatility.

Minimum Operating Temperature: -55 °C

A low minimum operating temperature allows for reliable operation in extreme cold conditions.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

The premium terminal finish enhances solderability and long-term durability against corrosion.

Terminal Position: DUAL

Dual terminal positioning simplifies routing and enhances layout flexibility on PCBs.

No. of Ports: 2

Two ports increase functionality, allowing for multiple interconnections within a single device.

Maximum Seated Height: 2.65 mm

A low seated height minimizes space requirements on PCBs, contributing to compact design efficiency.

Width: 7.5 mm

A narrow width supports high-density component layouts, ideal for miniaturized electronic applications.

Output Polarity: INVERTED

Inverted output characteristics can be crucial for specific application requirements, adding to design flexibility.

Minimum Supply Voltage (Vsup): 2 V

The ability to operate at a minimum supply voltage of 2V enhances compatibility with lower voltage systems.

Length: 12.8 mm

Compact length makes it adaptable for space-constrained designs, improving product design efficiency.

Temperature Grade: MILITARY

Designed to military specifications, this product promises reliability and performance in harsh environments.

Technology: CMOS

CMOS technology offers excellent power efficiency and high speed, making it suitable for modern applications.

Terminal Form: GULL WING

Gull wing terminal design eases soldering and enhances connectivity, benefiting automated assembly processes.

Packing Method: TR

Tape and reel packing maximizes convenience in handling and assembly, optimizing production workflows.

Terminal Pitch: 1.27 mm

A standard terminal pitch of 1.27 mm ensures compatibility with a wide range of connectors and circuit boards.

Control Type: ENABLE LOW

The low active state for enable control simplifies control circuitry, enhancing design simplicity.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a relatively high maximum supply voltage, allowing integration into various power supply systems.

Technical Specifications

Bus Driver & Transceivers 74VHC240MTR attributes and parameters. Explore more Bus Driver & Transceivers devices from STMicroelectronics

Specs

Control Type:

ENABLE LOW

Family:

AHC/VHC

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e4

Length:

12.8 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

8 Amp

No. of Bits:

4

No. of Functions:

2

No. of Ports:

2

No. of Terminals:

20

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

INVERTED

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP20,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Packing Method:

TR

Power Supplies (V):

2/5.5

Propagation Delay At Nominal Supply:

8.5 ns

Propagation Delay (tpd):

12.5 ns

Qualification:

Not Qualified

Maximum Seated Height:

2.65 mm

Sub-Category:

Bus Driver/Transceivers

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

2 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

7.5 mm

Trade Compliance

74VHC240MTR Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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